Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Alliance Memory, Inc. |
IC SRAM 64KBIT 55NS 28DIP
|
pacchetto: - |
Azione3.120 |
|
SRAM | SRAM - Asynchronous | 64Kb (8K x 8) | Parallel | - | 55ns | 55ns | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | - | - |
||
Micron Technology Inc. |
IC FLASH NOR 32MX4 QFN
|
pacchetto: - |
Azione7.872 |
|
FLASH | FLASH - NOR | 128Mb (32M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 32GBIT 153VFBGA
|
pacchetto: - |
Azione5.600 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | MMC | - | - | - | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | Surface Mount | - | - |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 1.5GBIT 130VFBGA
|
pacchetto: 130-VFBGA |
Azione2.416 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 1Gb (128M x 8)(NAND), 512Mb (16M x 32)(LPDRAM) | Parallel | 200MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 130-VFBGA | 130-VFBGA (8x9) |
||
Cypress Semiconductor Corp |
IC FRAM 2MBIT 40MHZ 8TDFN
|
pacchetto: 8-WDFN Exposed Pad |
Azione205.476 |
|
FRAM | FRAM (Ferroelectric RAM) | 2Mb (256K x 8) | SPI | 40MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-TDFN (5x6) |
||
Micron Technology Inc. |
IC FLASH 64GBIT 83MHZ 100TBGA
|
pacchetto: 100-TBGA |
Azione6.960 |
|
FLASH | FLASH - NAND | 64Gb (8G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-TBGA | 100-TBGA (12x18) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 45NS 32STSOP
|
pacchetto: 32-TFSOP (0.465", 11.80mm Width) |
Azione2.656 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 45ns | 45ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.465", 11.80mm Width) | 32-sTSOP I |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 200MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione7.088 |
|
SRAM | SRAM - Synchronous | 72Mb (2M x 36) | Parallel | 200MHz | - | 3ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 167MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione5.376 |
|
SRAM | SRAM - Synchronous, QDR II | 18Mb (512K x 36) | Parallel | 167MHz | - | 8.4ns | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
Cypress Semiconductor Corp |
IC SRAM 16KBIT 20NS 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione7.344 |
|
SRAM | SRAM - Asynchronous | 16Kb (4K x 4) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT 12NS 48FBGA
|
pacchetto: 48-TFBGA |
Azione6.976 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 48-TFBGA | 48-FBGA (6x8) |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 9NS 100TQFP
|
pacchetto: 100-LQFP |
Azione4.224 |
|
SRAM | SRAM - Dual Port, Synchronous | 1Mb (64K x 16) | Parallel | 67MHz | - | 9ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 143MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione3.664 |
|
DRAM | SDRAM | 128Mb (8M x 16) | Parallel | 133MHz | 14ns | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.856 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 512KBIT 250NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione6.592 |
|
FLASH | FLASH | 512Kb (64K x 8) | Parallel | - | 20ms | 250ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 15NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione5.776 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Alliance Memory, Inc. |
IC SDRAM 2GBIT 800MHZ 78BGA
|
pacchetto: 78-VFBGA |
Azione7.616 |
|
DRAM | SDRAM - DDR3L | 2Gb (256M x 8) | Parallel | 800MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-FBGA (10.5x8) |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 125MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione10.440 |
|
DRAM | SDRAM | 128Mb (8M x 16) | Parallel | 133MHz | 14ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Microchip Technology |
IC EEPROM 1KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.120 |
|
EEPROM | EEPROM | 1Kb (128 x 8 , 64 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione3.648 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x3) |
||
Fremont Micro Devices USA |
IC EEPROM 2KBIT 2MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione18.492 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Winbond Electronics |
IC DRAM 128M PARALLEL 60VFBGA
|
pacchetto: 60-TFBGA |
Azione5.520 |
|
DRAM | SDRAM - Mobile LPDDR | 128Mb (8M x 16) | Parallel | 200MHz | 15ns | 5ns | 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 60-TFBGA | 60-VFBGA (8x9) |
||
Fujitsu Semiconductor Memory Solution |
IC FRAM 8MBIT SPI/QUAD 16SOP
|
pacchetto: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 8Mbit | SPI - Quad I/O, QPI | 108 MHz | - | 7 ns | 1.7V ~ 1.95V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP |
||
Insignis Technology Corporation |
EMMC 153B IT PH, 15NM 3D TLC (PS
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (pSLC) | 512Gbit | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 153-VFBGA | 153-FBGA (11.5x13) |
||
Etron Technology, Inc. |
DDR3L-1866 2Gb (128MX16)1.25ns C
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 2Gbit | - | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-FBGA (7.5x13) |
||
GSI Technology Inc. |
IC SRAM 36MBIT PARALLEL 165FPBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Quad Port, Synchronous | 36Mbit | Parallel | 250 MHz | - | - | 1.7V ~ 1.9V | -40°C ~ 100°C (TJ) | Surface Mount | 165-LBGA | 165-FPBGA (15x13) |
||
Micron Technology Inc. |
LPDDR4 2G DIE 128MX16
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC EPROM 512KBIT PARALLEL 32PLCC
|
pacchetto: - |
Request a Quote |
|
EPROM | EPROM - OTP | 512Kbit | Parallel | - | - | 45 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (13.97x11.43) |