Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH 16MBIT 104MHZ 8USON
|
pacchetto: - |
Azione7.008 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | - | 8-USON (4x3) |
||
Microchip Technology |
IC FLASH 64MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione5.984 |
|
FLASH | FLASH | 64Mb (4M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
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Microchip Technology |
IC FLASH 32MBIT 80NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione59.316 |
|
FLASH | FLASH | 32Mb (2M x 16) | Parallel | - | 70ns | 80ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TC) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
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ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 143MHZ 90BGA
|
pacchetto: 90-LFBGA |
Azione12.180 |
|
DRAM | SDRAM | 64Mb (2M x 32) | Parallel | 143MHz | - | 5.5ns | 3.15 V ~ 3.45 V | -40°C ~ 85°C (TA) | Surface Mount | 90-LFBGA | 90-BGA (13x8) |
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Microchip Technology |
IC FLASH 8MBIT 70NS 48CBGA
|
pacchetto: 48-VFBGA, CSBGA |
Azione7.504 |
|
FLASH | FLASH | 8Mb (1M x 8, 512K x 16) | Parallel | - | 200µs | 70ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 48-VFBGA, CSBGA | 48-CBGA (6x8) |
||
Maxim Integrated |
IC NVSRAM 1MBIT 150NS 34PCM
|
pacchetto: 34-PowerCap? Module |
Azione6.304 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | Parallel | - | 150ns | 150ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 34-PowerCap? Module | 34-PowerCap Module |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.912 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 10ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 55NS 68PGA
|
pacchetto: 68-BPGA |
Azione3.952 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 68-BPGA | 68-PGA (29.46x29.46) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 166MHZ 208CABGA
|
pacchetto: 208-LFBGA |
Azione3.040 |
|
SRAM | SRAM - Dual Port, Synchronous | 4.5Mb (256K x 18) | Parallel | 166MHz | - | 3.6ns | 3.15 V ~ 3.45 V | 0°C ~ 70°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
Micron Technology Inc. |
LPDDR4 24G 384MX64 FBGA QDP
|
pacchetto: - |
Azione5.376 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
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IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 12NS 100TQFP
|
pacchetto: 100-LQFP |
Azione7.312 |
|
SRAM | SRAM - Dual Port, Synchronous | 512Kb (64K x 8) | Parallel | - | - | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 25NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione2.528 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Cypress Semiconductor Corp |
ASYNC SRAMS
|
pacchetto: - |
Azione2.416 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC SRAM 64KBIT 20MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.416 |
|
SRAM | SRAM | 64Kb (8K x 8) | SPI | 20MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione3.056 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1KBIT 1MHZ SOT23-5
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione14.880 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | SOT-23-5 |
||
Microchip Technology |
IC FLASH 8MBIT 50MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione231.012 |
|
FLASH | FLASH | 8Mb (1M x 8) | SPI | 50MHz | 10µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 64G EMMC 153VFBGA
|
pacchetto: 153-VFBGA |
Azione9.888 |
|
FLASH | FLASH - NAND (MLC) | 64Gb (8G x 8) | eMMC | 200MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 153-VFBGA | 153-VFBGA (11.5x13) |
||
Cypress Semiconductor Corp |
IC FLASH 8M PARALLEL 48TSOP I
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.088 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 55ns | 55ns | 3 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 512M SPI 133MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.120 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI - Quad I/O, QPI, DTR | 133MHz | 1.6ms | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64K PARALLEL 64TQFP
|
pacchetto: 64-LQFP |
Azione2.592 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Renesas Electronics Corporation |
IC FLASH 16MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 133 MHz | 12µs, 8ms | - | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC DRAM 12GBIT 1.866GHZ 200WFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 12Gbit | - | 1.866 GHz | - | - | 1.1V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
ATP Electronics, Inc. |
IC FLASH 256GBIT EMMC 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (pSLC) | 256Gbit | eMMC | - | - | - | - | -40°C ~ 105°C | Surface Mount | 153-FBGA | 153-BGA (11.5x13) |
||
ProLabs |
Cisco MEM-CF-256MB Compatible Fa
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
TLC 2T 256GX8 FBGA DDP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC FLASH 4MBIT SPI/QUAD 8WDFN
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH | 4Mbit | SPI - Quad I/O | 80 MHz | 1.5ms | - | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WDFN (5x6) |
||
Rohm Semiconductor |
IC EEPROM 512KBIT SPI 8SOP
|
pacchetto: - |
Azione7.500 |
|
EEPROM | EEPROM | 512Kbit | SPI | 20 MHz | 3.5ms | 20 ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |