Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH NOR
|
pacchetto: - |
Azione3.888 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 1GBIT 333MHZ 134TFBGA
|
pacchetto: 168-VFBGA |
Azione2.064 |
|
DRAM | SDRAM - Mobile LPDDR2-S4 | 1Gb (32M x 32) | Parallel | 333MHz | 15ns | - | 1.14 V ~ 1.95 V | -40°C ~ 105°C (TC) | Surface Mount | 168-VFBGA | 168-VFBGA (12x12) |
||
Cypress Semiconductor Corp |
IC FLASH 512MBIT 110NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione6.944 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Adesto Technologies |
IC FLASH MEM 16MBIT QUAD 8UDFN
|
pacchetto: 8-UDFN Exposed Pad |
Azione3.120 |
|
FLASH | FLASH | 16Mb (2M x 8) | SPI | 100MHz | 7µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 400MHZ 84FBGA
|
pacchetto: 84-TFBGA |
Azione3.136 |
|
DRAM | SDRAM - DDR2 | 1Gb (64M x 16) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (8x12.5) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 166MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione3.280 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Sharp Microelectronics |
IC FLASH 16MBIT 100NS 56SSOP
|
pacchetto: 56-SOP (0.524", 13.30mm) |
Azione10.008 |
|
FLASH | FLASH | 16Mb (2M x 8, 1M x 16) | Parallel | - | 100ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-SOP (0.524", 13.30mm) | 56-SSOP |
||
Microchip Technology |
IC OTP 8MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione4.208 |
|
EPROM | EPROM - OTP | 8Mb (1M x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Intersil |
IC EEPROM 256KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione30.720 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 5ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC EEPROM 256KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.808 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC OTP 512KBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.064 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 90ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione7.024 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 72MBIT 250MHZ 165BGA
|
pacchetto: 165-LBGA |
Azione3.440 |
|
SRAM | SRAM - Synchronous, QUAD | 72Mb (4M x 18) | Parallel | 250MHz | - | 1.8ns | 1.71 V ~ 1.89 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-LFBGA (13x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione6.880 |
|
DRAM | SDRAM | 256Mb (32M x 8) | Parallel | 166MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 2MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione5.328 |
|
SRAM | SRAM - Asynchronous | 2Mb (128K x 16) | Parallel | - | 10ns | 10ns | 3.135 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC SRAM 288KBIT 12NS 100TQFP
|
pacchetto: 100-LQFP |
Azione6.204 |
|
SRAM | SRAM - Dual Port, Synchronous | 288Kb (32K x 9) | Parallel | 50MHz | - | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 12NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione4.992 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Cypress Semiconductor Corp |
IC NVSRAM 1MBIT 25NS 48FBGA
|
pacchetto: 48-TFBGA |
Azione7.920 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (64K x 16) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-FBGA (6x10) |
||
Microchip Technology |
IC EEPROM 1K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.472 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 400kHz | 5ms | 3500ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Macronix |
IC FLASH SERIAL NOR 1GBIT
|
pacchetto: - |
Azione6.560 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM
|
pacchetto: - |
Azione3.552 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM LPDDR4 FBGA
|
pacchetto: - |
Azione3.408 |
|
DRAM | SDRAM - Mobile LPDDR4 | 16Gb (512M x 32) | - | 2.133GHz | - | - | 0.6V, 1.1V | -30°C ~ 85°C | Surface Mount | - | - |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 1Gbit | SPI - Quad I/O, DTR | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Microchip Technology |
1MBIT 3.4MHZ I2C SERIAL EEPROM,
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 1Mbit | I2C | 1 MHz | 5ms | 70 ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TC) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 512MBIT PARALLEL 84TWBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR2 | 512Mbit | Parallel | 400 MHz | 15ns | 400 ps | 1.7V ~ 1.9V | -40°C ~ 105°C (TA) | Surface Mount | 84-TFBGA | 84-TWBGA (8x12.5) |
||
GSI Technology Inc. |
IC SRAM 18MBIT PARALLEL 100TQFP
|
pacchetto: - |
Azione201 |
|
SRAM | SRAM - Synchronous, ZBT | 18Mbit | Parallel | 333 MHz | - | - | 2.3V ~ 2.7V, 3V ~ 3.6V | -40°C ~ 100°C (TJ) | Surface Mount | 100-LQFP | 100-TQFP (20x14) |
||
Micron Technology Inc. |
LPDDR5 Y42M
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC FLASH 1GBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 1Gbit | SPI - Quad I/O, QPI, DTR | 166 MHz | 700µs | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |