Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 55NS 36BGA
|
pacchetto: 36-TFBGA |
Azione6.528 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 55ns | 55ns | 1.65 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 36-TFBGA | 36-TFBGA (6x8) |
||
Cypress Semiconductor Corp |
IC FLASH 2GBIT 120NS 64BGA
|
pacchetto: 64-LBGA |
Azione5.696 |
|
FLASH | FLASH - NOR | 2Gb (256M x 8, 128M x 16) | Parallel | - | - | 120ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (11x13) |
||
Alliance Memory, Inc. |
IC SDRAM 2GBIT 800MHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione6.720 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 800MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (13x9) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 65NS 100FBGA
|
pacchetto: 100-TFBGA |
Azione4.656 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (16K x 16) | Parallel | - | 65ns | 65ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 100-TFBGA | 100-CABGA (6x6) |
||
Renesas Electronics America |
IC EEPROM 64KBIT 5MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.152 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 5MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 16MBIT 85MHZ 8UDFN
|
pacchetto: 8-UDFN Exposed Pad |
Azione2.224 |
|
FLASH | FLASH | 16Mb (528 Bytes x 4096 pages) | SPI | 85MHz | 8µs, 6ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.232 |
|
EEPROM | EEPROM | 16Kb (1K x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 166MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione3.152 |
|
DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 166MHz | - | 5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione3.904 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 25NS 80TQFP
|
pacchetto: 80-LQFP |
Azione5.088 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (32K x 8) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione2.464 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | Parallel | - | 60ns | 120ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
F-RAM MEMORY SERIAL
|
pacchetto: - |
Azione2.608 |
|
FRAM | FRAM (Ferroelectric RAM) | 64Kb (8K x 8) | I2C | 1MHz | - | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | - | - | - |
||
Winbond Electronics |
IC SDRAM 1GBIT 933MHZ 78BGA
|
pacchetto: 78-TFBGA |
Azione6.496 |
|
DRAM | SDRAM - DDR3 | 1Gb (128M x 8) | Parallel | 933MHz | - | 20ns | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-WBGA (10.5x8) |
||
Micron Technology Inc. |
IC FLASH 128MBIT 85NS 56VFBGA
|
pacchetto: 56-VFBGA |
Azione3.984 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | 66MHz | 85ns | 85ns | 1.7 V ~ 2 V | -30°C ~ 85°C (TA) | Surface Mount | 56-VFBGA | 56-VFBGA (7.7x9) |
||
Winbond Electronics |
IC FLASH 128MBIT 90NS 56TFBGA
|
pacchetto: 56-TFBGA |
Azione7.632 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFBGA | 56-TFBGA (9x7) |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione21.588 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 550MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione6.912 |
|
SRAM | SRAM - Synchronous, QDR II+ | 18Mb (512K x 36) | Parallel | 550MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Adesto Technologies |
IC FLASH 4MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione61.740 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 104MHz | 5µs, 2.5ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Alliance Memory, Inc. |
IC DRAM 1G PARALLEL 78FBGA
|
pacchetto: 78-VFBGA |
Azione4.064 |
|
DRAM | SDRAM - DDR3 | 1Gb (128M x 8) | Parallel | 800MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | -40°C ~ 105°C (TC) | Surface Mount | 78-VFBGA | 78-FBGA (10.5x8) |
||
Micron Technology Inc. |
LPDDR4 64G 2GX32 FBGA WT 8DP
|
pacchetto: - |
Azione5.472 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 128M SPI 24TPBGA
|
pacchetto: 24-TBGA |
Azione2.336 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |
||
Micron Technology Inc. |
IC FLASH 4G PARALLEL 63VFBGA
|
pacchetto: - |
Azione6.832 |
|
FLASH | FLASH - NAND | 4Gb (256M x 16) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | - | - | - |
||
Microchip Technology |
5MHZ A-TMP 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.424 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 5MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Alliance Memory, Inc. |
4G DDR3 256MX16 1.35V 96-BALL FB
|
pacchetto: 96-TFBGA |
Azione7.056 |
|
DRAM | SDRAM - DDR3L | 4Gb (256M x 16) | Parallel | 933MHz | 15ns | 20ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (9x13.5) |
||
Silicon Motion, Inc. |
IC FLASH 4TBIT EMMC 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 4Tbit | eMMC | - | - | - | - | -40°C ~ 85°C | Surface Mount | 153-TBGA | 153-BGA (11.5x13) |
||
Micron Technology Inc. |
LPDDR5 64GBIT 64 561/570 TFBGA 4
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 4GBIT HSUL 12 168VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4 | 4Gbit | HSUL_12 | 400 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 168-VFBGA | 168-VFBGA (12x12) |
||
Harris Corporation |
IC SRAM 256BIT PARALLEL 18CDIP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 256bit | Parallel | - | - | 710 ns | 4V ~ 6.5V | -40°C ~ 85°C (TA) | Through Hole | 18-CDIP | 18-CDIP |