Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc. |
IC LENS DRIVER 32-LFCSP
|
pacchetto: - |
Azione60.000 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
pacchetto: - |
Azione2.688 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
IC USB2.0 PROTECT 500MA-3A QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione2.912 |
|
- | 4.75 V ~ 5.25 V | -40°C ~ 105°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
Texas Instruments |
IC LI-ION BATT/PWR MGMT 120BGA
|
pacchetto: 120-VFBGA |
Azione14.484 |
|
870µA | 3 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 120-VFBGA | 120-BGA Microstar Junior (6x6) |
||
Microchip Technology |
IC POWER MANAGEMENT
|
pacchetto: - |
Azione12.756 |
|
- | - | -40°C ~ 85°C | - | - | - |
||
Maxim Integrated |
IC PWR SPLY CDMA 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione4.576 |
|
367µA | 2.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 20-TSSOP-EP |
||
Diodes Incorporated |
HEATER CONTROLLER PDIP-8
|
pacchetto: - |
Azione5.312 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER PDIP-8
|
pacchetto: - |
Azione5.728 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
IC PWR MGMT/SMART CARD INT 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.696 |
|
- | 2.7 V ~ 6.5 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Diodes Incorporated |
HEATER CONTROLLER SO-16
|
pacchetto: - |
Azione3.504 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC POWER/BATT MGMT 155DSBGA
|
pacchetto: 155-UFBGA, DSBGA |
Azione3.200 |
|
20µA | 2.5 V ~ 4.8 V | -40°C ~ 85°C | Surface Mount | 155-UFBGA, DSBGA | 155-DSBGA (5.21x5.36) |
||
STMicroelectronics |
IC CTLR DDR2/3 MEM PS VFQFPN-24
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.056 |
|
800µA | 4.5 V ~ 28 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VFQFPN (4x4) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: SOT-23-8 Thin, TSOT-23-8 |
Azione6.592 |
|
220µA | 2.5 V ~ 80 V | 0°C ~ 70°C | Surface Mount | SOT-23-8 Thin, TSOT-23-8 | TSOT-23-8 |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
pacchetto: 56-VFQFN Exposed Pad |
Azione4.512 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC FS86 SYSTEM BASIS CHIP ASIL
|
pacchetto: - |
Request a Quote |
|
- | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
STMicroelectronics |
Linear IC's
|
pacchetto: - |
Request a Quote |
|
40mA | 4V ~ 32V | -40°C ~ 150°C (TJ) | Surface Mount | 48-TFQFN Exposed Pad | 48-VFQFPN (7x7) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 0.8A VCO
|
pacchetto: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
pacchetto: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
Analog Devices Inc./Maxim Integrated |
OVERVOLTAGE-PROTECTION IC
|
pacchetto: - |
Request a Quote |
|
140µA | 1.2V ~ 28V | -40°C ~ 85°C (TA) | Surface Mount | 6-TSSOP, SC-88, SOT-363 | SC-70-6 |
||
Analog Devices Inc./Maxim Integrated |
MAX14739EWT+T
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Renesas Electronics Corporation |
MIXED SIGNAL POWER MANAGEMENT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Texas Instruments |
DUAL BUCK CONVERTER AND 5-VBOOST
|
pacchetto: - |
Azione9.000 |
|
27mA | 2.8V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
Renesas Electronics Corporation |
SSL INTERFACE CONTROLLER FOR ANA
|
pacchetto: - |
Request a Quote |
|
- | 15V ~ 60V | 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
AUTO SBC
|
pacchetto: - |
Request a Quote |
|
30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
POWER MANAGEMENT IC, PRE-PROG, 3
|
pacchetto: - |
Request a Quote |
|
- | - | - | Surface Mount, Wettable Flank | 32-PowerWFQFN | 32-HWQFN (5x5) |
||
Texas Instruments |
POWER MANAGEMENT CIRCUIT, PDSO24
|
pacchetto: - |
Request a Quote |
|
140µA | 3V ~ 3.6V, 3V ~ 5.5V, 7V ~ 13.5V | -40°C ~ 85°C (TA) | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Texas Instruments |
IC POWER MANAGEMENT
|
pacchetto: - |
Azione17.250 |
|
700µA | 4.5V ~ 36V | -40°C ~ 125°C (TJ) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 2.2A VCO
|
pacchetto: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |