Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH 16GBIT 200MHZ 153FBGA
|
pacchetto: 153-VFBGA |
Azione5.664 |
|
FLASH | FLASH - NAND | 16Gb (2G x 8) | Parallel | 200MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | 153-VFBGA |
||
Winbond Electronics |
IC FLASH 4MBIT 40MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.248 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 40MHz | 15ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 256KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.808 |
|
FLASH | FLASH | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione17.340 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 25NS 64TQFP
|
pacchetto: 64-LQFP |
Azione3.280 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 144KBIT 6.5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione3.280 |
|
SRAM | SRAM - Dual Port, Synchronous | 144Kb (16K x 9) | Parallel | - | - | 6.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 72KBIT 20NS 100TQFP
|
pacchetto: 100-LQFP |
Azione7.264 |
|
SRAM | SRAM - Dual Port, Asynchronous | 72Kb (4K x 18) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione5.312 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 3.135 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 1MBIT 12NS 36MINIBGA
|
pacchetto: 36-MBGA |
Azione3.664 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 12ns | 12ns | 3.15 V ~ 3.45 V | -40°C ~ 85°C (TA) | Surface Mount | 36-MBGA | 36-miniBGA (8x10) |
||
Rohm Semiconductor |
IC EEPROM 16KBIT 5MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.632 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 5MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
SII Semiconductor Corporation |
IC EEPROM 4KBIT 5MHZ 8MSOP
|
pacchetto: 8-WSSOP, 8-MSOP (0.110", 2.80mm Width) |
Azione7.088 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 5MHz | 4ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-TMSOP |
||
ON Semiconductor |
IC EEPROM 8KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.128 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Fremont Micro Devices USA |
IC EEPROM 4KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione11.172 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Alliance Memory, Inc. |
IC SRAM 256KBIT 55NS 28SOP
|
pacchetto: 28-SOIC (0.330", 8.38mm Width) |
Azione17.196 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 55ns | 55ns | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-SOIC (0.330", 8.38mm Width) | 28-SOP |
||
STMicroelectronics |
IC EEPROM 8KBIT 5MHZ 8MLP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione7.744 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UFDFPN (2x3) |
||
STMicroelectronics |
IC EEPROM 128KBIT 20MHZ 8UFDFPN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione22.794 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 20MHz | 4ms | - | 1.8 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-MLP (2x3) |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione9.204 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-UFDFN Exposed Pad |
Azione6.224 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | VSON008X2030 |
||
Micron Technology Inc. |
IC FLASH 1G SPI 133MHZ 16SOP2
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.848 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP2 |
||
onsemi |
IC EEPROM 1KBIT MICROWIRE 8TSSOP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 1Kbit | Microwire | 2 MHz | - | - | 1.8V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Infineon Technologies |
IC FLASH 32MBIT PARALLEL 56TSOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 32Mbit | Parallel | - | 90ns | 90 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Fremont Micro Devices Ltd |
IC EEPROM 4KBIT I2C 1MHZ 8SOP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 4Kbit | I2C | 1 MHz | 5ms | 550 ns | 1.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Winbond Electronics |
IC DRAM 2GBIT HSUL 12 134VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4B | 2Gbit | HSUL_12 | 400 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
||
Würth Elektronik |
IC FLASH 256MBIT SERIAL 16SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 256Mbit | SPI - Quad I/O, QPI, DTR | 166 MHz | 50µs, 1ms | - | 1.7V ~ 1.95V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
onsemi |
IC EEPROM 32KBIT SPI 10MHZ 8UDFN
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 32Kbit | SPI | 10 MHz | 5ms | - | 1.8V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Sharp Microelectronics |
FLASH NOR 16MB Lead Free version
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | Parallel | - | 100ns | 100 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-SOP (0.524", 13.30mm Width) | 56-SSOP |
||
Winbond Electronics |
IC FLASH 16MBIT SPI/QUAD 8USON
|
pacchetto: - |
Azione16.140 |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 104 MHz | 3ms | 6 ns | 2.3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (2x3) |
||
Renesas Electronics Corporation |
IC EPROM 256KBIT PARALLEL 28CDIP
|
pacchetto: - |
Request a Quote |
|
EPROM | EPROM - UV | 256Kbit | Parallel | - | - | 100 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |