Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 55NS 32TSOP
|
pacchetto: 32-SOIC (0.400", 10.16mm Width) |
Azione5.392 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 55ns | 55ns | 1.65 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.400", 10.16mm Width) | 32-TSOP II |
||
Micron Technology Inc. |
IC SDRAM 4GBIT 800MHZ 96FBGA
|
pacchetto: 96-TFBGA |
Azione7.888 |
|
DRAM | SDRAM - DDR3L | 4Gb (256M x 16) | Parallel | 800MHz | - | 13.75ns | 1.283 V ~ 1.45 V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (9x14) |
||
Micron Technology Inc. |
IC FLASH 512GBIT 83MHZ 100LBGA
|
pacchetto: - |
Azione4.464 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 6GBIT 137VFBGA
|
pacchetto: 137-VFBGA |
Azione7.808 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 4Gb (256M x 16)(NAND), 2Gb (128M x 16)(LPDRAM) | Parallel | 200MHz | - | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TA) | Surface Mount | 137-VFBGA | 137-VFBGA (13x10.5) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 2MBIT 5NS 100TQFP
|
pacchetto: 100-LQFP |
Azione6.272 |
|
SRAM | SRAM - Synchronous | 2Mb (64K x 32) | Parallel | 100MHz | - | 5ns | 3.135 V ~ 3.63 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 512MBIT 133MHZ 90BGA
|
pacchetto: 90-LFBGA |
Azione4.896 |
|
DRAM | SDRAM | 512Mb (16M x 32) | Parallel | 133MHz | - | 6ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 90-LFBGA | 90-LFBGA (8x13) |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 266MHZ 84FBGA
|
pacchetto: 84-TFBGA |
Azione6.256 |
|
DRAM | SDRAM - DDR2 | 512Mb (32M x 16) | Parallel | 267MHz | 15ns | 500ps | 1.7 V ~ 1.9 V | -40°C ~ 95°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (12x12.5) |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.632 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 200µs | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 512KBIT 150NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.664 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 150ns | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28FLATPK
|
pacchetto: 28-CFlatPack |
Azione3.312 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 7.5NS 128TQFP
|
pacchetto: 128-LQFP |
Azione3.392 |
|
SRAM | SRAM - Dual Port, Synchronous | 256Kb (16K x 16) | Parallel | - | - | 7.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 17NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione6.768 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 17ns | 17ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Cypress Semiconductor Corp |
IC SRAM 16MBIT 10NS 48BGA
|
pacchetto: 48-VFBGA |
Azione3.056 |
|
SRAM | SRAM - Asynchronous | 16Mb (2M x 8) | Parallel | - | 10ns | 10ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-VFBGA (6x8) |
||
Cypress Semiconductor Corp |
MICROPOWER SRAMS
|
pacchetto: - |
Azione6.768 |
|
SRAM | SRAM - Asynchronous | 16Mb (2M x 8, 1M x 16) | Parallel | - | 55ns | 55ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 200MHZ 119BGA
|
pacchetto: 119-BGA |
Azione7.392 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 200MHz | - | 3.1ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Cypress Semiconductor Corp |
IC FLASH 512MBIT 110NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione6.112 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 60ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 400MHZ 60FBGA
|
pacchetto: 60-TFBGA |
Azione3.984 |
|
DRAM | SDRAM - DDR2 | 1Gb (128M x 8) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | -40°C ~ 105°C (TC) | Surface Mount | 60-TFBGA | 60-FBGA (8x10) |
||
ISSI, Integrated Silicon Solution Inc |
IC PSRAM 8MBIT 70NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione4.720 |
|
PSRAM | PSRAM (Pseudo SRAM) | 8Mb (512K x 16) | Parallel | - | 70ns | 70ns | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
ON Semiconductor |
IC EEPROM 64KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione36.000 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 4KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.744 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Alliance Memory, Inc. |
IC SDRAM 64MBIT 166MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione16.332 |
|
DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 166MHz | 2ns | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 32K I2C 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.328 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Winbond Electronics |
IC FLASH 2MBIT SPI/QUAD 8WLCSP
|
pacchetto: - |
Azione6.555 |
|
FLASH | FLASH - NOR | 2Mbit | SPI - Quad I/O | 104 MHz | 30µs, 800µs | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFBGA, WLCSP | 8-WLCSP (1.4x1.34) |
||
ISSI, Integrated Silicon Solution Inc |
2Mb, Low Power/Power Saver,Async
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 2Mbit | Parallel | - | 45ns | 45 ns | 2.2V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 36-TFBGA | 36-TFBGA (6x8) |
||
Renesas Electronics Corporation |
IC RAM DUAL PORT
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kbit | Parallel | - | 12ns | 12 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
BYTe Semiconductor |
16 MBIT, 3.0V (2.7V TO 3.6V), -4
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 16Mbit | SPI - Quad I/O, QPI | 108 MHz | 50µs, 2.4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
Cypress Semiconductor Corp |
IC EPROM 64KBIT PARALLEL
|
pacchetto: - |
Request a Quote |
|
EPROM | EPROM - UV | 64Kbit | Parallel | - | - | 45 ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TA) | - | - | - |
||
Winbond Electronics |
IC DRAM 4GBIT LVSTL 11 200WFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 4Gbit | LVSTL_11 | 1.866 GHz | 18ns | - | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |