Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC SARAM 128KBIT 25NS 84PGA
|
pacchetto: 84-BPGA |
Azione2.176 |
|
RAM | SARAM | 128Kb (8K x 16) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 84-BPGA | 84-PGA (27.94x27.94) |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione4.896 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 45NS 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione2.928 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.816 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 70NS 32DIP
|
pacchetto: 32-DIP (0.600", 15.24mm) |
Azione4.336 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 32-DIP (0.600", 15.24mm) | 32-DIP |
||
Texas Instruments |
IC NVSRAM 4MBIT 70NS 32DIP
|
pacchetto: 32-DIP Module (0.61", 15.49mm) |
Azione4.400 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mb (512K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 32-DIP Module (0.61", 15.49mm) | 32-DIP Module (18.42x42.8) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1.125MBIT 5NS 208CABGA
|
pacchetto: 208-LFBGA |
Azione5.280 |
|
SRAM | SRAM - Dual Port, Synchronous | 1.125Mb (64K x 18) | Parallel | - | - | 5ns | 3.15 V ~ 3.45 V | 0°C ~ 70°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 12NS 100TQFP
|
pacchetto: 100-LQFP |
Azione3.472 |
|
SRAM | SRAM - Dual Port, Synchronous | 512Kb (64K x 8) | Parallel | - | - | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 72KBIT 20NS 100TQFP
|
pacchetto: 100-LQFP |
Azione6.736 |
|
SRAM | SRAM - Dual Port, Asynchronous | 72Kb (4K x 18) | Parallel | - | 20ns | 20ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 32KBIT 35NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione3.504 |
|
SRAM | SRAM - Dual Port, Asynchronous | 32Kb (4K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.320 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
SII Semiconductor Corporation |
IC EEPROM 8KBIT 1MHZ 8MSOP
|
pacchetto: 8-WSSOP, 8-MSOP (0.110", 2.80mm Width) |
Azione4.848 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 1MHz | 5ms | 500ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-TMSOP |
||
ON Semiconductor |
IC EEPROM 256KBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione46.644 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Rohm Semiconductor |
IC EEPROM 512KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione16.644 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I2C | 1MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP-T |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione264.000 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 2MHz | 6ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC FLASH 512G MMC
|
pacchetto: - |
Azione2.064 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | MMC | - | - | - | - | -25°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 1G PARALLEL 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione2.544 |
|
FLASH | FLASH - NOR | 1Gb (64M x 16) | Parallel | - | 60ns | 120ns | 1.65 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Rohm Semiconductor |
I2C BUS 32KBIT(4096X8BIT) EEPROM
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione7.104 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Micron Technology Inc. |
LPDDR4 4G DIE 128MX32
|
pacchetto: - |
Azione7.200 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Fairchild Semiconductor |
IC EEPROM 16KBIT I2C 8SOIC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 16Kbit | I2C | 100 kHz | 15ms | 3.5 µs | 2.7V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Winbond Electronics |
IC FLASH 256MBIT SPI 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 256Mbit | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Etron Technology, Inc. |
IC DRAM 256MBIT PAR 66TSOP II
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR | 256Mbit | Parallel | 250 MHz | 15ns | 700 ps | 2.3V ~ 2.7V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
||
Renesas Electronics Corporation |
IC RAM
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Quad Port, Asynchronous | 16Kbit | Parallel | - | 20ns | 20 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 120-LQFP | 120-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 64MBIT PAR 90TFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 64Mbit | LVTTL | 143 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Texas Instruments |
DUAL MARKED (5962-887400ILA)
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC FLASH 512MBIT SPI/QUAD 16SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | SPI - Quad I/O, QPI | 166 MHz | - | - | 1.7V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Winbond Electronics |
2GB DDR3L 1.35V SDRAM, X16, 1066
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 2Gbit | Parallel | 1.067 GHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |
||
Intelligent Memory Ltd. |
DDR3 8GB, 1.35V/1.5V, 1GX8 (1CS)
|
pacchetto: - |
Azione150 |
|
DRAM | SDRAM - DDR3L | 8Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 78-TFBGA | 78-FBGA (9x10.6) |