Prodotti Intel

5ASXFB3G4F35C5N

Intel

IC FPGA 350 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: FPGA - 350K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

5CSXFC5D6F31C6N

Intel

IC FPGA 288 I/O 896FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 925MHz
• Primary Attributes: FPGA - 85K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 896-BGA
• Supplier Device Package: 896-FBGA (31x31)

pacchetto: 896-BGA

EP20K100EFC196-1

Intel

IC FPGA

• Number of LABs/CLBs: 416
• Number of Logic Elements/Cells: 4160
• Total RAM Bits: 53248
• Number of I/O: -
• Number of Gates: 263000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 196-BGA
• Supplier Device Package: 196-BGA

pacchetto: 196-BGA

EP2A15B724C8

Intel

IC FPGA 492 I/O 724BGA

• Number of LABs/CLBs: 1664
• Number of Logic Elements/Cells: 16640
• Total RAM Bits: 425984
• Number of I/O: 492
• Number of Gates: 1900000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 724-BBGA, FCBGA
• Supplier Device Package: 724-BGA (35x35)

pacchetto: 724-BBGA, FCBGA

EP20K300EBC652-2

Intel

IC FPGA 408 I/O 652BGA

• Number of LABs/CLBs: 1152
• Number of Logic Elements/Cells: 11520
• Total RAM Bits: 147456
• Number of I/O: 408
• Number of Gates: 728000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 652-BBGA
• Supplier Device Package: 652-BGA (45x45)

pacchetto: 652-BBGA

EPF10K100EQC240-3

Intel

IC FPGA 189 I/O 240QFP

• Number of LABs/CLBs: 624
• Number of Logic Elements/Cells: 4992
• Total RAM Bits: 49152
• Number of I/O: 189
• Number of Gates: 257000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 240-BQFP
• Supplier Device Package: 240-PQFP (32x32)

pacchetto: 240-BQFP

5SEEBF45C2L

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 359250
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 65561600
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

pacchetto: 1932-BBGA, FCBGA

5SGSED6N3F45I4N

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 54553600
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

pacchetto: 1932-BBGA, FCBGA

10AX090N2F40E2LG

Intel

IC FPGA 600 I/O 1517FCBGA

• Number of LABs/CLBs: 339620
• Number of Logic Elements/Cells: 900000
• Total RAM Bits: 59234304
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

pacchetto: 1517-BBGA, FCBGA

5SGXMA7H3F35C4N

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

5SGXMA3E1H29C2LN

Intel

IC FPGA 360 I/O 780HBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 23704576
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

pacchetto: 780-BBGA, FCBGA

10AX032E2F29E2LG

Intel

780-PIN FBGA

• Number of LABs/CLBs: 119900
• Number of Logic Elements/Cells: 320000
• Total RAM Bits: 21040128
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

pacchetto: 780-BBGA, FCBGA

EP2SGX60CF780C5

Intel

IC FPGA 364 I/O 780FBGA

• Number of LABs/CLBs: 3022
• Number of Logic Elements/Cells: 60440
• Total RAM Bits: 2544192
• Number of I/O: 364
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA
• Supplier Device Package: 780-FBGA (29x29)

pacchetto: 780-BBGA

5CEFA7U19C6N

Intel

IC FPGA 240 I/O 484UBGA

• Number of LABs/CLBs: 56480
• Number of Logic Elements/Cells: 149500
• Total RAM Bits: 7880704
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

pacchetto: 484-FBGA

EP3C40F324I7

Intel

IC FPGA 195 I/O 324FBGA

• Number of LABs/CLBs: 2475
• Number of Logic Elements/Cells: 39600
• Total RAM Bits: 1161216
• Number of I/O: 195
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-BGA
• Supplier Device Package: 324-FBGA (19x19)

pacchetto: 324-BGA

EP3C10F256C6N

Intel

IC FPGA 182 I/O 256FBGA

• Number of LABs/CLBs: 645
• Number of Logic Elements/Cells: 10320
• Total RAM Bits: 423936
• Number of I/O: 182
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

pacchetto: 256-LBGA

5SGXMB6R1F40I2LG

Intel

IC FPGA 432 I/O 1517FBGA

• Number of LABs/CLBs: 225400
• Number of Logic Elements/Cells: 597000
• Total RAM Bits: 53248000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-FBGA (40x40)
• Supplier Device Package: 1517-FBGA (40x40)

pacchetto: -

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EP4SGX360NF45C3G

Intel

IC FPGA 920 I/O 1932FCBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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AGID023R31B2I2VB

Intel

IC FPGA AGILEX-I 3184BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

pacchetto: -

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5SGXMB6R2F43I3LG

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 225400
• Number of Logic Elements/Cells: 597000
• Total RAM Bits: 53248000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

pacchetto: -

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PDLXP610NE-B1

Intel

PDLXP610NE.B1

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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5SGXMA4H2F35C2WN

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 37888000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: -

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5SGXEA7N1F45C1G

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

pacchetto: -

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PRIXP423ABD

Intel

IC MPU IXP423 533MHZ PBGA492

• Core Processor: Intel® IXP42X
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100Mbps (2)
• SATA: -
• USB: USB 1.1 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: 3DES, AES, DES, MD5, SHA-1
• Package / Case: 492-BBGA
• Supplier Device Package: 492-PBGA (35x35)

pacchetto: -

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AGIB022R29A2I1VB

Intel

IC FPGA AGILEX-I 2957BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2957-BFBGA Exposed Pad
• Supplier Device Package: 2957-BGA (56x45)

pacchetto: -

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PH28F320W30TD70

Intel

IC FLASH 32MBIT CFI 56VFBGA

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH - Boot Block
• Memory Size: 32Mbit
• Memory Interface: CFI
• Clock Frequency: 40 MHz
• Write Cycle Time - Word, Page: -
• Access Time: 70 ns
• Voltage - Supply: 1.7V ~ 1.9V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFBGA
• Supplier Device Package: 56-VFBGA (7.7x9)

pacchetto: -

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AS83C196EA

Intel

16-BIT, MROM, 8096 CPU, 40MHZ

• Core Processor: 83C196EA
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: SSIO
• Peripherals: PWM, WDT
• Number of I/O: 83
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: ROM
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
• Data Converters: A/D 16x10b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 160-QFP
• Supplier Device Package: 160-QFP

pacchetto: -

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5SGXEB6R2F43C2LG

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 225400
• Number of Logic Elements/Cells: 597000
• Total RAM Bits: 53248000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

pacchetto: -

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