Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC CURRENT SENSE SWITCH 16-QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione2.720 |
|
600µA | 5 V ~ 18 V | -40°C ~ 105°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
Texas Instruments |
IC ANLG CTRLR ADJ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione14.976 |
|
500µA | 2.2 V ~ 24 V | -25°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Active-Semi International Inc. |
IC REG BUCK LDO 48TQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione3.792 |
|
600µA | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (6x6) |
||
Linear Technology |
IC CTLR OVP 80V REV OVP SC-70-8
|
pacchetto: 8-VFSOP (0.049", 1.25mm Width) |
Azione7.552 |
|
220µA | 2.5 V ~ 80 V | 0°C ~ 70°C | Surface Mount | 8-VFSOP (0.049", 1.25mm Width) | SC-70-8 |
||
Diodes Incorporated |
HEATER CONTROLLER PDIP-8
|
pacchetto: - |
Azione2.016 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER PDIP-8
|
pacchetto: - |
Azione3.488 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
pacchetto: - |
Azione2.000 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC WIRELESS PWR RCVR 20QFN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione8.052 |
|
1.5A | 4 V ~ 10 V | 0°C ~ 125°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VQFN (3.5x4.5) |
||
Diodes Incorporated |
IC CTRLR BIAS FET U-QFN3030-16
|
pacchetto: 16-UFQFN Exposed Pad |
Azione28.854 |
|
1.1mA | 2.1 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 16-UFQFN Exposed Pad | U-QFN3030-16 |
||
Intersil |
IC REG/CTLR ACPI DUAL DDR 28QFN
|
pacchetto: 28-VQFN Exposed Pad |
Azione7.044 |
|
7mA | - | 0°C ~ 70°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
NXP |
IC POWER MANAGEMENT 56-QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione14.814 |
|
86mA | 2.7 V ~ 5.5 V | -20°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (7x7) |
||
Texas Instruments |
IC REGULATOR DDR-II TERM 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione204.024 |
|
320µA | 2.2 V ~ 5.5 V | 0°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Maxim Integrated |
IC OVERVOLTAGE PROTECTOR 14TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Azione6.576 |
|
- | - | - | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) Exposed Pad | 14-TSSOP |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-16
|
pacchetto: - |
Azione5.376 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC USB REGULATOR SMD
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
POWER MANAGEMENT IC, PRE-PROG, 3
|
pacchetto: - |
Azione954 |
|
10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 40-VFQFN Exposed Pad | 40-HVQFN (6x6) |
||
Analog Devices Inc./Maxim Integrated |
SYSTEM POWER MANAGEMENT
|
pacchetto: - |
Request a Quote |
|
5µA | 2.9V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 30-WFBGA, WLBGA | 30-WLP (3.03x2.52) |
||
Microchip Technology |
PMIC FOR SAMA5DX/SAM9X6 MPUS
|
pacchetto: - |
Request a Quote |
|
120µA | 2.7V ~ 5.5V | -40°C ~ 125°C (TJ) | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
Texas Instruments |
INTEGRATED POWER MANAGEMENT (PMI
|
pacchetto: - |
Azione8.925 |
|
250µA | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (4x4) |
||
Analog Devices Inc./Maxim Integrated |
CDMA CELLULAR/PCS SYSTEM POWER S
|
pacchetto: - |
Request a Quote |
|
367µA | 2.5V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 20-WQFN Exposed Pad | 20-TQFN (5x5) |
||
Analog Devices Inc./Maxim Integrated |
AUTOMOTIVE LOW-VOLTAGE 2-CHANNEL
|
pacchetto: - |
Azione2.340 |
|
1.1mA | 3V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN (5x5) |
||
Analog Devices Inc./Maxim Integrated |
CELLULAR RF POWER-MANAGEMENT
|
pacchetto: - |
Request a Quote |
|
180µA | 2.5V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 12-WQFN Exposed Pad | 12-TQFN (4x4) |
||
Analog Devices Inc./Maxim Integrated |
AUTOMOTIVE HI-SPEED USB 2.0 PROT
|
pacchetto: - |
Request a Quote |
|
650mA | 3V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
Renesas Electronics Corporation |
MP-3ZK
|
pacchetto: - |
Azione14.940 |
|
708µA | 9V ~ 28V | -20°C ~ 85°C (TA) | Surface Mount | TO-252-3, DPAK (2 Leads + Tab), SC-63 | TO-252 (MP-3ZP) |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Renesas Electronics Corporation |
SMART IGBT DRIVER AND CONTROLLER
|
pacchetto: - |
Request a Quote |
|
100µA | 22V | -40°C ~ 150°C (TJ) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Analog Devices Inc./Maxim Integrated |
CELLULAR RF POWER-MANAGEMENT
|
pacchetto: - |
Request a Quote |
|
180µA | 2.5V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 12-WQFN Exposed Pad | 12-TQFN (4x4) |
||
NXP |
IC FS86 SYSTEM BASIS CHIP ASIL
|
pacchetto: - |
Request a Quote |
|
- | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |