Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC SRAM 16KBIT 100NS 24DIP
|
pacchetto: 24-DIP Module (0.600", 15.24mm) |
Azione21.696 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 16Kb (2K x 8) | Parallel | - | 100ns | 100ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 24-DIP Module (0.600", 15.24mm) | 24-EDIP |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 200MHZ 66TSOP
|
pacchetto: 66-TSSOP (0.400", 10.16mm Width) |
Azione6.128 |
|
DRAM | SDRAM - DDR | 512Mb (64M x 8) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione2.928 |
|
EEPROM | EEPROM | 8Kb (512 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Maxim Integrated |
IC NVSRAM 256KBIT 100NS 256BGA
|
pacchetto: 256-BGA |
Azione7.952 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 100ns | 100ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Cypress Semiconductor Corp |
IC SRAM 64KBIT 20NS 28DIP
|
pacchetto: 28-DIP (0.300", 7.62mm) |
Azione5.168 |
|
SRAM | SRAM - Asynchronous | 64Kb (8K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 16KBIT 250NS 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione2.256 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 3ms | 250ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28CPGA
|
pacchetto: 28-BCPGA |
Azione5.856 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 20NS 64TQFP
|
pacchetto: 64-LQFP |
Azione5.264 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 143MHZ 90BGA
|
pacchetto: 90-TFBGA |
Azione3.168 |
|
DRAM | SDRAM | 64Mb (2M x 32) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 12NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione6.144 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
NXP |
IC EEPROM 4KBIT 100KHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.624 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 100kHz | - | - | 2.5 V ~ 6.0 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC EEPROM 4KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.312 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC FLASH 512MBIT 110NS 64BGA
|
pacchetto: 64-LBGA |
Azione6.036 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 60ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
STMicroelectronics |
IC EEPROM 4KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione78.660 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 256KBIT 45NS 28SOP
|
pacchetto: 28-SOIC (0.330", 8.38mm Width) |
Azione13.872 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.330", 8.38mm Width) | 28-SOP |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione233.496 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Rohm Semiconductor |
IC EEPROM 32K SPI 10MHZ 8TSSOPB
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione29.496 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 10MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
Cypress Semiconductor Corp |
IC FLASH 128M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione2.240 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | Parallel | - | 90ns | 90ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Cypress Semiconductor Corp |
IC 64 MB FLASH MEMORY
|
pacchetto: 24-TBGA |
Azione2.432 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Micron Technology Inc. |
MASSFLASH/CONTROLLER 512G
|
pacchetto: - |
Azione5.552 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Alliance Memory, Inc. |
IC DRAM 4G PARALLEL 78FBGA
|
pacchetto: 78-VFBGA |
Azione4.880 |
|
DRAM | SDRAM - DDR3L | 4Gb (512M x 8) | Parallel | 800MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-FBGA (10.5x9) |
||
STMicroelectronics |
IC EEPROM 256KBIT 20MHZ 8UFDFPN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione6.416 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 20MHz | 4ms | - | 1.8V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-MLP (2x3) |
||
Infineon Technologies |
IC FLASH 128MBIT PARALLEL
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | Parallel | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
EMMC 512G LBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC RAM
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM | 128Kbit | Parallel | 40 MHz | 20ns | 20 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Rochester Electronics, LLC |
4,096-BIT (512X8) BIPOLAR PROM
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Quality Semiconductor |
MULTI-PORT SRAM, 4KX16, 35NS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ProLabs |
HP P06192-001 Compatible Factory
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |