Prodotti Intel

10AS016E3F27E1SG

Intel

IC SOC FPGA 240 I/O 672FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 160K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

pacchetto: 672-BBGA, FCBGA

10AS027E2F29E1HG

Intel

IC SOC FPGA 360 I/O 780FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 270K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

pacchetto: 780-BBGA, FCBGA

EP1C12F256C6AA

Intel

IC FPGA FBGA

• Number of LABs/CLBs: 1206
• Number of Logic Elements/Cells: 12060
• Total RAM Bits: 239616
• Number of I/O: 185
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

pacchetto: 256-BGA

EP20K100CQ208C7

Intel

IC FPGA

• Number of LABs/CLBs: 416
• Number of Logic Elements/Cells: 4160
• Total RAM Bits: 53248
• Number of I/O: 159
• Number of Gates: 263000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

10AT115U2F45E2SGE2

Intel

IC FPGA 624 I/O 1932FCBGA

• Number of LABs/CLBs: 427200
• Number of Logic Elements/Cells: 1150000
• Total RAM Bits: 68857856
• Number of I/O: 624
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FCBGA (45x45)

pacchetto: 1932-BBGA, FCBGA

EPF10K50RI240-4N

Intel

IC FPGA 189 I/O 240RQFP

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 20480
• Number of I/O: 189
• Number of Gates: 116000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-RQFP (32x32)

pacchetto: 240-BFQFP Exposed Pad

EPF10K50ETC144-3N

Intel

IC FPGA 102 I/O 144TQFP

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 40960
• Number of I/O: 102
• Number of Gates: 199000
• Voltage - Supply: 2.3 V ~ 2.7 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

EP20K30ETC144-2X

Intel

IC FPGA 92 I/O 144TQFP

• Number of LABs/CLBs: 120
• Number of Logic Elements/Cells: 1200
• Total RAM Bits: 24576
• Number of I/O: 92
• Number of Gates: 113000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

EP20K300EQC240-1X

Intel

IC FPGA 152 I/O 240QFP

• Number of LABs/CLBs: 1152
• Number of Logic Elements/Cells: 11520
• Total RAM Bits: 147456
• Number of I/O: 152
• Number of Gates: 728000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BQFP
• Supplier Device Package: 240-PQFP (32x32)

pacchetto: 240-BQFP

EPF81188AQC208-4

Intel

IC FPGA 148 I/O 208QFP

• Number of LABs/CLBs: 126
• Number of Logic Elements/Cells: 1008
• Total RAM Bits: -
• Number of I/O: 148
• Number of Gates: 12000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP

EP3SL340F1760C3N

Intel

IC FPGA 1120 I/O 1760FBGA

• Number of LABs/CLBs: 13500
• Number of Logic Elements/Cells: 337500
• Total RAM Bits: 18822144
• Number of I/O: 1120
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

pacchetto: 1760-BBGA, FCBGA

5SGSMD8K2F40C2N

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 262400
• Number of Logic Elements/Cells: 695000
• Total RAM Bits: 60968960
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

pacchetto: 1517-BBGA, FCBGA

5SGXMBBR3H43I4N

Intel

IC FPGA 600 I/O 1760HBGA

• Number of LABs/CLBs: 359200
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 65561600
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-HBGA (45x45)

pacchetto: 1760-BBGA, FCBGA

5SEE9F45C2N

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 64210944
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

pacchetto: 1932-BBGA, FCBGA

5SGXEB5R2F40I3N

Intel

IC FPGA 432 I/O 1517FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 48927744
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

pacchetto: 1517-BBGA, FCBGA

10AX027H4F34I3LG

Intel

1152-PIN FBGA

• Number of LABs/CLBs: 101620
• Number of Logic Elements/Cells: 270000
• Total RAM Bits: 17870848
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

5CEBA9U19C7N

Intel

IC FPGA 240 I/O 484UBGA

• Number of LABs/CLBs: 113560
• Number of Logic Elements/Cells: 301000
• Total RAM Bits: 14251008
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

pacchetto: 484-FBGA

10M08DAU324C8G

Intel

IC FPGA 246 I/O 324UBGA

• Number of LABs/CLBs: 500
• Number of Logic Elements/Cells: 8000
• Total RAM Bits: 387072
• Number of I/O: 246
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-LFBGA
• Supplier Device Package: 324-UBGA (15x15)

pacchetto: 324-LFBGA

EPM3128ATC144-10

Intel

IC CPLD 128MC 10NS 144TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 2500
• Number of I/O: 96
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

EPM7256AETC144-10N

Intel

IC CPLD 256MC 10NS 144TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 5000
• Number of I/O: 120
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

EPM570GF100C5N

Intel

IC CPLD 440MC 5.4NS 100FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.4ns
• Voltage Supply - Internal: 1.71 V ~ 1.89 V
• Number of Logic Elements/Blocks: 570
• Number of Macrocells: 440
• Number of Gates: -
• Number of I/O: 76
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 100-LBGA
• Supplier Device Package: 100-FBGA (11x11)

pacchetto: 100-LBGA

DCF1508FA1

Intel

IC MECHANICAL SAMPLE

• Type: Mechanical Sample
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

5SGXMA3K3F40I4WN

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

pacchetto: -

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5SGSMD4E2H29C2WN

Intel

IC FPGA 360 I/O 780HBGA

• Number of LABs/CLBs: 135840
• Number of Logic Elements/Cells: 360000
• Total RAM Bits: 19456000
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

pacchetto: -

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AGIB023R31B2E3V

Intel

IC FPGA AGILEX-I 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

pacchetto: -

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AGFB006R24D2I3V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 573K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

pacchetto: -

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1ST250EU2F50I2LG

Intel

IC FPGA 440 I/O 2397BGA

• Number of LABs/CLBs: 312500
• Number of Logic Elements/Cells: 2500000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

pacchetto: -

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EP4SGX530KH40C2G

Intel

IC FPGA 744 I/O 1517HBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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