Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 4GBIT 933MHZ 96FBGA
|
pacchetto: 96-TFBGA |
Azione5.520 |
|
DRAM | SDRAM - DDR3L | 4Gb (256M x 16) | Parallel | 933MHz | - | 20ns | 1.283 V ~ 1.45 V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (9x14) |
||
STMicroelectronics |
IC EEPROM 256KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.256 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 500ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 375MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione4.240 |
|
SRAM | SRAM - Synchronous, QDR II | 72Mb (4M x 18) | Parallel | 375MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 200MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione7.472 |
|
SRAM | SRAM - Synchronous, QDR II | 36Mb (2M x 18) | Parallel | 200MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Micron Technology Inc. |
IC FLASH 16GBIT 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione2.560 |
|
FLASH | FLASH - NAND | 16Gb (2G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 15NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione5.584 |
|
SRAM | SRAM - Asynchronous | 1Mb (1M x 1) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Microchip Technology |
IC FLASH 512KBIT 90NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.896 |
|
FLASH | FLASH | 512Kb (64K x 8) | Parallel | - | 50µs | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC FLASH 2MBIT 120NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.000 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 64KBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.320 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 200µs | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.824 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 150ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.128 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 128MBIT 143MHZ 90BGA
|
pacchetto: 90-TFBGA |
Azione4.752 |
|
DRAM | SDRAM | 128Mb (4M x 32) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
||
Winbond Electronics |
IC SDRAM 128MBIT 133MHZ 90BGA
|
pacchetto: 90-TFBGA |
Azione2.416 |
|
DRAM | SDRAM - Mobile LPSDR | 128Mb (4M x 32) | Parallel | 133MHz | 15ns | 5.4ns | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | Surface Mount | 90-TFBGA | 90-VFBGA (8x13) |
||
Adesto Technologies |
IC FLASH 2MBIT 70MHZ 8UDFN
|
pacchetto: 8-UDFN Exposed Pad |
Azione5.472 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 70MHz | 8µs, 2.5ms | - | 1.65 V ~ 4.4 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UDFN Exposed Pad | 8-UDFN (5x6) |
||
Adesto Technologies |
IC EEPROM 8-SOIC-N 1.65V I2C 128
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.304 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 1MHz | 100µs, 2.5ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Winbond Electronics |
IC FLASH 16MBIT 104MHZ 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione6.016 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Alliance Memory, Inc. |
IC SDRAM 4GBIT 800MHZ 78BGA
|
pacchetto: 78-VFBGA |
Azione7.584 |
|
DRAM | SDRAM - DDR3L | 4Gb (512M x 8) | Parallel | 800MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-FBGA (10.5x9) |
||
Cypress Semiconductor Corp |
IC FLASH 128M SPI 133MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.624 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Micron Technology Inc. |
IC FLASH 256G MMC
|
pacchetto: - |
Azione4.416 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | - | -40°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM
|
pacchetto: - |
Azione6.944 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 2T MMC
|
pacchetto: - |
Azione4.960 |
|
FLASH | FLASH - NAND | 2Tb (256G x 8) | MMC | - | - | - | - | -25°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH NOR 256MB 24TPBGA
|
pacchetto: 24-TBGA |
Azione6.672 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | Xccela Bus | 200MHz | - | - | 1.7V ~ 2V | -40°C ~ 125°C | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |
||
BYTe Semiconductor |
32 MBIT, 3.0V (2.7V TO 3.6V), -4
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 32Mbit | SPI - Quad I/O | 108 MHz | 50µs, 2.4ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
ProLabs |
16GB DDR4-2933MHz Registered ECC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
EMMC 512G LFBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
LPDDR4 64G 1GX64 FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 64Gbit | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -25°C ~ 85°C (TC) | Surface Mount | 376-WFBGA | 376-WFBGA (14x14) |
||
Renesas Electronics Corporation |
32K X 8 EEPROM,CMOS,HIGH SPEED,P
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 256Kbit | Parallel | - | 5ms | 120 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
ISSI, Integrated Silicon Solution Inc |
2G, 0.57-0.65V/1.06-1.17/1.70-1.
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |