Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Sharp Microelectronics |
IC FLASH 8MBIT 90NS 48TSOP
|
pacchetto: 48-TFSOP (0.488", 12.40mm Width) |
Azione6.480 |
|
FLASH | FLASH - Boot Block | 8Mb (1M x 8, 512K x 16) | Parallel | - | 90ns | 90ns | - | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.488", 12.40mm Width) | 48-TSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC PSRAM 64MBIT 70NS 48BGA
|
pacchetto: 48-TFBGA |
Azione2.048 |
|
PSRAM | PSRAM (Pseudo SRAM) | 64Mb (4M x 16) | Parallel | - | 70ns | 70ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 45NS 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione3.744 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 45ns | 45ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione10.344 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.960 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 50µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.432 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 10ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Maxim Integrated |
IC NVSRAM 64KBIT 150NS 28EDIP
|
pacchetto: 28-DIP Module (0.600", 15.24mm) |
Azione10.260 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | Parallel | - | 150ns | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-EDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 12NS 256CABGA
|
pacchetto: 256-LBGA |
Azione7.216 |
|
SRAM | SRAM - Dual Port, Asynchronous | 9Mb (256K x 36) | Parallel | - | 12ns | 12ns | 2.4 V ~ 2.6 V | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA | 256-CABGA (17x17) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 20NS 100TQFP
|
pacchetto: 100-LQFP |
Azione4.288 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 166MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione4.896 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Adesto Technologies |
IC FLASH 8MBIT 85MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.944 |
|
FLASH | FLASH | 8Mb (264 Bytes x 4096 pages) | SPI | 85MHz | 8µs, 4ms | - | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Rohm Semiconductor |
IC EEPROM 1MBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione17.370 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP-T |
||
Cypress Semiconductor Corp |
IC SRAM 256KBIT 15NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione8.796 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP I |
||
Alliance Memory, Inc. |
IC SDRAM 512MBIT 143MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione19.776 |
|
DRAM | SDRAM | 512Mb (32M x 16) | Parallel | 143MHz | 14ns | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Cypress Semiconductor Corp |
IC FLASH 256MBIT 133MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione10.464 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Macronix |
IC FLASH 512MBIT
|
pacchetto: - |
Azione7.104 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC FLASH MEMORY 32MB
|
pacchetto: - |
Azione3.632 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM 16G PARALLEL 1.2GHZ
|
pacchetto: - |
Azione38.040 |
|
DRAM | SDRAM - DDR4 | 16Gb (1G x 16) | Parallel | 1.2GHz | - | - | 1.14 V ~ 1.26 V | 0°C ~ 95°C (TC) | - | - | - |
||
Micron Technology Inc. |
IC FLASH RAM 4G PARALLEL 208MHZ
|
pacchetto: 168-WFBGA |
Azione7.152 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 4Gb (256M x 16)(NAND), 2G (128M x 16)(LPDRAM) | Parallel | 208MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
||
Micron Technology Inc. |
IC DRAM 512M PARALLEL 200MHZ
|
pacchetto: - |
Azione3.680 |
|
DRAM | SDRAM - DDR | 512Mb (128M x 4) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | 0°C ~ 70°C (TA) | - | - | - |
||
BYTe Semiconductor |
128 MBIT, 3.0V (2.7V TO 3.6V), -
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 128Mbit | SPI - Quad I/O | 108 MHz | 50µs, 2.4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
Renesas Electronics Corporation |
4M HIGH SPEED SRAM (1M X 4-BIT)
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
2GB DDR3L 1.35V SDRAM, X16, 800M
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 2Gbit | Parallel | 800 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 256MBIT SPI/QUAD 16SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O, QPI, DTR | 200 MHz | 70µs, 1.2ms | 6 ns | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP |
||
Microchip Technology |
IC EEPROM 256KBIT I2C 8DIP
|
pacchetto: - |
Azione1.245 |
|
EEPROM | EEPROM | 256Kbit | I2C | 3.4 MHz | 5ms | 70 ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Renesas Electronics Corporation |
IC SRAM 64KBIT PARALLEL 68PLCC
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kbit | Parallel | - | 25ns | 25 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Micron Technology Inc. |
LPDDR5 48G 768MX64 FBGA QDP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
7025S45GB/3215
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |