Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
LPDDR3 384MX32 PLASTIC WFBGA 1.2
|
pacchetto: - |
Azione2.480 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 64GBIT 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione13.236 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione4.608 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC OTP 2MBIT 90NS 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione6.304 |
|
EPROM | EPROM - OTP | 2Mb (128K x 16) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 167MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione4.224 |
|
DRAM | SDRAM | 256Mb (32M x 8) | Parallel | 167MHz | 12ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.928 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 1MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.272 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 20NS 128TQFP
|
pacchetto: 128-LQFP |
Azione5.376 |
|
SRAM | SRAM - Quad Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 143MHZ 54BGA
|
pacchetto: 54-TFBGA |
Azione5.184 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Alliance Memory, Inc. |
IC SDRAM 512MBIT 200MHZ 60BGA
|
pacchetto: 60-TFBGA |
Azione3.264 |
|
DRAM | SDRAM - DDR | 512Mb (64M x 8) | Parallel | 200MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-FBGA (13x8) |
||
Micron Technology Inc. |
IC FLASH 256MBIT 108MHZ 24TBGA
|
pacchetto: 24-TBGA |
Azione2.192 |
|
FLASH | FLASH - NOR | 256Mb (64M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |
||
Winbond Electronics |
IC FLASH 64MBIT 104MHZ 16WLCSP
|
pacchetto: 16-UFBGA, WLCSP |
Azione3.104 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI | 104MHz | 5ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 16-UFBGA, WLCSP | 16-WLCSP (2.47x3.12) |
||
Alliance Memory, Inc. |
IC SDRAM 64MBIT 166MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione7.056 |
|
DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 166MHz | 2ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 1GBIT 800MHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione10.908 |
|
DRAM | SDRAM - DDR3L | 1Gb (64M x 16) | Parallel | 800MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 1MBIT 12NS 32SOJ
|
pacchetto: 32-BSOJ (0.400", 10.16mm Width) |
Azione14.004 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-BSOJ (0.400", 10.16mm Width) | 32-SOJ |
||
Macronix |
IC FLASH 4MBIT 86MHZ 8USON
|
pacchetto: 8-UFDFN Exposed Pad |
Azione185.772 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | SPI | 86MHz | 50µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (2x3) |
||
Cypress Semiconductor Corp |
IC FLASH 256M SPI 133MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione5.760 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-BGA (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 256M PARALLEL 144LFBGA
|
pacchetto: 144-LFBGA |
Azione4.288 |
|
DRAM | SDRAM - DDR | 256Mb (8M x 32) | Parallel | 200MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 144-LFBGA | 144-LFBGA (12x12) |
||
Micron Technology Inc. |
LPDDR4 8G DIE 512MX16
|
pacchetto: - |
Azione6.480 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
MLC EMMC/LPDDR3 152G
|
pacchetto: - |
Azione2.016 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
QLC 2T 256GX8 VBGA DDP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Fairchild Semiconductor |
IC EEPROM 1KBIT MICROWIRE 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 1Kbit | Microwire | 250 kHz | 15ms | - | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Intel |
FLASH, 4MX16, 85NS, PBGA64
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC DRAM 64MBIT HYPERBUS 200MHZ
|
pacchetto: - |
Request a Quote |
|
DRAM | HyperRAM | 64Mbit | HyperBus | 200 MHz | - | - | 1.7V ~ 2V | -40°C ~ 85°C (TC) | - | - | - |
||
Infineon Technologies |
256MB SEMPER NANO FLASH
|
pacchetto: - |
Azione14.958 |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O, QPI | 80 MHz | 2.3ms | 6 ns | 1.7V ~ 2V | 0°C ~ 70°C (TA) | Surface Mount | 33-XFBGA, WLCSP | 33-WLCSP (3.36x3.97) |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT PAR 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, SDR | 18Mbit | Parallel | 100 MHz | - | 8.5 ns | 2.375V ~ 2.625V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 1GBIT PAR 78TWBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 1Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-TWBGA (8x10.5) |
||
ABLIC Inc. |
IC EEPROM 16KBIT SPI 2MHZ 8SOPJ
|
pacchetto: - |
Azione11.415 |
|
EEPROM | EEPROM | 16Kbit | Microwire | 2 MHz | 4ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP-J |