Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC RLDRAM 288MBIT 200MHZ 144FBGA
|
pacchetto: 144-TFBGA |
Azione4.736 |
|
DRAM | DRAM | 288Mb (8M x 36) | Parallel | 200MHz | - | 20ns | 1.7 V ~ 1.9 V | 0°C ~ 95°C (TC) | Surface Mount | 144-TFBGA | 144-FBGA (18.5x11) |
||
Micron Technology Inc. |
IC FLASH 512MBIT 95NS 64EASYBGA
|
pacchetto: 64-TBGA |
Azione6.432 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | 52MHz | 95ns | 95ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TBGA | 64-EasyBGA (8x10) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione2.864 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Microchip Technology |
IC OTP 2MBIT 55NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione3.520 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.872 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 10ms | 900ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Maxim Integrated |
IC NVSRAM 1MBIT 70NS 34LPM
|
pacchetto: 34-LPM |
Azione2.016 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mb (128K x 8) | Parallel | - | 70ns | 70ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 34-LPM | 34-LPM |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 8.5NS 119BGA
|
pacchetto: 119-BGA |
Azione3.696 |
|
SRAM | SRAM - Synchronous ZBT | 18Mb (1M x 18) | Parallel | - | - | 8.5ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Micron Technology Inc. |
IC FLASH 8G DDR2
|
pacchetto: - |
Azione6.832 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 16KBIT 45NS 52PLCC
|
pacchetto: 52-LCC (J-Lead) |
Azione6.928 |
|
SRAM | SRAM - Dual Port, Asynchronous | 16Kb (2K x 8) | Parallel | - | 45ns | 45ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
||
Alliance Memory, Inc. |
IC SRAM 4MBIT 15NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione5.136 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione7.968 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 133MHz | - | - | 1.7 V ~ 2 V | -40°C ~ 125°C (TA) | - | - | - |
||
Rohm Semiconductor |
IC EEPROM 2KBIT 3MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.864 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 4KBIT 3MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione18.960 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione6.108 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
ON Semiconductor |
IC EEPROM 256KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione55.908 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 500ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Micron Technology Inc. |
IC FLASH 2GBIT 63VFBGA
|
pacchetto: 63-VFBGA |
Azione2.784 |
|
FLASH | FLASH - NAND | 2Gb (256M x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
||
Rohm Semiconductor |
IC EEPROM 128KBIT 400KHZ 8SOP-J
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione19.746 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I2C | 400kHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP-J |
||
Cypress Semiconductor Corp |
IC FLASH 64MBIT 90NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione55.968 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8, 4M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Micron Technology Inc. |
IC SDRAM LPDDR4 32GBIT 512MX64 F
|
pacchetto: - |
Azione7.040 |
|
DRAM | SDRAM - Mobile LPDDR4 | - | - | - | - | - | 1.1V | - | - | - | - |
||
Microchip Technology |
IC EEPROM 128K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.792 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Cypress Semiconductor Corp |
IC MEMORY NOR
|
pacchetto: - |
Azione2.768 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH MEM NOR 48FBGA
|
pacchetto: - |
Azione5.008 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC DRAM 24G 1600MHZ FBGA
|
pacchetto: - |
Azione6.384 |
|
DRAM | SDRAM - Mobile LPDDR4 | 24Gb (384M x 64) | - | 1600MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 128MBIT PAR 86TSOP II
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 128Mbit | LVTTL | 166 MHz | - | 5.4 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 86-TFSOP (0.400", 10.16mm Width) | 86-TSOP II |
||
Winbond Electronics |
IC FLASH 32MBIT SPI/QUAD 8XSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 32Mbit | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-XDFN Exposed Pad | 8-XSON (4x4) |
||
Winbond Electronics |
1GB LPDDR4, X16, 1866MHZ, -40C~1
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 1Gbit | LVSTL_11 | 1.867 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 100-VFBGA | 100-VFBGA (10x7.5) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 128MBIT PAR 54TFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 128Mbit | LVTTL | 143 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Infineon Technologies |
FRAM
|
pacchetto: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 8Mbit | SPI | 50 MHz | - | 8 ns | 1.71V ~ 1.89V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-FBGA (6x8) |