Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.200 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
STMicroelectronics |
IC EEPROM 64KBIT 2MHZ 8MLP
|
pacchetto: 8-UFDFN Exposed Pad |
Azione5.056 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-MLP (2x3) |
||
Micron Technology Inc. |
IC FLASH 4MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.136 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8, 256K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.408 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 55ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Maxim Integrated |
IC NVSRAM 1MBIT 150NS 32EDIP
|
pacchetto: 32-DIP Module (0.600", 15.24mm) |
Azione5.040 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | Parallel | - | 150ns | 150ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Through Hole | 32-DIP Module (0.600", 15.24mm) | 32-EDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 166MHZ 208QFP
|
pacchetto: 208-BFQFP |
Azione5.664 |
|
SRAM | SRAM - Dual Port, Synchronous | 4.5Mb (128K x 36) | Parallel | 166MHz | - | 3.6ns | 2.4 V ~ 2.6 V | 0°C ~ 70°C (TA) | Surface Mount | 208-BFQFP | 208-PQFP (28x28) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 2.25MBIT 12NS 128TQFP
|
pacchetto: 128-LQFP |
Azione5.424 |
|
SRAM | SRAM - Dual Port, Asynchronous | 2.25Mb (128K x 18) | Parallel | - | 12ns | 12ns | 3.15 V ~ 3.45 V | 0°C ~ 70°C (TA) | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 25NS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione5.824 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (64K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
Micron Technology Inc. |
IC SDRAM 24GBIT 933MHZ 168WFBGA
|
pacchetto: - |
Azione3.120 |
|
DRAM | SDRAM - Mobile LPDDR3 | 24Gb (768M x 32) | - | 933MHz | - | - | 1.2V | -30°C ~ 85°C (TC) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 55NS 64TQFP
|
pacchetto: 64-LQFP |
Azione7.872 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Microchip Technology |
IC EEPROM 4KBIT 1MHZ 8VFBGA
|
pacchetto: 8-VFBGA |
Azione3.104 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-VFBGA | 8-VFBGA (1.5x2) |
||
Rohm Semiconductor |
IC EEPROM 2KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione27.492 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 128BIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.384 |
|
EEPROM | EEPROM | 128b (16 x 8) | I2C | 400kHz | 4ms | 3500ns | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 32MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione6.704 |
|
FLASH | FLASH | 32Mb (2M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione478.248 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC 256 MB FLASH MEMORY
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.040 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
IC FLASH 32M PARALLEL 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione7.360 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512K PARALLEL 100TQFP
|
pacchetto: 100-LQFP |
Azione7.456 |
|
SRAM | SRAM - Dual Port, Asynchronous | 512Kb (32K x 16) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Winbond Electronics |
IC DRAM 1GBIT SSTL 18 60WBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR2 | 1Gbit | SSTL_18 | 400 MHz | 15ns | 57.5 ns | 1.7V ~ 1.9V | -40°C ~ 95°C (TC) | Surface Mount | 60-TFBGA | 60-WBGA (8x9.5) |
||
Harris Corporation |
IC SRAM 16KBIT PARALLEL 24CERDIP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous | 16Kbit | Parallel | - | 170ns | 120 ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TA) | Through Hole | 24-CDIP (0.600", 15.24mm) | 24-CERDIP |
||
Fairchild Semiconductor |
IC EEPROM 16KBIT MICROWIRE 8DIP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 16Kbit | Microwire | 1 MHz | 10ms | - | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
ISSI, Integrated Silicon Solution Inc |
16Mb,High-Speed,Async,1Mbx16, 10
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 16Mbit | Parallel | - | 10ns | 10 ns | 1.65V ~ 2.2V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Cypress Semiconductor Corp |
IC SRAM 9MBIT PARALLEL 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, SDR | 9Mbit | Parallel | 133 MHz | - | 3.6 ns | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Renesas Electronics Corporation |
MEMORY SRAM 8M
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR4 4G 128MX32 FBGA DDP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 4GBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND | 4Gbit | SPI - Quad I/O | 120 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
64Mb QPI/QPI/QSPI, 8-pin WSON 5X
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 64Mbit | SPI - Quad I/O, QPI, DTR | 166 MHz | 40µs, 800µs | - | 2.3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
ISSI, Integrated Silicon Solution Inc |
512M, 2.5V, DDR, 64Mx8, 166MHz,
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR | 512Mbit | SSTL_2 | 167 MHz | 15ns | 700 ps | 2.3V ~ 2.7V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |