Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AKM Semiconductor Inc. |
IC EEPROM 2KBIT 400KHZ 8TSSOP
|
pacchetto: - |
Azione2.704 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 10ms | 4.5µs | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | - | 8-TSSOP |
||
Micron Technology Inc. |
IC FLASH 64MBIT 75MHZ 24TBGA
|
pacchetto: 24-TBGA |
Azione5.360 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI | 75MHz | 15ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |
||
Micron Technology Inc. |
IC FLASH 32GBIT 153WFBGA
|
pacchetto: 153-WFBGA |
Azione5.104 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | Surface Mount | 153-WFBGA | 153-WFBGA (11.5x13) |
||
Micron Technology Inc. |
IC SDRAM 2GBIT 200MHZ 168WFBGA
|
pacchetto: 168-WFBGA |
Azione5.536 |
|
DRAM | SDRAM - Mobile LPDDR | 2Gb (64M x 32) | Parallel | 200MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
||
Micron Technology Inc. |
IC FLASH 512MBIT 100NS 64EASYBGA
|
pacchetto: 64-LBGA |
Azione5.904 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | 52MHz | 100ns | 100ns | 1.7 V ~ 2 V | -40°C ~ 85°C (TC) | Surface Mount | 64-LBGA | 64-EasyBGA (8x10) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 1MBIT 10NS 32TSOP
|
pacchetto: 32-SOIC (0.400", 10.16mm Width) |
Azione17.400 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-SOIC (0.400", 10.16mm Width) | 32-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 128MBIT 166MHZ 86TSOP
|
pacchetto: 86-TFSOP (0.400", 10.16mm Width) |
Azione7.776 |
|
DRAM | SDRAM | 128Mb (4M x 32) | Parallel | 166MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 86-TFSOP (0.400", 10.16mm Width) | 86-TSOP II |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione107.760 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
STMicroelectronics |
IC FLASH 64MBIT 110NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione4.576 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8, 4M x 16) | Parallel | - | - | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.848 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 120ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Micron Technology Inc. |
IC SDRAM 24GBIT 1.8GHZ FBGA
|
pacchetto: - |
Azione4.240 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (384M x 64) | - | 1866MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM 16MBIT 10NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione4.848 |
|
SRAM | SRAM - Asynchronous | 16Mb (1M x 16) | Parallel | - | 10ns | 10ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 20NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione4.144 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Micron Technology Inc. |
IC FLASH 1GBIT 100NS 64FBGA
|
pacchetto: 64-LBGA |
Azione5.568 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8, 64M x 16) | Parallel | - | 100ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (11x13) |
||
Alliance Memory, Inc. |
IC SRAM 256KBIT 55NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione3.456 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 55ns | 55ns | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-sTSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.016 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC FRAM 4MBIT 55NS 48FBGA
|
pacchetto: 48-TFBGA |
Azione31.428 |
|
FRAM | FRAM (Ferroelectric RAM) | 4Mb (256K x 16) | Parallel | - | 110ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-FBGA (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 128M PARALLEL 143MHZ
|
pacchetto: 54-TFBGA |
Azione2.688 |
|
DRAM | SDRAM | 128Mb (8M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Cypress Semiconductor Corp |
IC SRAM ASYNC 28TSOP I
|
pacchetto: - |
Azione7.312 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
2G 1.5V DDR3 128MX16 1600MT 96 B
|
pacchetto: 96-TFBGA |
Azione7.416 |
|
DRAM | SDRAM - DDR3L | 2Gb (128M x 16) | Parallel | 800MHz | 15ns | 20ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
ISSI, Integrated Silicon Solution Inc |
16GB, 153 BALL FBGA, 3.3V, ROHS
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (MLC) | 128Gbit | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | 153-VFBGA (11.5x13) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 2GBIT PARALLEL 96TWBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3 | 2Gbit | Parallel | 800 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Insignis Technology Corporation |
SDR 128MB X32 BGA 8X13(X1.2) PC1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 128Mbit | LVTTL | 166 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-FBGA (8x13) |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 1Gbit | SPI - Quad I/O, DTR | 133 MHz | 600µs | 7 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
Automotive (Tc: -40 to +105C), 2
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 32MBIT SPI/QUAD 8SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 32Mbit | SPI - Quad I/O | 133 MHz | 70µs, 2.4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 128MBIT PAR 90TFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 128Mbit | LVTTL | 143 MHz | - | 5.4 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
GigaDevice Semiconductor (HK) Limited |
32MBIT, 1.8V, WSON8 6*5MM, INDUS
|
pacchetto: - |
Azione17.880 |
|
FLASH | FLASH - NOR (SLC) | 32Mbit | SPI - Quad I/O, QPI | 133 MHz | 60µs, 2.4ms | 6 ns | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |