Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC SRAM 1MBIT 45NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione5.088 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 45ns | 45ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 90FBGA
|
pacchetto: 90-TFBGA |
Azione5.888 |
|
DRAM | SDRAM | 256Mb (8M x 32) | Parallel | 166MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 143MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione3.968 |
|
DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 133MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione3.280 |
|
DRAM | SDRAM | 256Mb (32M x 8) | Parallel | 133MHz | 15ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Micron Technology Inc. |
IC FLASH 8MBIT 90NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione6.704 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8, 512K x 16) | Parallel | - | 90ns | 90ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 44CLCC
|
pacchetto: 44-CLCC |
Azione5.088 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
||
Maxim Integrated |
IC NVSRAM 2MBIT 85NS 32EDIP
|
pacchetto: 32-DIP Module (0.600", 15.24mm) |
Azione4.096 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 2Mb (256K x 8) | Parallel | - | 85ns | 85ns | 4.75 V ~ 5.25 V | 0°C ~ 70°C (TA) | Through Hole | 32-DIP Module (0.600", 15.24mm) | 32-EDIP |
||
Microchip Technology |
IC OTP 512KBIT 70NS 28SOIC
|
pacchetto: 28-SOIC (0.342", 8.69mm Width) |
Azione5.392 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.342", 8.69mm Width) | 28-SOIC |
||
Intersil |
IC EEPROM 64KBIT 120NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione22.152 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 5ms | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 633MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione7.232 |
|
SRAM | SRAM - Synchronous, DDR II+ | 36Mb (2M x 18) | Parallel | 633MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 15NS 64TQFP
|
pacchetto: 64-LQFP |
Azione7.152 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 1GBIT 933MHZ 78BGA
|
pacchetto: 78-TFBGA |
Azione6.464 |
|
DRAM | SDRAM - DDR3L | 1Gb (128M x 8) | Parallel | 933MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-TWBGA (8x10.5) |
||
Winbond Electronics |
IC SDRAM 128MBIT 250MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione4.768 |
|
DRAM | SDRAM - DDR | 128Mb (8M x 16) | Parallel | 250MHz | 12ns | 48ns | 2.4 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
||
Microchip Technology |
IC FLASH 8MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione6.784 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Macronix |
IC FLASH 2MBIT 80MHZ 8SOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.024 |
|
FLASH | FLASH - NOR | 2Mb (256K x 8) | SPI | 80MHz | 30µs, 3ms | - | 1.65 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC EEPROM 8KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.720 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Adesto Technologies |
IC FLASH 512KBIT 85MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.480 |
|
FLASH | FLASH | 512Kb (64K x 8) | SPI | 104MHz | 8µs, 1.75ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC FLASH 128MBIT 133MHZ 16SO
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.344 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC FLASH 64MBIT 104MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.288 |
|
FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Macronix |
IC FLASH 64MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione6.320 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Cypress Semiconductor Corp |
IC FLASH 512M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione2.100 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 60ns | 110ns | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-Fortified BGA (13x11) |
||
Micron Technology Inc. |
IC DRAM 32G 2133MHZ FBGA
|
pacchetto: - |
Azione7.520 |
|
DRAM | SDRAM - Mobile LPDDR4 | 32Gb (1G x 32) | - | 2133MHz | - | - | 1.1V | -40°C ~ 125°C (TC) | - | - | - |
||
Swissbit |
IC FLASH 2TBIT EMMC 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND | 2Tbit | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 153-TFBGA | 153-BGA (11.5x13) |
||
Insignis Technology Corporation |
DDR3L 4GB X16 FBGA 7.5X13.5(X1.2
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 1.066 GHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (7.5x13.5) |
||
Rohm Semiconductor |
IC EEPROM 16KBIT I2C 1MHZ 8TSSOP
|
pacchetto: - |
Azione9.000 |
|
EEPROM | EEPROM | 16Kbit | I2C | 1 MHz | 3.5ms | - | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 4MBIT SPI/QUAD I/O 8SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 4Mbit | SPI - Quad I/O | 104 MHz | - | - | 2.1V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 32MBIT SPI/QUAD 8SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 32Mbit | SPI - Quad I/O, QPI | 133 MHz | 60µs, 2.4ms | 6 ns | 1.65V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 64MBIT SPI/QUAD 8VSOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O | 120 MHz | 2.4ms | - | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-VSOP |