Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics America |
IC EEPROM 4KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.184 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
STMicroelectronics |
IC EEPROM 4KBIT 1MHZ 8UFDFPN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione6.300 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UFDFPN (2x3) |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT 10NS 36SOJ
|
pacchetto: 36-BSOJ (0.400", 10.16mm Width) |
Azione4.848 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 36-BSOJ (0.400", 10.16mm Width) | 36-SOJ |
||
Maxim Integrated |
IC OTP 1KBIT 1WIRE TO92-3
|
pacchetto: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Azione5.232 |
|
EPROM | EPROM - OTP | 1Kb (1K x 1) | 1-Wire? | - | - | 15µs | - | -40°C ~ 85°C (TA) | Through Hole | TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) | TO-92-3 |
||
Microchip Technology |
IC FLASH 1MBIT 200NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.200 |
|
FLASH | FLASH | 1Mb (64K x 16) | Parallel | - | 20ms | 200ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 15NS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione3.472 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (8K x 16) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 133MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione3.936 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 133MHz | - | 4.2ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 128MBIT 250MHZ 144BGA
|
pacchetto: 144-LFBGA |
Azione7.952 |
|
DRAM | SDRAM - DDR | 128Mb (4M x 32) | Parallel | 250MHz | 16ns | 700ps | 2.4 V ~ 2.6 V | 0°C ~ 70°C (TA) | Surface Mount | 144-LFBGA | 144-LFBGA (12x12) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 1GBIT 667MHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione4.560 |
|
DRAM | SDRAM - DDR3 | 1Gb (64M x 16) | Parallel | 667MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 1GBIT 667MHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione5.712 |
|
DRAM | SDRAM - DDR3 | 1Gb (64M x 16) | Parallel | 667MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione4.160 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O, QPI | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 128MBIT 133MHZ 24TBGA
|
pacchetto: 24-TBGA |
Azione5.984 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 1.7 V ~ 2 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TBGA (6x8) |
||
Micron Technology Inc. |
IC FLASH 64MBIT 108MHZ 16SO
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.936 |
|
FLASH | FLASH - NOR | 64Mb (16M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SO W |
||
Rohm Semiconductor |
IC EEPROM 8KBIT 400KHZ 8VSON
|
pacchetto: 8-UFDFN Exposed Pad |
Azione5.088 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 400kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | VSON008X2030 |
||
ON Semiconductor |
IC SRAM 256KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione20.718 |
|
SRAM | SRAM | 256Kb (32K x 8) | SPI | 20MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Fremont Micro Devices USA |
IC EEPROM 256KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione28.854 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Winbond Electronics |
IC DRAM 2G PARALLEL 800MHZ
|
pacchetto: 96-VFBGA |
Azione7.200 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 800MHz | - | 20ns | 1.425 V ~ 1.575 V | -40°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (13x7.5) |
||
Cypress Semiconductor Corp |
IC 128 MB FLASH MEMORY
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.208 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O, QPI | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
IC FLASH 256M SPI 133MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione4.816 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Micron Technology Inc. |
SLC 2G DIE 2GX1
|
pacchetto: - |
Azione6.464 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR4 48G 768MX64 FBGA WT QDP
|
pacchetto: - |
Azione5.056 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC SDRAM 2G DDR3 78WBGA
|
pacchetto: 78-VFBGA |
Azione3.920 |
|
DRAM | SDRAM - DDR3 | 2Gb (256M x 8) | Parallel | 667MHz | 15ns | 20ns | 1.425V ~ 1.575V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
||
Texas Instruments |
32X8 BI-POLAR PROM 16-CDIP -55 T
|
pacchetto: - |
Request a Quote |
|
PROM | - | 256bit | Parallel | - | - | 50 ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TA) | Through Hole | 16-CDIP (0.300", 7.62mm) | 16-CDIP |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 32MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Azione1.005 |
|
FLASH | FLASH - NOR | 32Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 1.6ms | 6 ns | 1.65V ~ 1.95V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Winbond Electronics |
IC FLASH 8MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 8Mbit | SPI - Quad I/O | 80 MHz | 30µs, 3ms | 6 ns | 2.3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
onsemi |
IC EEPROM 2KBIT SPI 10MHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 2Kbit | SPI | 10 MHz | 5ms | 40 ns | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 128MBIT SPI/QUAD 16SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 128Mbit | SPI - Quad I/O | 133 MHz | 70µs, 2.4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP |
||
Winbond Electronics |
SPIFLASH, 1M-BIT, 4KB UNIFORM SE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |