Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Active-Semi International Inc. |
IC PMU MULTIFUNCTION
|
pacchetto: - |
Azione72.000 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
pacchetto: - |
Azione4.496 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
pacchetto: 79-UFBGA, DSBGA |
Azione7.728 |
|
- | - | - | Surface Mount | 79-UFBGA, DSBGA | 79-DSBGA (4.06x3.90) |
||
Texas Instruments |
IC PMU CDMA W/CHARGER 49USMDXT
|
pacchetto: 49-WFBGA, DSBGA |
Azione7.776 |
|
- | 3 V ~ 5.5 V | - | Surface Mount | 49-WFBGA, DSBGA | 49-DSBGA |
||
Texas Instruments |
IC PMU FOR ADV APPL PROC 40WQFN
|
pacchetto: 40-WFQFN Exposed Pad |
Azione245.640 |
|
60µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 40-WFQFN Exposed Pad | 40-WQFN (5x5) |
||
Texas Instruments |
IC REGULATOR DDR TERM 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione312.696 |
|
250µA | 2.2 V ~ 5.5 V | 0°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
HEATER CONTROLLER SO-16
|
pacchetto: - |
Azione2.688 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
IC CTLR PWM CPU 1PH VR11 TQFN
|
pacchetto: - |
Azione4.912 |
|
- | - | - | Surface Mount | - | - |
||
Maxim Integrated |
IC SW USB DUAL W/FB 10-UMAX
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione47.016 |
|
50µA | 4 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
||
NXP |
IC RECEIVER 16KB FLASH 32QFN
|
pacchetto: 32-UFQFN Exposed Pad |
Azione3.024 |
|
120mA | 3.5 V ~ 20 V | - | Surface Mount | 32-UFQFN Exposed Pad | 32-QFN (5x5) |
||
Rohm Semiconductor |
MULTI-CHANNEL POWER SUPPLY IC FO
|
pacchetto: 44-VSOP (0.295", 7.50mm Width) Exposed Pad |
Azione5.328 |
|
5mA | 5.5 V ~ 25 V | -40°C ~ 85°C | Surface Mount | 44-VSOP (0.295", 7.50mm Width) Exposed Pad | 44-HTSSOP-A |
||
Linear Technology |
SUPPLY PROTECTION CONTROLLER
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione15.504 |
|
70µA | 2.5 V ~ 60 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.232 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Texas Instruments |
O917A130TRGZTQ1
|
pacchetto: - |
Azione6.672 |
|
- | - | - | - | - | - |
||
Infineon Technologies |
IC CONTROLLER 56QFN
|
pacchetto: - |
Azione5.040 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS RECEIVER
|
pacchetto: - |
Azione4.816 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-8
|
pacchetto: - |
Azione4.944 |
|
- | 3.5 V ~ 5.5 V | -20°C ~ 85°C (TA) | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-8
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.592 |
|
- | 3.5 V ~ 5.5 V | -20°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
pacchetto: - |
Azione7.936 |
|
- | - | - | - | - | - |
||
Renesas Electronics Corporation |
STANDARD VARIANT FOR A TI SITTAR
|
pacchetto: - |
Request a Quote |
|
11mA | 2.8V ~ 5.5V | -40°C ~ 150°C (TJ) | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Renesas Electronics Corporation |
IC WIRELESS RECEIVER 52WLCSP
|
pacchetto: - |
Request a Quote |
|
3mA | 4.5V ~ 5.5V | 0°C ~ 85°C (TA) | Surface Mount | 52-UFBGA, WLCSP | 52-WLCSP (2.64x3.94) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 2.2A VCO
|
pacchetto: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
onsemi |
ANA PMU PWR MGT UNIT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
SAFETY SYSTEM BASIS CHIP WITH LO
|
pacchetto: - |
Request a Quote |
|
- | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
Sharp Microelectronics |
IC POWER SUPPLY CCD IC LSI
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
25MA-500MA AUTO HI-SPEED USB PRO
|
pacchetto: - |
Request a Quote |
|
150mA | 3V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 12-WFQFN Exposed Pad | 12-TQFN (3x3) |
||
Analog Devices Inc./Maxim Integrated |
POWER MANAGEMENT CIRCUIT, BICMOS
|
pacchetto: - |
Request a Quote |
|
225µA | 2.3V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN-EP (2x2) |
||
NXP |
IC PMIC HVQFN24
|
pacchetto: - |
Azione4.200 |
|
5.5µA | 3.3V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | 24-HVQFN (3x3) |