Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC NVSRAM 4MBIT 25NS 48FBGA
|
pacchetto: 48-TFBGA |
Azione2.944 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mb (512K x 8) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-FBGA (6x10) |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 333MHZ 60FBGA
|
pacchetto: 60-FBGA |
Azione6.640 |
|
DRAM | SDRAM - DDR2 | 512Mb (128M x 4) | Parallel | 333MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 60-FBGA | 60-FBGA |
||
Micron Technology Inc. |
IC FLASH 32MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione53.340 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.152 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 10ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 12NS 128TQFP
|
pacchetto: 128-LQFP |
Azione6.560 |
|
SRAM | SRAM - Dual Port, Synchronous | 1Mb (64K x 16) | Parallel | - | - | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 15NS 80TQFP
|
pacchetto: 80-LQFP |
Azione3.808 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (32K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 72KBIT 20NS 80TQFP
|
pacchetto: 80-LQFP |
Azione7.952 |
|
SRAM | SRAM - Dual Port, Asynchronous | 72Kb (8K x 9) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Micron Technology Inc. |
IC RLDRAM 288MBIT 400MHZ 144FBGA
|
pacchetto: 144-TFBGA |
Azione7.296 |
|
DRAM | DRAM | 288Mb (32M x 9) | Parallel | 400MHz | - | 20ns | 1.7 V ~ 1.9 V | 0°C ~ 95°C (TC) | Surface Mount | 144-TFBGA | 144-FBGA (18.5x11) |
||
Cypress Semiconductor Corp |
MICROPOWER SRAMS
|
pacchetto: - |
Azione6.784 |
|
SRAM | SRAM - Asynchronous | 8Mb (1M x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC FLASH 2MBIT 33MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione54.228 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 33MHz | 20µs | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Winbond Electronics |
IC FLASH 16MBIT 133MHZ 8USON
|
pacchetto: 8-UDFN Exposed Pad |
Azione2.896 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 133MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-USON (4x3) |
||
Adesto Technologies |
IC FLASH 512KBIT 85MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione6.080 |
|
FLASH | FLASH | 512Kb (64K x 8) | SPI | 104MHz | 8µs, 3.5ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16KBIT 100KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.192 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 100KHZ SOT23-3
|
pacchetto: TO-236-3, SC-59, SOT-23-3 |
Azione7.104 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
||
Fremont Micro Devices USA |
IC EEPROM 8KBIT 1MHZ 8DFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione5.792 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-DFN (2x3) |
||
Macronix |
IC FLASH 4MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione51.660 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 2K SPI 10MHZ WAFER
|
pacchetto: Die |
Azione7.264 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1M PARALLEL 128TQFP
|
pacchetto: 128-LQFP |
Azione6.784 |
|
SRAM | SRAM - Dual Port, Synchronous | 1Mb (64K x 16) | Parallel | - | - | 7.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
Macronix |
IC FLASH 4GBIT
|
pacchetto: - |
Azione6.704 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 1G SPI 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione3.104 |
|
FLASH | FLASH - NAND (SLC) | 1Gb (128M x 8) | SPI | 104MHz | - | 8ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Winbond Electronics |
IC FLASH MEMORY 64MB
|
pacchetto: - |
Azione5.216 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256K PARALLEL 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione6.272 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (16K x 16) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) |
||
Micron Technology Inc. |
IC FLASH NAND 4G SLC
|
pacchetto: - |
Azione4.224 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Rohm Semiconductor |
MEMORY EEPROM
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione7.424 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 4ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Atmel |
FLASH NOR 8MB BGA Bottom Boot
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 8Mbit | Parallel | - | - | 100 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TC) | Surface Mount | 48-LFBGA, CSPBGA | 48-CBGA (7x7) |
||
Micron Technology Inc. |
QLC 4T 512GX8 VBGA QDP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC FLASH 1GBIT SPI/QUAD 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 1Gbit | SPI - Quad I/O, QPI | 133 MHz | 3ms | 7 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (8x6) |
||
Alliance Memory, Inc. |
DRAM DDR3L, 8G, 512M X 16, 1.35V
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 8Gbit | Parallel | 800 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (9x13) |