Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 32MBIT 133MHZ 54BGA
|
pacchetto: 54-TFBGA |
Azione4.544 |
|
DRAM | SDRAM - Mobile | 32Mb (2M x 16) | Parallel | 133MHz | - | 6ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 288MBIT 400MHZ 144BGA
|
pacchetto: 144-TFBGA |
Azione4.272 |
|
DRAM | DRAM | 288Mb (8M x 36) | Parallel | 400MHz | - | 20ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | 144-FCBGA (11x18.5) |
||
ON Semiconductor |
IC FLASH 512KBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.760 |
|
FLASH | FLASH | 512Kb (64K x 8) | Parallel | - | 120ns | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 200MHZ 90BGA
|
pacchetto: 90-VFBGA |
Azione4.656 |
|
DRAM | SDRAM - Mobile LPDDR | 512Mb (16M x 32) | Parallel | 200MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (9x13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 45NS 24DIP
|
pacchetto: 24-DIP (0.300", 7.62mm) |
Azione4.640 |
|
SRAM | SRAM - Asynchronous | 16Kb (2K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Micron Technology Inc. |
IC FLASH 4MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.624 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP (8x20) |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 133MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione3.936 |
|
DRAM | SDRAM - DDR | 1Gb (256M x 4) | Parallel | 133MHz | 15ns | 750ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 55NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione5.952 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC FLASH 4MBIT 15MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.656 |
|
FLASH | FLASH | 4Mb (264 Bytes x 2048 pages) | SPI | 15MHz | 14ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 17NS 84PGA
|
pacchetto: 84-BPGA |
Azione6.832 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (8K x 16) | Parallel | - | 17ns | 17ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 84-BPGA | 84-PGA (27.94x27.94) |
||
Micron Technology Inc. |
IC FLASH 64GBIT 153LFBGA
|
pacchetto: - |
Azione5.504 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 166MHZ 60BGA
|
pacchetto: 60-TFBGA |
Azione5.168 |
|
DRAM | SDRAM - Mobile DDR | 512Mb (32M x 16) | Parallel | 166MHz | 15ns | 5.5ns | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (8x10) |
||
Intel |
IC FLASH 32MBIT 70NS 66SCSP
|
pacchetto: 66-LFBGA, CSPBGA |
Azione6.400 |
|
FLASH, RAM | FLASH, SRAM | 32Mbit Flash, 8Mbit RAM | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.3 V | -25°C ~ 85°C (TC) | Surface Mount | 66-LFBGA, CSPBGA | 66-SCSP (8x14) |
||
Alliance Memory, Inc. |
IC SRAM 1MBIT 12NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione6.336 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 12NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione2.832 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione7.632 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.384 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 150NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione13.200 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Alliance Memory, Inc. |
IC SRAM 4M PARALLEL 36TFBGA
|
pacchetto: 36-TFBGA |
Azione7.216 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 36-TFBGA | 36-TFBGA (6x8) |
||
Swissbit |
IC FLASH 16GBIT EMMC 153BGA
|
pacchetto: - |
Azione102 |
|
FLASH | FLASH - NAND (pSLC) | 16Gbit | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 153-VFBGA | 153-BGA (11.5x13) |
||
Infineon Technologies |
IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC SRAM 64KBIT PARALLEL 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kbit | Parallel | - | 20ns | 20 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 2Gbit | SPI - Quad I/O, DTR | 133 MHz | 600µs | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 1TBIT EMMC 153VFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 1Tbit | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | 153-VFBGA (11.5x13) |
||
Insignis Technology Corporation |
LPDDR4 4GB X16 2400MHZ CL16 10X1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | LVSTL | 1.2 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-FBGA (10x14.5) |
||
ISSI, Integrated Silicon Solution Inc |
Automotive (Tc: -40 to +95C), 8G
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3 | 8Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (10x14) |
||
GSI Technology Inc. |
IC SRAM 288MBIT PAR 165FPBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, Standard | 288Mbit | Parallel | 400 MHz | - | - | 2.3V ~ 2.7V, 3V ~ 3.6V | -40°C ~ 100°C (TJ) | Surface Mount | 165-LBGA | 165-FPBGA (13x15) |
||
onsemi |
IC EEPROM 256KBIT SPI 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 256Kbit | SPI | 10 MHz | 5ms | - | 1.8V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |