Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 512MBIT 200MHZ 60FBGA
|
pacchetto: 60-TFBGA |
Azione2.528 |
|
DRAM | SDRAM - DDR | 512Mb (32M x 16) | Parallel | 200MHz | 15ns | 700ps | 2.5 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-FBGA (8x12.5) |
||
Microchip Technology |
IC EEPROM 1MBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.296 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC FRAM 64KBIT 70NS 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione24.564 |
|
FRAM | FRAM (Ferroelectric RAM) | 64Kb (8K x 8) | Parallel | - | 130ns | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 20NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione34.428 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 20ns | 20ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 45NS 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione4.944 |
|
SRAM | SRAM - Asynchronous | 16Kb (2K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
STMicroelectronics |
IC OTP 512KBIT 100NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione2.352 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.35x13.89) |
||
Microchip Technology |
IC FLASH 8MBIT 70MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione5.136 |
|
FLASH | FLASH | 8Mb (256 Bytes x 4096 pages) | SPI | 70MHz | 7µs, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione2.768 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 400KHZ 8DIP
|
pacchetto: 8-UDFN Exposed Pad |
Azione4.800 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-UDFN Exposed Pad | 8-MAP (3x4.9) |
||
Microchip Technology |
IC EEPROM 64KBIT 150NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione252.120 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC EEPROM 32KBIT 3MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.824 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 25NS 24CDIP
|
pacchetto: 24-CDIP (0.300", 7.62mm) |
Azione2.240 |
|
SRAM | SRAM - Asynchronous | 16Kb (2K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 24-CDIP (0.300", 7.62mm) | 24-CDIP |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione3.712 |
|
FLASH, RAM | FLASH, DRAM | 256Mbit Flash, 2565Mbit DDR DRAM | Parallel | 108MHz | - | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 256MBIT 133MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.328 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 64MBIT 143MHZ 60BGA
|
pacchetto: 60-TFBGA |
Azione5.664 |
|
DRAM | SDRAM | 64Mb (4M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 60-TFBGA | 60-TFBGA (6.4x10.1) |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione4.016 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 400ns | 2.2 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.144 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC FLASH 128MBIT 110NS 56TSOP
|
pacchetto: 56-TFSOP (0.724", 18.40mm Width) |
Azione7.308 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | - | 60ns | 110ns | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFSOP (0.724", 18.40mm Width) | 56-TSOP |
||
Microchip Technology |
IC EEPROM 16KBIT 2MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.657.112 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 2MHz | 10ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC NVSRAM 64KBIT 3.4MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.424 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 64Kb (8K x 8) | I2C | 3.4MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Micron Technology Inc. |
IC DRAM 4G 1600MHZ
|
pacchetto: 200-WFBGA |
Azione5.184 |
|
DRAM | SDRAM - Mobile LPDDR4 | 4Gb (128M x 32) | - | 1600MHz | - | - | 1.1V | -40°C ~ 105°C (TA) | Surface Mount | 200-WFBGA | - |
||
ISSI, Integrated Silicon Solution Inc |
8G, 1.06-1.17/1.70-1.95V, LPDDR4
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 8Gbit | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 95°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Winbond Electronics |
IC FLASH 256MBIT SPI 24TFBGA
|
pacchetto: - |
Azione5.175 |
|
FLASH | FLASH - NOR | 256Mbit | SPI - Quad I/O | 133 MHz | 5ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 4GBIT PARALLEL 78TWBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3 | 4Gbit | Parallel | 800 MHz | 15ns | 20 ns | 1.425V ~ 1.575V | -40°C ~ 105°C (TC) | Surface Mount | 78-TFBGA | 78-TWBGA (9x10.5) |
||
ISSI, Integrated Silicon Solution Inc |
64MB, QPI/QSPI, 8-PIN SOP 150MIL
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Macronix |
MEMORY
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 8Mbit | SPI - Quad I/O | 104 MHz | 100µs, 3.6ms | 6 ns | 2.3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-USON (2x3) |
||
Insignis Technology Corporation |
IC DRAM 1GBIT PARALLEL 84FBGA
|
pacchetto: - |
Azione60 |
|
DRAM | SDRAM - DDR2 | 1Gbit | Parallel | 400 MHz | 15ns | 450 ps | 1.7V ~ 1.9V | -40°C ~ 95°C (TC) | Surface Mount | 84-TFBGA | 84-FBGA (8x12.5) |
||
ISSI, Integrated Silicon Solution Inc |
256Mb QPI/QSPI, 24-ball TFBGA 6x
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O, QPI, DTR | 166 MHz | 50µs, 1ms | - | 2.3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |