Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC EEPROM 512BIT 1WIRE
|
pacchetto: - |
Azione5.904 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 70NS 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione4.864 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 250MHZ 165CABGA
|
pacchetto: 165-TBGA |
Azione3.616 |
|
SRAM | SRAM - Synchronous, QDR II | 18Mb (1M x 18) | Parallel | 250MHz | - | 6.3ns | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 55NS 32TSOP
|
pacchetto: 32-SOIC (0.400", 10.16mm Width) |
Azione2.848 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 55ns | 55ns | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-SOIC (0.400", 10.16mm Width) | 32-TSOP II |
||
IDT, Integrated Device Technology Inc |
IC SRAM 128KBIT 35NS 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione2.672 |
|
SRAM | SRAM - Dual Port, Asynchronous | 128Kb (16K x 8) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione2.640 |
|
FLASH | FLASH - NOR | 128Mb (8M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -25°C ~ 85°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 128MBIT 166MHZ 54BGA
|
pacchetto: 54-TFBGA |
Azione5.984 |
|
DRAM | SDRAM | 128Mb (8M x 16) | Parallel | 166MHz | - | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DFNS
|
pacchetto: 8-VDFN Exposed Pad |
Azione7.136 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN-S (6x5) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.448 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
ON Semiconductor |
IC EEPROM 16KBIT 400KHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione7.072 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN-EP (2x3) |
||
STMicroelectronics |
IC EEPROM 4KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.552 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 1MHz | 4ms | 450ns | 1.8 V ~ 5.5 V | -40°C ~ 105°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 15NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione8.652 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Fremont Micro Devices USA |
IC EEPROM 4KBIT 1MHZ 8DFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione28.236 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-DFN (2x3) |
||
Fremont Micro Devices USA |
IC EEPROM 32KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione18.912 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I2C | 800kHz | 5ms | 700ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Maxim Integrated |
IC EEPROM 1KBIT 1WIRE TO92-3
|
pacchetto: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) |
Azione31.194 |
|
EEPROM | EEPROM | 1Kb (256 x 4) | 1-Wire? | - | - | 2µs | - | -40°C ~ 85°C (TA) | Through Hole | TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) | TO-92-3 |
||
Rohm Semiconductor |
EEPROMS MICROWIRE SERIAL BUS, HI
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione21.396 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 1.25MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Renesas Electronics America |
IC EEPROM 256K PARALLEL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.312 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 5ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Winbond Electronics |
IC SDRAM 1GBIT 933MHZ 96BGA
|
pacchetto: - |
Azione5.904 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC NOR
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.568 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 5µs, 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Macronix |
IC FLASH 4MBIT
|
pacchetto: - |
Azione6.544 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
MLC 512G 64GX8 VBGA IT QDP L05B
|
pacchetto: - |
Azione5.184 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH RAM 4G PARALLEL 533MHZ
|
pacchetto: - |
Azione2.864 |
|
FLASH, RAM | FLASH - NAND, DRAM - LPDDR2 | 4Gb (128M x 32)(NAND), 2G (64M x 32)(LPDDR2) | Parallel | 533MHz | - | - | 1.8V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC SDRAM DDR3L 2GB 96FBGA
|
pacchetto: 96-TFBGA |
Azione4.176 |
|
DRAM | SDRAM - DDR3L | 2Gb (128M x 16) | Parallel | 933MHz | 15ns | 20ns | 1.283V ~ 1.45V | -40°C ~ 105°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (8x14) |
||
Microchip Technology |
400KHZ AUTO TEMP 8-TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.768 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Renesas Electronics Corporation |
QDR SRAM, 2MX18, 0.45NS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
IC USB PERIPHERAL FULL SPEED
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC SRAM 4MBIT PAR 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM | 4Mbit | Parallel | 100 MHz | - | 5 ns | 3.135V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20.1) |
||
Cypress Semiconductor Corp |
IC SRAM 256KBIT PARALLEL 28SOJ
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 256Kbit | Parallel | - | 12ns | 12 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |