Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 16GBIT 533MHZ FBGA
|
pacchetto: 168-TFBGA |
Azione6.832 |
|
DRAM | SDRAM - Mobile LPDDR2 | 16Gb (512M x 32) | Parallel | 533MHz | - | - | 1.14 V ~ 1.95 V | -30°C ~ 85°C (TC) | Surface Mount | 168-TFBGA | 168-FBGA (12x12) |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 40MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.952 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | SPI | 40MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 250MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione2.128 |
|
SRAM | SRAM - Synchronous, QDR II | 18Mb (512K x 36) | Parallel | 250MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 7.5NS 165CABGA
|
pacchetto: 165-TBGA |
Azione3.136 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | - | - | 7.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 133MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione6.320 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 133MHz | - | 4.2ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SARAM 128KBIT 20NS 80TQFP
|
pacchetto: 80-LQFP |
Azione2.272 |
|
RAM | SARAM | 128Kb (8K x 16) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Cypress Semiconductor Corp |
IC SRAM 2MBIT 166MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione2.560 |
|
SRAM | SRAM - Synchronous | 2Mb (64K x 36) | Parallel | 166MHz | - | 3.5ns | 3.15 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 533MHZ 60FBGA
|
pacchetto: 60-FBGA |
Azione5.312 |
|
DRAM | SDRAM - DDR2 | 1Gb (128M x 8) | Parallel | 533MHz | 15ns | 350ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 60-FBGA | 60-FBGA (8x11.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 8MBIT 70NS 48MINIBGA
|
pacchetto: 48-TFBGA |
Azione6.480 |
|
SRAM | SRAM - Asynchronous | 8Mb (512K x 16) | Parallel | - | 70ns | 70ns | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-miniBGA (6x8) |
||
Microchip Technology |
IC EEPROM 64KBIT 20MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.776 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 20MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.768 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 16MBIT 15MHZ 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione7.856 |
|
FLASH | FLASH | 16Mb (528 Bytes x 4096 pages) | SPI | 15MHz | 14ms | - | 2.5 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 576MBIT 1066MHZ 168BGA
|
pacchetto: 168-LBGA |
Azione3.808 |
|
DRAM | DRAM | 576Mb (32M x 18) | Parallel | 1.066GHz | - | 8ns | 1.28 V ~ 1.42 V | -40°C ~ 85°C (TA) | Surface Mount | 168-LBGA | 168-FC(LF)BGA (13.5x13.5) |
||
Cypress Semiconductor Corp |
IC NVSRAM 16MBIT 30NS 165FBGA
|
pacchetto: 165-LBGA |
Azione4.000 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 16Mb (1M x 16) | Parallel | - | 30ns | 30ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 25NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione5.376 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 25ns | 25ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 35NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione7.216 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 150MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione2.192 |
|
SRAM | SRAM - Synchronous | 4.5Mb (256K x 18) | Parallel | 150MHz | - | 3.8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Rohm Semiconductor |
IC EEPROM 32KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.640 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 512M PARALLEL 200MHZ
|
pacchetto: 60-TFBGA |
Azione4.240 |
|
DRAM | SDRAM - DDR | 512Mb (32M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (13x8) |
||
Cypress Semiconductor Corp |
IC GATE NOR
|
pacchetto: - |
Azione2.992 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC SRAM 4M FAST 36-SOJ
|
pacchetto: 36-BSOJ (0.400", 10.16mm Width) |
Azione4.400 |
|
SRAM | SRAM | 4Mb (512K x 8) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 36-BSOJ (0.400", 10.16mm Width) | 36-SOJ |
||
Cypress Semiconductor Corp |
IC FLASH MEM NOR 48FBGA
|
pacchetto: 48-VFBGA |
Azione3.152 |
|
FLASH | FLASH - NOR | 32Mb (2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 48-VFBGA | 48-FBGA (8.15x6.15) |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.928 |
|
EEPROM | EEPROM | 1Kb (128 x 8, 64 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 1GBIT PAR 96TWBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 1Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Infineon Technologies |
IC FLASH 512MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | SPI - Quad I/O, QPI | 133 MHz | - | - | 1.7V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
Winbond Electronics |
2GB LPDDR4, X16, 1866MHZ, -40C~1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 2Gbit | LVSTL_11 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Micron Technology Inc. |
UFS 4T
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 128MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 128Mbit | SPI - Quad I/O, QPI | 104 MHz | 2.4ms | 6 ns | 1.65V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |