Prodotti Intel

KC80526LY400128SL544

Intel

IC MPU MOB CELERON 400MHZ 495BGA

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 100°C (TJ)
• Security Features: -
• Package / Case: 495-BBGA
• Supplier Device Package: 495-BGA (31x27.2)

pacchetto: 495-BBGA

TXN22125D000000

Intel

TXRX OPT SFP 10KM 1310NM SINGLE

• Data Rate: 1.25Gbps
• Wavelength: 1310nm
• Applications: Ethernet
• Voltage - Supply: -
• Connector Type: LC Duplex
• Mounting Type: Pluggable, SFP

pacchetto: -

10AS032E2F27I1SG

Intel

IC SOC FPGA 240 I/O 672FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 320K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

pacchetto: 672-BBGA, FCBGA

5ASXBB3D4F31C6N

Intel

IC FPGA 170 I/O 896FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 700MHz
• Primary Attributes: FPGA - 350K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FBGA (31x31)

pacchetto: 896-BBGA, FCBGA

1SX280LN2F43I2LG

Intel

1760-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

EPC1064PC8

Intel

IC CONFIG DEVICE 65KBIT 8DIP

• Programmable Type: OTP
• Memory Size: 65kb
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

pacchetto: 8-DIP (0.300", 7.62mm)

EPF10K250EGC599-1

Intel

IC FPGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: 599-BPGA
• Supplier Device Package: 599-PGA (62.5x62.5)

pacchetto: 599-BPGA

EP1S60B956C7

Intel

IC FPGA 683 I/O 956BGA

• Number of LABs/CLBs: 5712
• Number of Logic Elements/Cells: 57120
• Total RAM Bits: 5215104
• Number of I/O: 683
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 956-BBGA
• Supplier Device Package: 956-BGA (40x40)

pacchetto: 956-BBGA

EP20K100EFC324-2

Intel

IC FPGA 246 I/O 324FBGA

• Number of LABs/CLBs: 416
• Number of Logic Elements/Cells: 4160
• Total RAM Bits: 53248
• Number of I/O: 246
• Number of Gates: 263000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-BGA
• Supplier Device Package: 324-FBGA (19x19)

pacchetto: 324-BGA

10M02SCU324C8G

Intel

324-PIN UBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: 324-LFBGA
• Supplier Device Package: 324-UBGA (15x15)

pacchetto: 324-LFBGA

EP1C3T144I7N

Intel

IC FPGA 104 I/O 144TQFP

• Number of LABs/CLBs: 291
• Number of Logic Elements/Cells: 2910
• Total RAM Bits: 59904
• Number of I/O: 104
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

5SEE9F45I2LN

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 64210944
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

pacchetto: 1932-BBGA, FCBGA

EP4SGX360HF35C2N

Intel

IC FPGA 564 I/O 1152FBGA

• Number of LABs/CLBs: 14144
• Number of Logic Elements/Cells: 353600
• Total RAM Bits: 23105536
• Number of I/O: 564
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

5SGSED8K3F40I3N

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 262400
• Number of Logic Elements/Cells: 695000
• Total RAM Bits: 60968960
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

pacchetto: 1517-BBGA, FCBGA

5SGXEA7N2F45I3

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59939840
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

pacchetto: 1932-BBGA, FCBGA

10AX032H3F34I2SG

Intel

1152-PIN FBGA

• Number of LABs/CLBs: 119900
• Number of Logic Elements/Cells: 320000
• Total RAM Bits: 21040128
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

5AGXMA3D4F27I3

Intel

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 7362
• Number of Logic Elements/Cells: 156000
• Total RAM Bits: 11746304
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.12 V ~ 1.18 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA, FC (27x27)

pacchetto: 672-BBGA, FCBGA

EP4CGX110CF23I7N

Intel

IC FPGA 270 I/O 484FBGA

• Number of LABs/CLBs: 6839
• Number of Logic Elements/Cells: 109424
• Total RAM Bits: 5621760
• Number of I/O: 270
• Number of Gates: -
• Voltage - Supply: 1.16 V ~ 1.24 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

pacchetto: 484-BGA

EP3C25U256C7

Intel

IC FPGA 156 I/O 256UBGA

• Number of LABs/CLBs: 1539
• Number of Logic Elements/Cells: 24624
• Total RAM Bits: 608256
• Number of I/O: 156
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LFBGA
• Supplier Device Package: 256-UBGA (14x14)

pacchetto: 256-LFBGA

EPM7160EQC100-20MM

Intel

IC CPLD 160MC 20NS 100QFP

• Programmable Type: EE PLD
• Delay Time tpd(1) Max: 20.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 10
• Number of Macrocells: 160
• Number of Gates: 3200
• Number of I/O: 84
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (20x14)

pacchetto: 100-BQFP

1SG210HN1F43E2VG

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 262500
• Number of Logic Elements/Cells: 2100000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

pacchetto: -

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5SGXMA4K2F40C2WN

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 37888000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

pacchetto: -

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N89027

Intel

MODEM, CMOS, PQCC28

• Data Format: -
• Baud Rates: -
• Voltage - Supply: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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AGFB014R24C3E3V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.4M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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5SGXEA7N3F45C2LG

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

pacchetto: -

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AGFA022R25A2I3V

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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EP3SE80F780C3G

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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RK80546KG0801M

Intel

IC MPU 1 3GHZ 604PPGA

• Core Processor: Intel® Xeon® Processor
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 3GHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.25V, 1.4V
• Operating Temperature: 72°C (TC)
• Security Features: -
• Package / Case: 604-PGA
• Supplier Device Package: 604-PPGA

pacchetto: -

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