Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 1KBIT 1MHZ SOT23-5
|
pacchetto: SOT-23-5 Thin, TSOT-23-5 |
Azione3.920 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | SOT-23-5 |
||
Adesto Technologies |
IC FLASH 16MBIT 70MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione199.788 |
|
FLASH | FLASH | 16Mb (256 Bytes x 8192 pages) | SPI | 70MHz | 7µs, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 16MBIT 166MHZ 50TSOP
|
pacchetto: 50-TSOP (0.400", 10.16mm Width) |
Azione2.032 |
|
DRAM | SDRAM | 16Mb (1M x 16) | Parallel | 166MHz | - | 5.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width) | 50-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 143MHZ 54LFBGA
|
pacchetto: 54-LFBGA |
Azione6.512 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-LFBGA | 54-LFBGA (8x13) |
||
Microchip Technology |
IC FLASH 16MBIT 55NS 48CBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione3.632 |
|
FLASH | FLASH | 16Mb (2M x 8, 1M x 16) | Parallel | - | 200µs | 55ns | 2.65 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 48-TFBGA, CSPBGA | 48-CBGA (6x8) |
||
Microchip Technology |
IC FLASH 2MBIT 90NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione73.308 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Microchip Technology |
IC OTP 4MBIT 120NS 40DIP
|
pacchetto: 40-DIP (0.600", 15.24mm) |
Azione3.664 |
|
EPROM | EPROM - OTP | 4Mb (256K x 16) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 35NS 68FPACK
|
pacchetto: 68-Flatpack |
Azione2.720 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (2K x 16) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 68-Flatpack | 68-FPACK |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 200MHZ 165BGA
|
pacchetto: 165-LBGA |
Azione6.864 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 200MHz | - | 3ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Micron Technology Inc. |
IC RLDRAM 288MBIT 400MHZ 144FBGA
|
pacchetto: 144-TBGA |
Azione6.416 |
|
DRAM | DRAM | 288Mb (16M x 18) | Parallel | 400MHz | - | 20ns | 1.7 V ~ 1.9 V | 0°C ~ 95°C (TC) | Surface Mount | 144-TBGA | 144-FBGA (18.5x11) |
||
Micron Technology Inc. |
IC FLASH 512MBIT 100NS 64EASYBGA
|
pacchetto: 64-TBGA |
Azione4.976 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | 52MHz | 100ns | 100ns | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TBGA | 64-EasyBGA (8x10) |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione5.520 |
|
FLASH, RAM | FLASH, DRAM | 256Mbit Flash, 2565Mbit DDR DRAM | Parallel | 108MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.896 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 2MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione2.880 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 32M SPI 133MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.600 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI, DTR | 133MHz | 800µs | 7ns | 1.65 V ~ 1.95 V | -40°C ~ 105°C | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC DRAM 1G PARALLEL 933MHZ
|
pacchetto: 96-TFBGA |
Azione3.200 |
|
DRAM | SDRAM - DDR3L | 1Gb (64M x 16) | Parallel | 933MHz | - | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 125°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (8x14) |
||
Micron Technology Inc. |
IC FLASH 512M SPI 133MHZ 16SOP2
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.776 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP2 |
||
Micron Technology Inc. |
IC DRAM 8G PARALLEL
|
pacchetto: - |
Azione6.496 |
|
DRAM | SDRAM - Mobile LPDDR3 | 8Gb (512M x 16) | Parallel | - | - | - | 1.14 V ~ 1.95 V | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM 8G 1600MHZ
|
pacchetto: - |
Azione2.960 |
|
DRAM | SDRAM - Mobile LPDDR4 | 8Gb (256M x 32) | - | 1600MHz | - | - | 1.1V | -40°C ~ 125°C (TC) | - | - | - |
||
onsemi |
IC EEPROM 16KBIT MICROWIRE 8UDFN
|
pacchetto: - |
Azione9.000 |
|
EEPROM | EEPROM | 16Kbit | Microwire | 2 MHz | - | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Cypress Semiconductor Corp |
IC EPROM 16KBIT PARALLEL
|
pacchetto: - |
Request a Quote |
|
EPROM | EPROM - UV | 16Kbit | Parallel | - | - | 50 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 256MBIT PAR 54TSOP II
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 256Mbit | LVTTL | 143 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 4GBIT PAR 78TWBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-TWBGA (9x10.5) |
||
MoSys, Inc. |
IC MEMORY RMW 0.5GB ALU FCBGA
|
pacchetto: - |
Request a Quote |
|
RAM | SRAM, RLDRAM | 576Mbit | Parallel | - | - | 3.2 ns | - | - | Surface Mount | 288-BGA, FCBGA | 288-FCBGA (19x19) |
||
Silicon Motion, Inc. |
IC FLASH 160GBIT EMMC 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 160Gbit | eMMC | - | - | - | - | -25°C ~ 85°C | Surface Mount | 153-TBGA | 153-BGA (11.5x13) |
||
STMicroelectronics |
256-KBIT SERIAL I2C BUS EEPROM W
|
pacchetto: - |
Azione10.125 |
|
EEPROM | EEPROM | 256Kbit | I2C | 1 MHz | 5ms | 450 ns | 1.6V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Silicon Motion, Inc. |
IC FLASH 4GBIT EMMC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 4Gbit | eMMC | - | - | - | - | -40°C ~ 85°C | Surface Mount | 100-BGA | - |
||
Winbond Electronics |
IC FLASH 1GBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 1Gbit | SPI - Quad I/O, DTR | 166 MHz | 700µs | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |