Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC MEM FLASH NOR
|
pacchetto: - |
Azione4.096 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC RLDRAM 576MBIT 400MHZ 144UBGA
|
pacchetto: 144-TFBGA |
Azione6.048 |
|
DRAM | DRAM | 576Mb (32M x 18) | Parallel | 400MHz | - | 20ns | 1.7 V ~ 1.9 V | 0°C ~ 95°C (TC) | Surface Mount | 144-TFBGA | 144-µBGA (18.5x11) |
||
Micron Technology Inc. |
IC FLASH 128MBIT 108MHZ 8VPDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.904 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 108MHz | 8ms, 5ms | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFPN (MLP8) (8x6) |
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Maxim Integrated |
IC NVSRAM 16MBIT 150NS 36EDIP
|
pacchetto: 36-DIP Module (0.600", 15.24mm) |
Azione3.520 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 16Mb (2M x 8) | Parallel | - | 150ns | 150ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Through Hole | 36-DIP Module (0.600", 15.24mm) | 36-EDIP |
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Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 45NS 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione5.568 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 45ns | 45ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.712 |
|
FLASH | FLASH | 16Mb (2M x 8, 1M x 16) | Parallel | - | 200µs | 70ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Maxim Integrated |
IC OTP 1KBIT 1WIRE 6TSOC
|
pacchetto: 6-LSOJ (0.148", 3.76mm Width) |
Azione6.656 |
|
EPROM | EPROM - OTP | 1Kb (1K x 1) | 1-Wire? | - | - | 15µs | - | -40°C ~ 85°C (TA) | Surface Mount | 6-LSOJ (0.148", 3.76mm Width) | 6-TSOC |
||
Microchip Technology |
IC OTP 256KBIT 45NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione4.864 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.896 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 10ms | 900ns | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 36KBIT 20NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione5.488 |
|
SRAM | SRAM - Dual Port, Synchronous | 36Kb (4K x 9) | Parallel | - | - | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 25NS 48DIP
|
pacchetto: 48-DIP (0.600", 15.24mm) |
Azione2.160 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 48-DIP (0.600", 15.24mm) | 48-PDIP |
||
Alliance Memory, Inc. |
IC SDRAM 256MBIT 200MHZ 60BGA
|
pacchetto: 60-TFBGA |
Azione7.984 |
|
DRAM | SDRAM - DDR | 256Mb (16M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (13x8) |
||
Cypress Semiconductor Corp |
IC MEMORY F-RAM SER 8SOIC
|
pacchetto: - |
Azione6.704 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT 55NS 32SOIC
|
pacchetto: 32-SOIC (0.445", 11.30mm Width) |
Azione9.756 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.445", 11.30mm Width) | 32-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione17.814 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 1.5 V ~ 3.6 V | -20°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Winbond Electronics |
IC SDRAM 1GBIT 400MHZ 84BGA
|
pacchetto: 84-TFBGA |
Azione15.984 |
|
DRAM | SDRAM - DDR2 | 1Gb (64M x 16) | Parallel | 200MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | -40°C ~ 95°C (TC) | Surface Mount | 84-TFBGA | 84-WBGA (8x12.5) |
||
Rohm Semiconductor |
IC EEPROM 1KBIT 400KHZ 8SSOPB
|
pacchetto: 8-LSSOP (0.173", 4.40mm Width) |
Azione13.488 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-LSSOP (0.173", 4.40mm Width) | 8-SSOPB |
||
Micron Technology Inc. |
IC DRAM 12G 1866MHZ
|
pacchetto: - |
Azione7.040 |
|
DRAM | SDRAM - Mobile LPDDR4 | 12Gb (384M x 32) | - | 1866MHz | - | - | 1.1V | -40°C ~ 95°C (TC) | - | - | - |
||
ON Semiconductor |
IC EEPROM 256 SPI 1MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.712 |
|
EEPROM | EEPROM | 256b (16 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Macronix |
IC FLASH 8MBIT
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione2.464 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 133MHz | 300µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
Micron Technology Inc. |
IC SDRAM DDR2 512M 84FBGA
|
pacchetto: 84-TFBGA |
Azione5.424 |
|
DRAM | SDRAM - DDR2 | 512M (32M x 16) | Parallel | 400MHz | 15ns | 400ps | 1.7V ~ 1.9V | 0°C ~ 85°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (8x12.5) |
||
ABLIC Inc. |
IC EEPROM 4KBIT I2C 1MHZ 8DFN
|
pacchetto: - |
Azione59.064 |
|
EEPROM | EEPROM | 4Kbit | I2C | 1 MHz | 5ms | - | 1.7V ~ 3.6V | -20°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-DFN (2x3) |
||
Micron Technology Inc. |
LPDDR5 128G 4GX32 FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | Parallel | 4.266 GHz | - | - | - | -40°C ~ 95°C | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 128MBIT PAR 54TSOP II
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 128Mbit | LVTTL | 166 MHz | - | 5.4 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Fujitsu Semiconductor Memory Solution |
IC FRAM 64KBIT I2C 3.4MHZ 8SOP
|
pacchetto: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 64Kbit | I2C | 3.4 MHz | - | 130 ns | 1.8V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Cypress Semiconductor Corp |
IC SRAM 256KBIT PAR 28TSOP I
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 256Kbit | Parallel | - | 70ns | 70 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP I |
||
ISSI, Integrated Silicon Solution Inc |
2G, 1.2/1.8V, LPDDR2, 128Mx16, 4
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4 | 2Gbit | HSUL_12 | 400 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 134-TFBGA | 134-TFBGA (10x11.5) |
||
Renesas Electronics Corporation |
IC SRAM 1MBIT LVTTL 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 1Mbit | LVTTL | - | 15ns | 15 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |