Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
NAND FLASH
|
pacchetto: - |
Azione2.912 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 2.5G
|
pacchetto: - |
Azione19.104 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 256MBIT 70NS 64TBGA
|
pacchetto: 64-TBGA |
Azione7.136 |
|
FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | 52MHz | 70ns | 70ns | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TBGA | 64-TBGA (10x13) |
||
Winbond Electronics |
IC FLASH 128MBIT 90NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione5.184 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 133MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione5.728 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 133MHz | - | 4.2ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
IC EEPROM 1MBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.616 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 9MBIT 166MHZ 119BGA
|
pacchetto: 119-BGA |
Azione7.504 |
|
SRAM | SRAM - Synchronous | 9Mb (256K x 36) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
NXP |
IC EEPROM 16KBIT 400KHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.128 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | - | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Sharp Microelectronics |
IC SRAM 16KBIT 100NS 24DIP
|
pacchetto: 24-DIP (0.600", 15.24mm) |
Azione4.368 |
|
SRAM | SRAM | 16Kb (2K x 8) | Parallel | - | 100ns | 100ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-DIP |
||
Cypress Semiconductor Corp |
IC SRAM 16MBIT 10NS 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione120.000 |
|
SRAM | SRAM - Asynchronous | 16Mb (2M x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
IDT, Integrated Device Technology Inc |
IC SRAM 64KBIT 35NS 100TQFP
|
pacchetto: 100-LQFP |
Azione7.696 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (4K x 16) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 1GBIT 166MHZ 90BGA
|
pacchetto: 90-LFBGA |
Azione2.224 |
|
DRAM | SDRAM - Mobile DDR | 64Mb (2M x 32) | Parallel | 166MHz | 15ns | 5.5ns | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 90-LFBGA | 90-LFBGA (8x13) |
||
Microchip Technology |
IC EEPROM 128KBIT 10MHZ 8SOIJ
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione4.112 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Microchip Technology |
IC EEPROM 32KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione1.376.220 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.008 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 5MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.488 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Macronix |
IC FLASH 8MBIT 104MHZ 8SOP
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione21.168 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 104MHz | 30µs, 3ms | - | 1.65 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Micron Technology Inc. |
IC FLASH 64G MMC
|
pacchetto: 100-LBGA |
Azione7.904 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 100-LBGA | 100-LBGA (14x18) |
||
Cypress Semiconductor Corp |
IC FLASH 16G PARALLEL 63BGA
|
pacchetto: 63-VFBGA |
Azione2.528 |
|
FLASH | FLASH - NAND | 16Gb (4G x 4) | Parallel | - | 45ns | 45ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-BGA (11x9) |
||
Cypress Semiconductor Corp |
IC FLASH 64M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione3.744 |
|
FLASH | FLASH - NOR | 64Mb (4M x 16) | Parallel | - | 60ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
Micron Technology Inc. |
IC FLASH 8GB NAND
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 16MBIT SPI/QUAD 8SOP
|
pacchetto: - |
Azione57.036 |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 133 MHz | 70µs, 2ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
National Semiconductor |
OTP ROM, 1KX8, 55NS, TTL, CQCC28
|
pacchetto: - |
Request a Quote |
|
PROM | - | 8Kbit | Parallel | - | - | 55 ns | 4.75V ~ 5.25V | -55°C ~ 125°C (TC) | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.43x11.43) |
||
Winbond Electronics |
IC FLASH 512MBIT SPI/QUAD 16SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 512Mbit | SPI - Quad I/O | 166 MHz | 700µs | 6 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
ABLIC Inc. |
IC EEPROM 1KBIT SPI 2MHZ 8SOPJ
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 1Kbit | Microwire | 2 MHz | 4ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP-J |
||
Microchip Technology |
IC FLASH 32MBIT SPI/QUAD 8SOIJ
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 32Mbit | SPI - Quad I/O | 80 MHz | 1.5ms | - | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIJ |
||
Micron Technology Inc. |
LPDDR4 48GBIT 32 200/264 TFBGA 4
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 48Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -25°C ~ 85°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Alliance Memory, Inc. |
IC DRAM 512MBIT PAR 54FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 512Mbit | Parallel | 143 MHz | 14ns | 6 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-FBGA (8x8) |