Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics |
IC FLASH 128MBIT 104MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.088 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 45NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione6.560 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-DIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8NS 165CABGA
|
pacchetto: 165-TBGA |
Azione2.480 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | - | - | 8ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 250MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione7.216 |
|
SRAM | SRAM - Synchronous, QDR II | 36Mb (4M x 9) | Parallel | 250MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Micron Technology Inc. |
IC FLASH 128MBIT 120NS 64FBGA
|
pacchetto: 64-FBGA |
Azione7.328 |
|
FLASH | FLASH | 128Mb (16M x 8, 8M x 16) | Parallel | - | - | 120ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-FBGA | 64-FBGA (10x13) |
||
Microchip Technology |
IC FLASH 2MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.024 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 20NS 28CDIP
|
pacchetto: 28-CDIP (0.600", 15.24mm) |
Azione2.304 |
|
SRAM | SRAM - Asynchronous | 64Kb (8K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CerDip |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 55NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione2.800 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 55ns | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Alliance Memory, Inc. |
IC SRAM 1MBIT 15NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione5.360 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Rohm Semiconductor |
IC EEPROM 32KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.064 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Maxim Integrated |
IC NVSRAM 256KBIT 70NS 34PCM
|
pacchetto: 34-PowerCap? Module |
Azione3.984 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 70ns | 70ns | 4.75 V ~ 5.25 V | -40°C ~ 85°C (TA) | Surface Mount | 34-PowerCap? Module | 34-PowerCap Module |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione5.888 |
|
DRAM | SDRAM - DDR | 256Mb (16M x 16) | Parallel | 166MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
||
Alliance Memory, Inc. |
IC SRAM 1MBIT 12NS 32SOJ
|
pacchetto: 32-BSOJ (0.300", 7.62mm Width) |
Azione9.768 |
|
SRAM | SRAM - Asynchronous | 1Mb (128K x 8) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 32-BSOJ (0.300", 7.62mm Width) | 32-SOJ |
||
Micron Technology Inc. |
IC DRAM 12G 1866MHZ
|
pacchetto: - |
Azione7.664 |
|
DRAM | SDRAM - Mobile LPDDR4 | 12Gb (384M x 32) | - | 1866MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 16M PARALLEL 80PQFP
|
pacchetto: 80-BQFP |
Azione6.240 |
|
FLASH | FLASH - NOR | 16Mb (512K x 32) | Parallel | 66MHz | 60ns | 54ns | 1.65 V ~ 2.75 V | -40°C ~ 125°C (TA) | Surface Mount | 80-BQFP | 80-PQFP (20x20) |
||
Microchip Technology |
128 KBIT I2C SERIAL EEPROM WITH
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.832 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 1G PARALLEL 60TWBGA
|
pacchetto: 60-TFBGA |
Azione4.896 |
|
DRAM | SDRAM - DDR2 | 1Gb (128M x 8) | Parallel | 333MHz | 15ns | 450ps | 1.7 V ~ 1.9 V | -40°C ~ 105°C | Surface Mount | 60-TFBGA | 60-TWBGA (8x10.5) |
||
Micron Technology Inc. |
IC FLASH 512G MMC
|
pacchetto: - |
Azione3.392 |
|
FLASH | FLASH - NAND | 512Gb (64G x 8) | MMC | - | - | - | - | -40°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 512MBIT PARALLEL
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 512Mbit | Parallel | - | - | 100 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | - | - |
||
Renesas Electronics Corporation |
IC SRAM
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
Automotive (Tc: -40 to +105C), 1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3 | 1Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Flexxon Pte Ltd |
IC FLASH 64GBIT EMMC 153FBGA
|
pacchetto: - |
Azione123 |
|
FLASH | FLASH - NAND (pSLC) | 64Gbit | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 153-VFBGA | 153-FBGA (11.5x13) |
||
GSI Technology Inc. |
IC SRAM 36MBIT PARALLEL 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, Standard | 36Mbit | Parallel | 250 MHz | - | - | 2.3V ~ 2.7V, 3V ~ 3.6V | -40°C ~ 100°C (TJ) | Surface Mount | 100-LQFP | 100-TQFP (20x14) |
||
Winbond Electronics |
IC FLASH 256MBIT 104MHZ 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND | 256Mbit | - | 104 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 85°C | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
||
Microchip Technology |
IC EEPROM 8KBIT I2C 1MHZ SOT23-5
|
pacchetto: - |
Azione7.371 |
|
EEPROM | EEPROM | 8Kbit | I2C | 1 MHz | 5ms | 450 ns | 1.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Rohm Semiconductor |
32KBIT, IC BUS, HIGH ENDURANCE,
|
pacchetto: - |
Azione7.425 |
|
EEPROM | EEPROM | 32Kbit | I2C | 1 MHz | 5ms | - | 1.6V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP-J |
||
Infineon Technologies |
IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 4GBIT HSUL 12 168VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4 | 4Gbit | HSUL_12 | 533 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 0°C ~ 85°C (TC) | Surface Mount | 168-VFBGA | 168-VFBGA (12x12) |