Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Adesto Technologies |
IC FLASH 32MBIT 70MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione119.316 |
|
FLASH | FLASH | 32Mb (256 Bytes x 16384 pages) | SPI | 70MHz | 6µs, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
IC NVSRAM 4MBIT 25NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione4.640 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 4Mb (256K x 16) | Parallel | - | 25ns | 25ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 133MHZ 119BGA
|
pacchetto: 119-BGA |
Azione2.528 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (128K x 36) | Parallel | 133MHz | - | 4.2ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 20NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione7.088 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 20ns | 20ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Microchip Technology |
IC EEPROM 8KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.256 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 45NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione3.808 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Winbond Electronics |
IC FLASH 4MBIT 100MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione77.232 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 100MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Sharp Microelectronics |
IC FLASH 64MBIT 70NS 48TSOP
|
pacchetto: 48-TFSOP (0.488", 12.40mm Width) |
Azione7.984 |
|
FLASH | FLASH | 64Mb (4M x 16) | Parallel | - | 70ns | 70ns | - | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.488", 12.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 45NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione7.808 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 20MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.344 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 2MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione4.832 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 50µs | 120ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC OTP 1MBIT 45NS 40VSOP
|
pacchetto: 40-TFSOP (0.488", 12.40mm Width) |
Azione190.380 |
|
EPROM | EPROM - OTP | 1Mb (64K x 16) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 40-TFSOP (0.488", 12.40mm Width) | 40-VSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.984 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione32.400 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC FLASH 128GBIT 48TSOP
|
pacchetto: - |
Azione3.392 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | Parallel | 83MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 8NS 119BGA
|
pacchetto: 119-BGA |
Azione6.896 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 100MHz | - | 8ns | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Cypress Semiconductor Corp |
IC FLASH 128MBIT 100NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione3.776 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | - | 60ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Macronix |
IC FLASH 2GBIT
|
pacchetto: - |
Azione7.328 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Macronix |
IC FLASH 16MBIT
|
pacchetto: 8-WDFN Exposed Pad |
Azione48.000 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 50µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Cypress Semiconductor Corp |
IC FLASH 16M SPI 65MHZ WAFER
|
pacchetto: Die |
Azione2.976 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI - Dual I/O | 65MHz | 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Wafer |
||
Cypress Semiconductor Corp |
IC GATE NOR
|
pacchetto: - |
Azione4.256 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC DRAM 1GBIT HSUL 12 178VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR3 | 1Gbit | HSUL_12 | 800 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 178-VFBGA | 178-VFBGA (11x11.5) |
||
Micron Technology Inc. |
DDR5 16G 2GX8 FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR5 | 16Gbit | POD | 2.4 GHz | - | 16 ns | - | -40°C ~ 95°C (TC) | Surface Mount | 82-VFBGA | 82-VFBGA (9x11) |
||
Winbond Electronics |
IC FLASH 128MBIT SPI 24TFBGA
|
pacchetto: - |
Azione5.700 |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O | 133 MHz | -, 3ms | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Infineon Technologies |
INFINEON
|
pacchetto: - |
Request a Quote |
|
FLASH | HyperFlash | 128Mbit | HyperBus | 166 MHz | - | 96 ns | 1.7V ~ 1.95V | -40°C ~ 105°C (TA) | Surface Mount | 24-VBGA | 24-VFBGA (6x8) |
||
Fairchild Semiconductor |
IC EEPROM 64KBIT I2C 100KHZ 8DIP
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 64Kbit | I2C | 100 kHz | 15ms | 3.5 µs | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Silicon Motion, Inc. |
IC FLASH 640GBIT EMMC 153BGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 640Gbit | eMMC | - | - | - | - | -25°C ~ 85°C | Surface Mount | 153-TFBGA | 153-BGA (11.5x13) |