Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH NOR
|
pacchetto: - |
Azione6.608 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 55NS 36BGA
|
pacchetto: 36-TFBGA |
Azione5.712 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 55ns | 55ns | 1.65 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 36-TFBGA | 36-TFBGA (6x8) |
||
Cypress Semiconductor Corp |
IC FLASH 4MBIT 85MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.872 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | SPI | 85MHz | 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Cypress Semiconductor Corp |
IC NVSRAM 64KBIT 35NS 28SOIC
|
pacchetto: 28-SOIC (0.342", 8.69mm Width) |
Azione7.472 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-SOIC (0.342", 8.69mm Width) | 28-SOIC |
||
Cypress Semiconductor Corp |
IC NVSRAM 64KBIT 45NS 28CDIP
|
pacchetto: 28-CDIP (0.300", 7.62mm) |
Azione3.312 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 28-CDIP (0.300", 7.62mm) | 28-CDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 20NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione7.600 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 15NS 32SOJ
|
pacchetto: 32-BSOJ (0.300", 7.62mm Width) |
Azione24.072 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-BSOJ (0.300", 7.62mm Width) | 32-SOJ |
||
Microchip Technology |
IC FLASH 1MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione3.008 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20ms | 120ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC OTP 8MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione18.192 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.584 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 576MBIT 800MHZ 168BGA
|
pacchetto: 168-LBGA |
Azione3.008 |
|
DRAM | DRAM | 576Mb (32M x 18) | Parallel | 800MHz | - | 12ns | 1.28 V ~ 1.42 V | -40°C ~ 85°C (TA) | Surface Mount | 168-LBGA | 168-FC(LF)BGA (13.5x13.5) |
||
Macronix |
IC FLASH 16MBIT 104MHZ 8SOP
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione7.824 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 30µs, 3ms | - | 1.65 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.712 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 3MHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione7.648 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Adesto Technologies |
8-SOIC-N, 1.65V, I2C W/ 128B OTP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione15.300 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 100µs, 2.5ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Renesas Electronics America |
SRAM 32MB 3V X16 FBGA48 55NS -40
|
pacchetto: 48-TFBGA |
Azione12.882 |
|
SRAM | SRAM | 32Mb (2M x 16) | Parallel | - | 55ns | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (7.5x8.5) |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione5.792 |
|
DRAM | SDRAM - Mobile LPDDR4 | 8Gb (512M x 16) | - | 2.133GHz | - | - | - | -30°C ~ 85°C (TC) | Surface Mount | - | - |
||
Winbond Electronics |
IC FLASH 2MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 2Mbit | SPI - Quad I/O | 104 MHz | - | - | 1.65V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC DRAM 32GBIT PARALLEL 78FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR4 | 32Gbit | Parallel | 1.6 GHz | - | 13.75 ns | 1.14V ~ 1.26V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (10.5x11) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 64MBIT SPI/QUAD 8USON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 64Mbit | SPI - Quad I/O | 133 MHz | 140µs, 4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-USON (3x4) |
||
Infineon Technologies |
INFINEON
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC FLASH 512MBIT SPI/OCTL 24FBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | SPI - Octal I/O | 200 MHz | 1.7ms | 5.45 ns | 1.7V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (6x8) |
||
BYTe Semiconductor |
16 MBIT, WIDE VCC (1.7V TO 3.6V)
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 16Mbit | SPI - Quad I/O | 100 MHz | 3ms | 12 ns | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Micron Technology Inc. |
IC DRAM 8GBIT PARALLEL WAFER
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR4 | 8Gbit | Parallel | - | - | - | 1.14V ~ 1.26V | - | Surface Mount | Die | Wafer |
||
Insignis Technology Corporation |
LPDDR4 4GB X16 3200MHZ CL22 10X1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-FBGA (10x14.5) |
||
Rochester Electronics, LLC |
27S03ADM/B
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
USSD 2T
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
16Mb QSPI, 8-pin SOP 208Mil, RoH
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 16Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 40µs, 800µs | 7 ns | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |