Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 32GBIT WAFER
|
pacchetto: Die |
Azione4.688 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Cypress Semiconductor Corp |
IC NVSRAM 4MBIT 45NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione18.744 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mb (256K x 16) | Parallel | - | 45ns | 45ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 200MHZ 484FBGA
|
pacchetto: 484-FBGA |
Azione5.024 |
|
SRAM | SRAM - Dual Port, Synchronous | 36Mb (2M x 18) | Parallel | 200MHz | - | 3.3ns | 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 484-FBGA | 484-FBGA (23x23) |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 300MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione5.248 |
|
SRAM | SRAM - Synchronous, DDR II | 18Mb (512K x 36) | Parallel | 300MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Micron Technology Inc. |
IC FLASH 64MBIT 85NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione5.120 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | 40MHz | 85ns | 85ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP (14x20) |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 167MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione5.392 |
|
SRAM | SRAM - Synchronous, QDR II | 18Mb (1M x 18) | Parallel | 167MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 55NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione2.384 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (32K x 8) | Parallel | - | 55ns | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 15NS 100TQFP
|
pacchetto: 100-LQFP |
Azione6.832 |
|
SRAM | SRAM - Dual Port, Synchronous | 256Kb (16K x 16) | Parallel | - | - | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 20NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione3.248 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione14.844 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.952 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 10MHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.464 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ SOT23-6
|
pacchetto: SOT-23-6 |
Azione4.544 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Cypress Semiconductor Corp |
IC FLASH 512M PARALLEL 56BGA
|
pacchetto: 56-VFBGA |
Azione4.368 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | Parallel | - | 60ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-VFBGA | 56-FBGA (9x7) |
||
Cypress Semiconductor Corp |
IC FLASH 128M SPI 66MHZ 16SO
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.736 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 66MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Micron Technology Inc. |
IC DRAM 2G PARALLEL 167MHZ
|
pacchetto: - |
Azione4.304 |
|
DRAM | SDRAM - Mobile LPDDR | 2Gb (64M x 32) | Parallel | 167MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC SDRAM DDR3 8GB FBGA
|
pacchetto: 96-TFBGA |
Azione7.504 |
|
DRAM | SDRAM - DDR3L | 8Gb (512M x 16) | Parallel | 933MHz | 15ns | 20ns | 1.283V ~ 1.45V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (8x14) |
||
Macronix |
IC FLASH 4G 63VFBGA
|
pacchetto: 63-VFBGA |
Azione7.760 |
|
FLASH | FLASH - NAND (SLC) | 4G (512M x 8) | Parallel | - | 25ns | 25ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
||
Winbond Electronics |
IC SDRAM 2G DDR3 96WFBGA
|
pacchetto: 96-VFBGA |
Azione7.216 |
|
DRAM | SDRAM - DDR3L | 2Gb (128M x 16) | Parallel | 800MHz | 15ns | 20ns | 1.283V ~ 1.45V | -40°C ~ 105°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |
||
Winbond Electronics |
IC FLASH 8MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 8Mbit | SPI - Quad I/O | 104 MHz | 30µs, 800µs | 6 ns | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Samsung |
SRAM ASYNC SLOW 256K 32Kx8 28-S
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 256Kbit | Parallel | - | 70ns | - | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | - | 28-SOP |
||
Winbond Electronics |
IC FLASH 8MBIT SPI/QUAD 8XSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 8Mbit | SPI - Quad I/O | 104 MHz | - | - | 1.65V ~ 1.95V | -40°C ~ 105°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-XSON (2x3) |
||
Winbond Electronics |
IC DRAM 2GBIT LVSTL 11 200WFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | LVSTL_11 | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Winbond Electronics |
IC FLASH 64MBIT SPI/QUAD 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (8x6) |
||
Winbond Electronics |
1GB LPDDR4X, X16, 1600MHZ, -40C~
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 1Gbit | LVSTL_06 | 1.6 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Microchip Technology |
IC EEPROM 4KBIT I2C 1MHZ 8UDFN
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 4Kbit | I2C | 1 MHz | 5ms | 450 ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 256MBIT PAR 54TSOP II
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 256Mbit | LVTTL | 166 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 4MBIT SPI/QUAD I/O 8SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 4Mbit | SPI - Quad I/O | 104 MHz | - | - | 2.1V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |