Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC DRAM 576MBIT 300MHZ 144BGA
|
pacchetto: 144-TFBGA |
Azione7.504 |
|
DRAM | DRAM | 576Mb (64M x 9) | Parallel | 300MHz | - | 20ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | 144-FCBGA (11x18.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 143MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione2.128 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 667MHZ 96FBGA
|
pacchetto: 96-TFBGA |
Azione4.304 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 667MHz | - | 13.5ns | 1.425 V ~ 1.575 V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (9x14) |
||
ON Semiconductor |
IC SRAM 4MBIT 70NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione2.320 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 70ns | 70ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 167MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione80.508 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 167MHz | - | 3.4ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Cypress Semiconductor Corp |
IC SRAM 16MBIT 10NS 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione29.016 |
|
SRAM | SRAM - Asynchronous | 16Mb (1M x 16) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 512KBIT 1MHZ 8LAP
|
pacchetto: 8-TDFN |
Azione272.520 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 10ms | 550ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TDFN | 8-LAP (5x8) |
||
Macronix |
IC FLASH 1GBIT 120NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione5.936 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | Parallel | - | 120ns | 120ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Renesas Electronics America |
IC SRAM 4MBIT 70NS 32SOP
|
pacchetto: 32-SOIC (0.450", 11.40mm Width) |
Azione4.432 |
|
SRAM | SRAM | 4Mb (512K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.450", 11.40mm Width) | 32-SOP |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 333MHZ 84BGA
|
pacchetto: 84-TFBGA |
Azione6.160 |
|
DRAM | SDRAM - DDR2 | 256Mb (16M x 16) | Parallel | 333MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 84-TFBGA | 84-TWBGA (8x12.5) |
||
Microchip Technology |
IC EEPROM 4KBIT 4MHZ 8MINIMAP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione4.992 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-Mini Map (2x3) |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.736 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.096 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione3.312 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 100kHz | 1.5ms | 3500ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 100KHZ SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione6.112 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | Single Wire | 100kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Cypress Semiconductor Corp |
IC NVSRAM 64KBIT 40MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.968 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | SPI | 40MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
STMicroelectronics |
IC EEPROM 8KBIT 400KHZ 4WLCSP
|
pacchetto: 4-XFBGA, WLCSP |
Azione21.258 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-XFBGA, WLCSP | 4-WLCSP |
||
Cypress Semiconductor Corp |
IC FLASH 128M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione3.152 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | Parallel | - | 110ns | 110ns | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Micron Technology Inc. |
SPECIAL/CUSTOM LPDDR4
|
pacchetto: - |
Azione7.712 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 WFBGA
|
pacchetto: - |
Azione3.344 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
16Mb, Low Power/Power Saver,Asyn
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 16Mbit | Parallel | - | 55ns | 55 ns | 1.65V ~ 2.2V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
||
Infineon Technologies |
IC FRAM 4MBIT SPI/QUAD 8GQFN
|
pacchetto: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 4Mbit | SPI - Quad I/O | 108 MHz | - | - | 1.8V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-UQFN | 8-GQFN (3.23x3.28) |
||
Micron Technology Inc. |
TLC 4T 512GX8 FBGA 8DP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR4 32G 1GX32 FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
Automotive (Tc: -40 to +95C), 4G
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | Surface Mount | 200-VFBGA | 200-VFBGA (10x14.5) |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT PARALLEL 32SOJ
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 1Mbit | Parallel | - | 12ns | 12 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 32-BSOJ (0.300", 7.62mm Width) | 32-SOJ |
||
Renesas Electronics Corporation |
IC SRAM 16KBIT PARALLEL 24CDIP
|
pacchetto: - |
Azione900 |
|
SRAM | SRAM - Synchronous | 16Kbit | Parallel | - | 90ns | 90 ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TA) | Through Hole | 24-CDIP (0.600", 15.24mm) | 24-CDIP |
||
Micron Technology Inc. |
LPDDR5 128G 2GX64 FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |