Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH/LPDRAM 1.5GBIT 137TFBGA
|
pacchetto: 137-TFBGA |
Azione2.384 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 1Gb (128M x 8)(NAND), 512Mb (16M x 32)(LPDRAM) | Parallel | 166MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 137-TFBGA | 137-TFBGA (10.5x13) |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.080 |
|
EEPROM | EEPROM | 8Kb (512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Micron Technology Inc. |
IC FLASH 128GBIT 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione18.336 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Microchip Technology |
IC FLASH 16MBIT 90NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione4.992 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 40µs | 90ns | 1.65 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione2.496 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 86TSOP
|
pacchetto: 86-TFSOP (0.400", 10.16mm Width) |
Azione15.216 |
|
DRAM | SDRAM | 256Mb (8M x 32) | Parallel | 166MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 86-TFSOP (0.400", 10.16mm Width) | 86-TSOP II |
||
Microchip Technology |
IC FLASH 4MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione6.304 |
|
FLASH | FLASH | 4Mb (512K x 8) | Parallel | - | 40µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 133MHZ 208FBGA
|
pacchetto: 208-LFBGA |
Azione5.104 |
|
SRAM | SRAM - Dual Port, Synchronous | 9Mb (512K x 18) | Parallel | 133MHz | - | 4.2ns | 2.4 V ~ 2.6 V | -40°C ~ 85°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 133MHZ 208CABGA
|
pacchetto: 208-LFBGA |
Azione6.960 |
|
SRAM | SRAM - Dual Port, Synchronous | 4.5Mb (128K x 36) | Parallel | 133MHz | - | 4.2ns | 2.4 V ~ 2.6 V | -40°C ~ 85°C (TA) | Surface Mount | 208-LFBGA | 208-CABGA (15x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 20NS 84PLCC
|
pacchetto: 84-LCC (J-Lead) |
Azione5.216 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (16K x 16) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 84-LCC (J-Lead) | 84-PLCC (29.21x29.21) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 35NS 100TQFP
|
pacchetto: 100-LQFP |
Azione5.376 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (4K x 16) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
LPDDR4 8G 256MX32 FBGA
|
pacchetto: - |
Azione7.472 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 120NS 24CDIP
|
pacchetto: 24-CDIP (0.300", 7.62mm) |
Azione3.264 |
|
SRAM | SRAM - Asynchronous | 16Kb (2K x 8) | Parallel | - | 120ns | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 24-CDIP (0.300", 7.62mm) | 24-CDIP |
||
Macronix |
IC FLASH 4MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione5.840 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFBGA, CSPBGA | 48-TFBGA, CSP (6x8) |
||
Microchip Technology |
IC EEPROM 4KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione16.404 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 10ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Rohm Semiconductor |
IC EEPROM 8KBIT 100KHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.976 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 100kHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 10MHZ 8DFN
|
pacchetto: 8-VDFN Exposed Pad |
Azione6.080 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 10MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Adesto Technologies |
IC FLASH 2MBIT 66MHZ 8UDFN
|
pacchetto: 8-UDFN Exposed Pad |
Azione4.944 |
|
FLASH | FLASH | 2Mb (264 Bytes x 1024 pages) | SPI | 66MHz | 4ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
||
Adesto Technologies |
IC EEPROM 512KBIT 20MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.136 |
|
EEPROM | EEPROM | 512kb (128B Page Size) | SPI | 20MHz | 100µs, 5ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Adesto Technologies |
IC FLASH 32MBIT 9BGA
|
pacchetto: 9-UBGA |
Azione6.256 |
|
FLASH | FLASH | 32Mb (528 Bytes x 8192 pages) | SPI | 104MHz | 8µs, 4ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 9-UBGA | 9-UBGA (6x6) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 3M PARALLEL 119PBGA
|
pacchetto: 119-BGA |
Azione4.224 |
|
SRAM | SRAM - Asynchronous | 3Mb (128K x 24) | Parallel | - | 8ns | 8ns | 3.135 V ~ 3.63 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 2M PARALLEL 48TFBGA
|
pacchetto: 48-TFBGA |
Azione2.016 |
|
SRAM | SRAM - Asynchronous | 2Mb (128K x 16) | Parallel | - | 55ns | 70ns | 1.65 V ~ 2.2 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Micron Technology Inc. |
DDR5 32GB SOEDIMM
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC PSRAM 128MBIT SPI/OCTL 24FBGA
|
pacchetto: - |
Request a Quote |
|
PSRAM | PSRAM (Pseudo SRAM) | 128Mbit | SPI - Octal I/O | 200 MHz | 35ns | 35 ns | 1.7V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (6x8) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 2MBIT SPI/DUAL 8USON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 2Mbit | SPI - Dual I/O | 100 MHz | 97µs, 6ms | 12 ns | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-USON (1.5x1.5) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLSH 512MBIT SPI/QUAD 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | SPI - Quad I/O, QPI, DTR | 200 MHz | - | - | 1.65V ~ 2V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 2MBIT SPI/QUAD 8USON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 2Mbit | SPI - Quad I/O | 80 MHz | 60µs, 4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-USON (3x2) |
||
Winbond Electronics |
IC FLASH 2GBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 2Gbit | SPI - Quad I/O, QPI, DTR | 166 MHz | 700µs | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |