Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 128MBIT 70NS 64TBGA
|
pacchetto: 64-TBGA |
Azione5.856 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | 52MHz | 70ns | 70ns | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TBGA | 64-TBGA (10x13) |
||
Micron Technology Inc. |
IC SDRAM 16GBIT 533MHZ FBGA
|
pacchetto: 220-VFBGA |
Azione6.080 |
|
DRAM | SDRAM - Mobile LPDDR2 | 16Gb (256M x 64) | Parallel | 533MHz | - | - | 1.14 V ~ 1.3 V | -30°C ~ 85°C (TC) | Surface Mount | 220-VFBGA | 220-FBGA (14x14) |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.856 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 20µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 300MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione6.032 |
|
SRAM | SRAM - Synchronous, QDR II | 72Mb (2M x 36) | Parallel | 300MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Micron Technology Inc. |
IC FLASH 64MBIT 85NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione173.136 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | 40MHz | 85ns | 85ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP (14x20) |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 167MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione2.176 |
|
SRAM | SRAM - Synchronous | 72Mb (4M x 18) | Parallel | 167MHz | - | 3.4ns | 3.135 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.048 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Micron Technology Inc. |
IC FLASH 512GBIT 100MHZ 100LBGA
|
pacchetto: 100-LBGA |
Azione7.904 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | Parallel | 100MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LBGA | 100-LBGA (12x18) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 9NS 100TQFP
|
pacchetto: 100-LQFP |
Azione7.984 |
|
SRAM | SRAM - Dual Port, Synchronous | 1Mb (128K x 8) | Parallel | - | - | 9ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 1GBIT 166MHZ 60BGA
|
pacchetto: 60-TFBGA |
Azione6.576 |
|
DRAM | SDRAM - Mobile DDR | 1Gb (64M x 16) | Parallel | 166MHz | 15ns | 5ns | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 60-TFBGA | 60-TWBGA (8x10) |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 133MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione4.880 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 133MHz | - | 6.5ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione4.736 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
ON Semiconductor |
IC EEPROM 16KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione576.456 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Alliance Memory, Inc. |
IC DRAM 4G PARALLEL 96FBGA
|
pacchetto: 96-TFBGA |
Azione3.024 |
|
DRAM | SDRAM - DDR3L | 4Gb (256M x 16) | Parallel | 800MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (13.5x9) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 32M PARALLEL 133MHZ
|
pacchetto: 90-TFBGA |
Azione6.416 |
|
DRAM | SDRAM - Mobile | 32Mb (1M x 32) | Parallel | 133MHz | - | 6ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Cypress Semiconductor Corp |
IC FLASH 128M SPI 108MHZ 8SO
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.184 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Renesas Electronics America |
IC SRAM 4M FAST 44-SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione6.928 |
|
SRAM | SRAM | 4Mb (256K x 16) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
Micron Technology Inc. |
SPECIAL/CUSTOM LPDDR3
|
pacchetto: - |
Azione5.904 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Alliance Memory, Inc. |
IC DRAM 1G PARALLEL 134FBGA
|
pacchetto: 134-VFBGA |
Azione7.840 |
|
DRAM | SDRAM - Mobile LPDDR2 | 1Gb (32M x 32) | Parallel | 400MHz | 15ns | - | 1.14 V ~ 1.95 V | -30°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-FBGA (10x11.5) |
||
Winbond Electronics |
IC DRAM 2GBIT HSUL 12 134VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4B | 2Gbit | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
||
Renesas Electronics Corporation |
72-MB DDR II+ SRAM (2M X 36-BIT)
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ATP Electronics, Inc. |
21GB E.MMC 153 BALLS BGA C-TEMP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
1MBIT 3.4MHZ I2C SERIAL EEPROM,
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 1Mbit | I2C | 3.4 MHz | 5ms | 70 ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Silicon Motion, Inc. |
IC FLASH 160GBIT UFS3.1 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 160Gbit | UFS3.1 | - | - | - | - | -40°C ~ 105°C | Surface Mount | 153-TFBGA | 153-BGA (11.5x13) |
||
ISSI, Integrated Silicon Solution Inc |
4G, 1.2V, DDR4, 512Mx8, 2400MT/s
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR4 | 4Gbit | POD | 1.2 GHz | 15ns | 19 ns | 1.14V ~ 1.26V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-TWBGA (10x14) |
||
Cypress Semiconductor Corp |
IC SRAM 256KBIT PAR 28TSOP I
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 256Kbit | Parallel | - | 55ns | 55 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP I |
||
Microchip Technology |
IC EEPROM 2KBIT I2C TSOT23-5
|
pacchetto: - |
Azione34.695 |
|
EEPROM | EEPROM | 2Kbit | I2C | 1 MHz | 5ms | 450 ns | 1.7V ~ 3.6V | -40°C ~ 85°C (TC) | Surface Mount | SOT-23-5 Thin, TSOT-23-5 | TSOT-23-5 |