Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH NOR
|
pacchetto: - |
Azione7.888 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH NOR 512MBIT
|
pacchetto: - |
Azione5.824 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR3 192MX128 PLASTIC GREEN VF
|
pacchetto: - |
Azione5.280 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 64GBIT 83MHZ 100VBGA
|
pacchetto: 100-VBGA |
Azione5.216 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-VBGA | 100-VBGA (12x18) |
||
Winbond Electronics |
IC FLASH 64MBIT 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.632 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
STMicroelectronics |
IC FLASH 4MBIT 90NS 80LQFP
|
pacchetto: 80-LQFP |
Azione5.856 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | 80-LQFP (12x12) |
||
Microchip Technology |
IC OTP 512KBIT 70NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione24.696 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 70ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Micron Technology Inc. |
IC SDRAM 16GBIT 800MHZ FBGA
|
pacchetto: - |
Azione7.092 |
|
DRAM | SDRAM - DDR3L | 16Gb (1G x 16) | Parallel | 800MHz | - | - | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 35NS 64TQFP
|
pacchetto: 64-LQFP |
Azione7.232 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 167MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione4.816 |
|
DRAM | SDRAM | 512Mb (32M x 16) | Parallel | 167MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 133MHZ 90BGA
|
pacchetto: 90-TFBGA |
Azione6.080 |
|
DRAM | SDRAM | 256Mb (8M x 32) | Parallel | 133MHz | - | 6ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione3.824 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | Parallel | - | 60ns | 130ns | 1.65 V ~ 3.6 V | -40°C ~ 125°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 64MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione2.896 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6.39x10.5) |
||
Microchip Technology |
IC EEPROM 512KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.872 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 20NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione4.192 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 20ns | 20ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 250MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione5.760 |
|
SRAM | SRAM - Synchronous, QDR II | 72Mb (2M x 36) | Parallel | 250MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
pacchetto: Die |
Azione7.296 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 2G PARALLEL 533MHZ
|
pacchetto: 168-VFBGA |
Azione6.528 |
|
DRAM | SDRAM - Mobile LPDDR2-S4 | 2Gb (64M x 32) | Parallel | 533MHz | 15ns | - | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | 168-VFBGA (12x12) |
||
Micron Technology Inc. |
LPDDR4 16G 1GX16 FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
ISSI, Integrated Silicon Solution Inc |
2G, 1.5V, DDR3, 128Mx16, 1866MT/
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 2Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Quality Semiconductor |
CACHE TAG SRAM, 16KX4, 19NS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC PSRAM 64MBIT HYPERBUS 24FBGA
|
pacchetto: - |
Request a Quote |
|
PSRAM | PSRAM (Pseudo SRAM) | 64Mbit | HyperBus | 200 MHz | 35ns | 35 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (6x8) |
||
Renesas Electronics Corporation |
IC RAM
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Quad Port, Asynchronous | 32Kbit | Parallel | - | 45ns | 45 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
onsemi |
IC EEPROM 32KBIT I2C 1MHZ 8MSOP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 32Kbit | I2C | 1 MHz | 5ms | 400 ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Micron Technology Inc. |
DDR4 16GB
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
onsemi |
IC EEPROM 1KBIT 400KHZ 8DIP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 1Kbit | I2C | 400 kHz | 5ms | 1 µs | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 256MBIT PAR 90TFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 256Mbit | LVTTL | 166 MHz | - | 5.4 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Micron Technology Inc. |
LPDDR5 48G 1.5GX32 FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |