Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC FLASH 32MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione2.528 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI | 104MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
STMicroelectronics |
IC OTP 2MBIT 100NS 44PLCC
|
pacchetto: 44-LCC |
Azione7.696 |
|
EPROM | EPROM - OTP | 2Mb (128K x 16) | Parallel | - | - | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-LCC | 44-PLCC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 166MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione5.328 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Micron Technology Inc. |
IC FLASH 128MBIT 75NS 64EASYBGA
|
pacchetto: 64-TBGA |
Azione7.360 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 75ns | 75ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TBGA | 64-EasyBGA (10x13) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 200MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione4.992 |
|
SRAM | SRAM - Synchronous, QDR II | 72Mb (8M x 9) | Parallel | 200MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 167MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione3.920 |
|
DRAM | SDRAM - DDR | 256Mb (16M x 16) | Parallel | 167MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 250NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.792 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20ms | 250ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 4MBIT 55NS 40VSOP
|
pacchetto: 40-TFSOP (0.488", 12.40mm Width) |
Azione6.528 |
|
EPROM | EPROM - OTP | 4Mb (256K x 16) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 40-TFSOP (0.488", 12.40mm Width) | 40-VSOP |
||
Micron Technology Inc. |
IC SDRAM 24GBIT 1.6GHZ FBGA
|
pacchetto: - |
Azione7.760 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (384M x 64) | - | 1600MHz | - | - | 1.1V | - | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM 9MBIT 133MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione3.728 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 133MHz | - | 6.5ns | 3.135 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 8NS 100TQFP
|
pacchetto: 100-LQFP |
Azione6.096 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 100MHz | - | 8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Cypress Semiconductor Corp |
NON VOLATILE SRAMS
|
pacchetto: - |
Azione4.960 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | SPI | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC SDRAM 64MBIT 143MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione17.352 |
|
DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 133MHz | 14ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 1KBIT 4MHZ M2P
|
pacchetto: M2 J, Smart Card Module (ISO) |
Azione6.096 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (ISO) | M2 - P Module (ISO) |
||
Adesto Technologies |
IC EEPROM 8-TSSOP 1.65V I2C 128B
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.728 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 100µs, 2.5ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.096 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
ON Semiconductor |
IC EEPROM 256KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione30.672 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 500ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Alliance Memory, Inc. |
IC SDRAM 2GBIT 800MHZ 78BGA
|
pacchetto: 78-VFBGA |
Azione6.432 |
|
DRAM | SDRAM - DDR3 | 2Gb (256M x 8) | Parallel | 800MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | -40°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-FBGA (10.5x8) |
||
Winbond Electronics |
IC SDRAM 1GBIT 667MHZ 96BGA
|
pacchetto: - |
Azione7.120 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 256G MMC
|
pacchetto: - |
Azione2.160 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | - | -40°C ~ 105°C (TA) | - | - | - |
||
Micron Technology Inc. |
SPECIAL/CUSTOM LPDDR4
|
pacchetto: - |
Azione3.792 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 1G SPI SOIC
|
pacchetto: - |
Azione6.032 |
|
FLASH | FLASH - NAND | 1Gb (1G x 1) | SPI | - | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |
||
Infineon Technologies |
IC FLASH 1GBIT HYPERBUS 24FBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 1Gbit | HyperBus | 166 MHz | 1.7ms | 6.5 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (8x8) |
||
Winbond Electronics |
IC FLASH 128MBIT SPI 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O, QPI | 104 MHz | 60µs, 5ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
National Semiconductor |
STANDARD SRAM, 1KX4
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 4Kbit | Parallel | - | - | 45 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Through Hole | 18-CDIP (0.300", 7.62mm) | 18-CDIP |
||
Cypress Semiconductor Corp |
IC SRAM 2MBIT PARALLEL 32TSOP II
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 2Mbit | Parallel | - | 10ns | 10 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 32-SOIC (0.400", 10.16mm Width) | 32-TSOP II |
||
Micron Technology Inc. |
LPDDR4 32G 512MX32 FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT PAR 48SSOP
|
pacchetto: - |
Request a Quote |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kbit | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |