Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 64MBIT 133MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione7.008 |
|
DRAM | SDRAM | 64Mb (8M x 8) | Parallel | 133MHz | 14ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Micron Technology Inc. |
IC SDRAM 4GBIT 1067MHZ 78BGA
|
pacchetto: 78-TFBGA |
Azione5.616 |
|
DRAM | SDRAM - DDR3 | 4Gb (512M x 8) | Parallel | 1066MHz | - | 20ns | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (9x10.5) |
||
Winbond Electronics |
IC FLASH 4MBIT 50MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione2.080 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | SPI | 104MHz | 800µs | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Winbond Electronics |
IC FLASH 16MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione37.824 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 3ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC FLASH 64GBIT 100MHZ 100VBGA
|
pacchetto: 100-VBGA |
Azione7.120 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | Parallel | 100MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-VBGA | 100-VBGA (12x18) |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 1.5GBIT 153VFBGA
|
pacchetto: 153-VFBGA |
Azione36.000 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 1Gb (128M x 8)(NAND), 512Mb (16M x 32)(LPDRAM) | Parallel | 166MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 153-VFBGA | 153-VFBGA |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 150MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione6.032 |
|
SRAM | SRAM - Synchronous ZBT | 9Mb (256K x 36) | Parallel | 150MHz | - | 3.8ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 7.5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione3.952 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | - | - | 7.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
IC EEPROM 1MBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione49.272 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 5ms | 550ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 167MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione5.696 |
|
DRAM | SDRAM - DDR | 1Gb (64M x 16) | Parallel | 167MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC OTP 256KBIT 120NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione4.080 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 120ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 20NS 100TQFP
|
pacchetto: 100-LQFP |
Azione7.744 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (2K x 16) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 166MHZ 54BGA
|
pacchetto: 54-TFBGA |
Azione6.704 |
|
DRAM | SDRAM - Mobile | 512Mb (32M x 16) | Parallel | 166MHz | - | 5.5ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 12NS 36SOJ
|
pacchetto: 36-BSOJ (0.400", 10.16mm Width) |
Azione2.832 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 36-BSOJ (0.400", 10.16mm Width) | 36-SOJ |
||
Alliance Memory, Inc. |
IC SRAM 4MBIT 20NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione4.320 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Alliance Memory, Inc. |
IC SRAM 4MBIT 15NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione7.984 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Winbond Electronics |
IC FLASH 64MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione7.968 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8, 4M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Rohm Semiconductor |
IC EEPROM 32KBIT 400KHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.376 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.048 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione15.708 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC FLASH 32MBIT 80MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.512 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI - Quad I/O | 80MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 512M PARALLEL 166MHZ
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione2.560 |
|
DRAM | SDRAM - DDR | 512Mb (32M x 16) | Parallel | 166MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 105°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Cypress Semiconductor Corp |
IC MEMORY FLASH NOR
|
pacchetto: 8-WDFN Exposed Pad |
Azione7.808 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 104MHz | 5µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
Renesas Electronics Corporation |
IC FLASH 16MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Azione7.470 |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 108 MHz | 50µs, 2.4ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
IC RAM
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kbit | Parallel | - | 12ns | 12 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Winbond Electronics |
2GB LPDDR4, X16, 1866MHZ, -40C~1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | LVSTL_11 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Micron Technology Inc. |
LPDDR4 32G 1GX32 FBGA DDP
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 32Gbit | Parallel | 2.133 GHz | 18ns | - | 1.06V ~ 1.17V | -40°C ~ 95°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Alliance Memory, Inc. |
IC FLASH 8MBIT PARALLEL 48TSOP I
|
pacchetto: - |
Azione471 |
|
FLASH | FLASH - NOR | 8Mbit | Parallel | - | 55ns | 55 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |