Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8.5NS 165CABGA
|
pacchetto: 165-TBGA |
Azione6.208 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | - | - | 8.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Cypress Semiconductor Corp |
IC SRAM 64KBIT 55NS 100TQFP
|
pacchetto: 100-LQFP |
Azione3.728 |
|
SRAM | SRAM - Dual Port, MoBL | 64Kb (8K x 8) | Parallel | - | 55ns | 55ns | 1.7 V ~ 1.9 V, 2.4 V ~ 2.6 V, 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
STMicroelectronics |
IC FLASH 4MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione13.644 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione144.936 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 400kHz | 5ms | 900ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.856 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Maxim Integrated |
IC NVSRAM 64KBIT 150NS 28EDIP
|
pacchetto: 28-DIP Module (0.600", 15.24mm) |
Azione6.208 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | Parallel | - | 150ns | 150ns | 4.75 V ~ 5.25 V | -40°C ~ 85°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-EDIP |
||
Microchip Technology |
IC EEPROM 64KBIT 150NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione6.512 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 1ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC OTP 512KBIT 55NS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione10.440 |
|
EPROM | EPROM - OTP | 512Kb (32K x 16) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 35NS 100TQFP
|
pacchetto: 100-LQFP |
Azione2.400 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 25NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione4.288 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Micron Technology Inc. |
IC FLASH 128GBIT 152VBGA
|
pacchetto: - |
Azione6.976 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.704 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Micron Technology Inc. |
IC FLASH 512MBIT 100NS 64BGA
|
pacchetto: 64-LBGA |
Azione4.816 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8, 32M x 16) | Parallel | - | 100ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (11x13) |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione5.136 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione97.200 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC EEPROM 128BIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.664 |
|
EEPROM | EEPROM | 128b (16 x 8) | I2C | 400kHz | 4ms | 3500ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 167MHZ 60FBGA
|
pacchetto: 60-TFBGA |
Azione6.464 |
|
DRAM | SDRAM - DDR | 512Mb (128M x 4) | Parallel | 167MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-FBGA (10x12.5) |
||
Maxim Integrated |
IC EEPROM 4KBIT 1WIRE 8SO
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione386.352 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | 1-Wire? | - | - | 2µs | 2.8 V ~ 5.25 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SO |
||
Cypress Semiconductor Corp |
IC NOR
|
pacchetto: - |
Azione2.512 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Alliance Memory, Inc. |
IC DRAM 256M PARALLEL 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione3.440 |
|
DRAM | SDRAM | 256Mb (32M x 8) | Parallel | 143MHz | - | 5.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Cypress Semiconductor Corp |
IC FLASH 64M SPI 108MHZ 8USON
|
pacchetto: 8-UDFN Exposed Pad |
Azione3.968 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-USON (4x4) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32K PARALLEL 128TQFP
|
pacchetto: 128-LQFP |
Azione4.352 |
|
SRAM | SRAM - Quad Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
Winbond Electronics |
IC FLASH 128MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O | 133 MHz | -, 3ms | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
onsemi |
IC EEPROM 256KBIT SPI 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 256Kbit | SPI | 10 MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Winbond Electronics |
IC FLASH 512MBIT SPI/QUAD 16SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 512Mbit | SPI - Quad I/O | 104 MHz | 700µs | 7 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 128MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 128Mbit | SPI - Quad I/O, QPI | 104 MHz | 2.4ms | 6 ns | 1.65V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
Advanced Micro Devices |
IC PROM 1KBIT PARALLEL 20PLCC
|
pacchetto: - |
Request a Quote |
|
PROM | - | 1Kbit | Parallel | - | - | 50 ns | 4.75V ~ 5.25V | 0°C ~ 75°C (TA) | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Renesas Electronics Corporation |
IC SRAM 1MBIT LVTTL 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 1Mbit | LVTTL | - | 15ns | 15 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |