Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC MEM FLASH NOR
|
pacchetto: - |
Azione6.288 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC PSRAM 16MBIT 60NS 48BGA
|
pacchetto: 48-TFBGA |
Azione50.520 |
|
PSRAM | PSRAM (Pseudo SRAM) | 16Mb (1M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 32MBIT 104MHZ 8VSOP
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione2.912 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI | 104MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-VSOP |
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IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 133MHZ 119BGA
|
pacchetto: 119-BGA |
Azione5.568 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 133MHz | - | 4.2ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Micron Technology Inc. |
IC FLASH 32GBIT 153WFBGA
|
pacchetto: 153-WFBGA |
Azione6.032 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | Surface Mount | 153-WFBGA | 153-WFBGA (11.5x13) |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 2GBIT 137TFBGA
|
pacchetto: 137-TFBGA |
Azione2.048 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 1Gb (128M x 8)(NAND), 1Gb (32M x 32)(LPDRAM) | Parallel | 166MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 137-TFBGA | 137-TFBGA (10.5x13) |
||
STMicroelectronics |
IC EEPROM 2KBIT 400KHZ 8UFDFPN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione56.376 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UFDFPN (2x3) |
||
Microchip Technology |
IC EEPROM 64KBIT 120NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione7.680 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 167MHZ 60FBGA
|
pacchetto: 60-FBGA |
Azione2.064 |
|
DRAM | SDRAM - DDR | 256Mb (16M x 16) | Parallel | 167MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 60-FBGA | 60-FBGA (8x14) |
||
Microchip Technology |
IC FLASH 2MBIT 90NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.600 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 2GBIT 667MHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione4.928 |
|
DRAM | SDRAM - DDR3 | 2Gb (128M x 16) | Parallel | 667MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Rohm Semiconductor |
IC EEPROM 1KBIT 100KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.704 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 100kHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
ON Semiconductor |
IC EEPROM 2KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.952 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Alliance Memory, Inc. |
IC SDRAM 128MBIT 166MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione6.384 |
|
DRAM | SDRAM | 128Mb (8M x 16) | Parallel | 166MHz | 12ns | 5ns | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 256K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.832 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Cypress Semiconductor Corp |
IC FLASH 16M PARALLEL 48FBGA
|
pacchetto: 48-VFBGA |
Azione6.768 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8, 1M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFBGA | 48-FBGA (8.15x6.15) |
||
Cypress Semiconductor Corp |
IC FLASH 256M SPI 133MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione5.888 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-BGA (6x8) |
||
Alliance Memory, Inc. |
IC DRAM 4G PARALLEL 134FBGA
|
pacchetto: 134-VFBGA |
Azione5.616 |
|
DRAM | SDRAM - Mobile LPDDR2 | 4Gb (128M x 32) | Parallel | 533MHz | 15ns | - | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-FBGA (10x11.5) |
||
Cypress Semiconductor Corp |
IC SRAM
|
pacchetto: - |
Azione3.424 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 256MBIT SPI 24TPBGA
|
pacchetto: - |
Azione5.787 |
|
FLASH | FLASH - NOR | 256Mbit | SPI - Quad I/O | 166 MHz | 1.8ms | 5 ns | 1.7V ~ 2V | -40°C ~ 125°C (TA) | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |
||
Micron Technology Inc. |
LPDDR4 12GBIT 16 200/264 TFBGA 1
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR5 BGA Y42M
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 4GBIT PARALLEL 96TWBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3 | 4Gbit | Parallel | 800 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Insignis Technology Corporation |
LPDDR4 4GB X32 3200MHZ CL22 10X1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 4Gbit | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 0°C ~ 85°C (TC) | Surface Mount | 200-WFBGA | 200-FBGA (10x14.5) |
||
Fujitsu Semiconductor Memory Solution |
IC FRAM 1MBIT SPI 40MHZ 8DFN
|
pacchetto: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 1Mbit | SPI | 40 MHz | - | - | 1.8V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (5x6) |
||
Cypress Semiconductor Corp |
SRAM CHIP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 8MBIT SPI/QUAD I/O 8SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 8Mbit | SPI - Quad I/O | 120 MHz | 50µs, 2.4ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |