Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH MEMORY 48TSOP
|
pacchetto: - |
Azione2.864 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC RLDRAM 576MBIT 533MHZ 144UBGA
|
pacchetto: 144-TFBGA |
Azione12.276 |
|
DRAM | DRAM | 576Mb (16M x 36) | Parallel | 533MHz | - | 15ns | 1.7 V ~ 1.9 V | 0°C ~ 95°C (TC) | Surface Mount | 144-TFBGA | 144-µBGA (18.5x11) |
||
Winbond Electronics |
IC FLASH 8MBIT 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione6.544 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 7.5NS 165CABGA
|
pacchetto: 165-TBGA |
Azione5.584 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (256K x 18) | Parallel | - | - | 7.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 15NS 32TSOP
|
pacchetto: 32-SOIC (0.400", 10.16mm Width) |
Azione2.672 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.400", 10.16mm Width) | 32-TSOP II |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 133MHZ 60FBGA
|
pacchetto: 60-TFBGA |
Azione7.328 |
|
DRAM | SDRAM - DDR | 512Mb (32M x 16) | Parallel | 133MHz | 15ns | 750ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-FBGA (10x12.5) |
||
Microchip Technology |
IC FLASH 8MBIT 10MHZ 28SOIC
|
pacchetto: 28-SOIC (0.342", 8.69mm Width) |
Azione4.368 |
|
FLASH | FLASH | 8Mb (264 Bytes x 4096 pages) | SPI | 10MHz | 14ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.342", 8.69mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 1MBIT 250NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.656 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 250ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 3MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione39.540 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC FLASH 2MBIT 200NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione127.704 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20ms | 200ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 70NS 68PGA
|
pacchetto: 68-BPGA |
Azione7.392 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (2K x 16) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 68-BPGA | 68-PGA (29.46x29.46) |
||
Micron Technology Inc. |
PARALLEL/MOBILE DDR 576M
|
pacchetto: - |
Azione6.192 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC SGRAM 4GBIT 1.5GHZ 170FBGA
|
pacchetto: 170-TFBGA |
Azione5.936 |
|
RAM | SGRAM - GDDR5 | 4Gb (128M x 32) | Parallel | 1.5GHz | - | - | 1.31 V ~ 1.65 V | 0°C ~ 95°C (TC) | Surface Mount | 170-TFBGA | 170-FBGA (12x14) |
||
Micron Technology Inc. |
IC FLASH 32MBIT 108MHZ 8VPDFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione5.760 |
|
FLASH | FLASH - NOR | 32Mb (8M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-VDFN (6x5) |
||
Cypress Semiconductor Corp |
IC FLASH NOR 8WSON
|
pacchetto: - |
Azione2.048 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O | 108MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | - | - | - |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.128 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.688 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1KBIT 100KHZ TO92-3
|
pacchetto: TO-226-3, TO-92-3 (TO-226AA) |
Azione6.960 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | TO-226-3, TO-92-3 (TO-226AA) | TO-92-3 |
||
Cypress Semiconductor Corp |
IC FLASH 32MBIT108MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione11.760 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O | 108MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |
||
Rohm Semiconductor |
IC EEPROM 2KBIT 2MHZ 8SOP
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione479.820 |
|
EEPROM | EEPROM | 2Kb (128 x 16) | SPI | 2MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Cypress Semiconductor Corp |
IC FLASH 1GBIT 110NS 64BGA
|
pacchetto: 64-LBGA |
Azione23.808 |
|
FLASH | FLASH - NOR | 1Gb (64M x 16) | Parallel | - | 60ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Cypress Semiconductor Corp |
IC GATE NOR
|
pacchetto: - |
Azione3.232 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 16MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Azione9.099 |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 800µs | - | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Alliance Memory, Inc. |
MEMORY
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Alliance Memory, Inc. |
MEMORY
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (MLC) | 512Mbit | CFI | 40 MHz | - | 100 ns | 1.7V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-LBGA (11x13) |
||
Infineon Technologies |
IC FLASH 128MBIT PARALLEL 56TSOP
|
pacchetto: - |
Azione546 |
|
FLASH | FLASH - NOR | 128Mbit | Parallel | - | 70ns | 70 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Winbond Electronics |
IC DRAM 1GBIT PAR 96VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 1Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 105°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |