Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC SRAM 18MBIT 167MHZ 119BGA
|
pacchetto: 119-BGA |
Azione2.608 |
|
SRAM | SRAM - Synchronous | 18Mb (1M x 18) | Parallel | 167MHz | - | 3.4ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 133MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione6.608 |
|
SRAM | SRAM - Synchronous ZBT | 9Mb (512K x 18) | Parallel | 133MHz | - | 4.2ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 12NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione5.120 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 143MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione94.392 |
|
DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
STMicroelectronics |
IC FLASH 2MBIT 200NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione24.648 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | - | 200ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) |
||
Microchip Technology |
IC FLASH 1MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.288 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 20ms | 150ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Maxim Integrated |
IC NVSRAM 256KBIT 85NS 28EDIP
|
pacchetto: 28-DIP Module (0.600", 15.24mm) |
Azione6.432 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 85ns | 85ns | 4.75 V ~ 5.25 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP Module (0.600", 15.24mm) | 28-EDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione7.840 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EEPROM 1MBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.552 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 4MBIT 90NS 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione5.536 |
|
EPROM | EPROM - OTP | 4Mb (512K x 8, 256K x 16) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Cypress Semiconductor Corp |
IC FLASH 512MBIT 66MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.320 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI - Quad I/O | 66MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Winbond Electronics |
IC FLASH 256MBIT 104MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.104 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 133MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Micron Technology Inc. |
IC FLASH 32MBIT 8VPDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione3.504 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WPDFN (6x5)(MLP8) |
||
Cypress Semiconductor Corp |
F-RAM MEMORY SERIAL
|
pacchetto: - |
Azione4.128 |
|
FRAM | FRAM (Ferroelectric RAM) | 16Kb (2K x 8) | I2C | 1MHz | - | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | - | - | - |
||
Alliance Memory, Inc. |
IC SRAM 256KBIT 12NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione5.808 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 256KBIT 20NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione33.360 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 20ns | 20ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP I |
||
Micron Technology Inc. |
IC FLASH 1MX8 SLC UFDFPN
|
pacchetto: - |
Azione6.848 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 108MHz | 8ms, 5ms | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | - | - | - |
||
ON Semiconductor |
IC EEPROM 1MBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.920 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 5ms | 400ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Winbond Electronics |
IC FLASH 8MBIT 80MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione12.156 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 104MHz | 800µs | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Cypress Semiconductor Corp |
IC 1 GB FLASH MEMORY
|
pacchetto: - |
Azione5.680 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 64M SPI 133MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione16.866 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 133MHz | 800µs | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 256M PARALLEL 60TFBGA
|
pacchetto: 60-TFBGA |
Azione2.384 |
|
DRAM | SDRAM - DDR | 256Mb (16M x 16) | Parallel | 166MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (13x8) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512K PARALLEL 100TQFP
|
pacchetto: 100-LQFP |
Azione2.944 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Winbond Electronics |
IC FLASH 32MBIT SPI/QUAD 8XSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 32Mbit | SPI - Quad I/O | 133 MHz | 3ms | 6 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-XDFN Exposed Pad | 8-XSON (4x4) |
||
Winbond Electronics |
IC FLASH 16MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | 6 ns | 1.65V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 8GBIT PARALLEL 96LWBGA
|
pacchetto: - |
Azione456 |
|
DRAM | SDRAM - DDR3L | 8Gbit | Parallel | 800 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 96-LFBGA | 96-LWBGA (9x13) |
||
Micron Technology Inc. |
IC FLASH 1GBIT DIE
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 1Gbit | - | - | - | - | 2.7V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Winbond Electronics |
IC FLASH 16MBIT SPI/QUAD 8USON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (4x3) |