Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor |
IC EEPROM 256KBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.632 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 5ms | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 133MHZ 119BGA
|
pacchetto: 119-BGA |
Azione2.448 |
|
SRAM | SRAM - Synchronous | 18Mb (512K x 36) | Parallel | 133MHz | - | 6.5ns | 3.135 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Cypress Semiconductor Corp |
IC SRAM 2MBIT 133MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione5.904 |
|
SRAM | SRAM - Synchronous | 2Mb (128K x 18) | Parallel | 133MHz | - | 6.5ns | 3.15 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
Microchip Technology |
IC EEPROM 2KBIT 2MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.664 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 10ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Micron Technology Inc. |
IC SDRAM 64MBIT 100MHZ 54VFBGA
|
pacchetto: 54-VFBGA |
Azione4.592 |
|
DRAM | SDRAM - Mobile LPSDR | 64Mb (4M x 16) | Parallel | 104MHz | 15ns | 7ns | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 54-VFBGA | 54-VFBGA (8x8) |
||
Micron Technology Inc. |
IC SDRAM 1GBIT 266MHZ 92FBGA
|
pacchetto: 92-VFBGA |
Azione6.960 |
|
DRAM | SDRAM - DDR2 | 1Gb (128M x 8) | Parallel | 267MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | 0°C ~ 85°C (TC) | Surface Mount | 92-VFBGA | 92-FBGA (11x19) |
||
Micron Technology Inc. |
IC SDRAM 128MBIT 143MHZ 54TSOP
|
pacchetto: 54-TSOP (0.400", 10.16mm Width) |
Azione6.720 |
|
DRAM | SDRAM | 128Mb (8M x 16) | Parallel | 133MHz | 14ns | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Micron Technology Inc. |
LPDDR3 256MX32 PLASTIC GREEN LFB
|
pacchetto: - |
Azione5.568 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 167MHZ 90VFBGA
|
pacchetto: 90-VFBGA |
Azione5.568 |
|
DRAM | SDRAM - Mobile LPDDR | 512Mb (16M x 32) | Parallel | 166MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
Microchip Technology |
IC FLASH 4MBIT 40MHZ 8CSP
|
pacchetto: 8-UFBGA, CSPBGA |
Azione6.272 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 40MHz | 1ms | - | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFBGA, CSPBGA | 8-CSP |
||
Microchip Technology |
IC SRAM 64KBIT 20MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.496 |
|
SRAM | SRAM | 64Kb (8K x 8) | SPI | 20MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 450MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione6.848 |
|
SRAM | SRAM - Synchronous, QDR II+ | 18Mb (1M x 18) | Parallel | 450MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 25NS 28DIP
|
pacchetto: 28-DIP (0.300", 7.62mm) |
Azione6.792 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 28-DIP (0.300", 7.62mm) | 28-PDIP |
||
ON Semiconductor |
IC EEPROM 1K SPI 1MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione12.060 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Cypress Semiconductor Corp |
IC FLASH 256M SPI 133MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione7.280 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 32M SPI 133MHZ WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.968 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI, DTR | 133MHz | 800µs | - | 1.65 V ~ 1.95 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Cypress Semiconductor Corp |
IC FLASH MEM NOR 48FBGA
|
pacchetto: 48-VFBGA |
Azione7.520 |
|
FLASH | FLASH - NOR | 64M (4M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -25°C ~ 85°C | Surface Mount | 48-VFBGA | 48-FBGA (8.15x6.15) |
||
Microchip Technology |
IC EEPROM 256K PARALLEL 28TSOP
|
pacchetto: 28-TSSOP (0.465", 11.80mm Width) |
Azione22.710 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 70ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-TSSOP (0.465", 11.80mm Width) | 28-TSOP |
||
Microchip Technology |
APG STANDARD
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.608 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Winbond Electronics |
IC DRAM 512MBIT PAR 84VFBGA
|
pacchetto: - |
Azione2.685 |
|
DRAM | SDRAM - DDR2 | 512Mbit | Parallel | 400 MHz | 15ns | 57.5 ns | 1.7V ~ 1.9V | -40°C ~ 95°C (TC) | Surface Mount | 84-VFBGA | 84-VFBGA (8x12.5) |
||
Micron Technology Inc. |
GDDR6 16G 512MX32 FBGA DDP
|
pacchetto: - |
Azione6.000 |
|
DRAM | SGRAM - GDDR6 | 16Gbit | POD_135 | 7 GHz | - | - | 1.3095V ~ 1.3905V | 0°C ~ 95°C (TC) | Surface Mount | 180-TFBGA | 180-FBGA (12x14) |
||
Silicon Motion, Inc. |
IC 153BGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
4G, 1.35V, DDR3L w/ ECC,256Mx16,
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 800 MHz | - | - | - | -40°C ~ 85°C | Surface Mount | 96-BGA | 96-BGA |
||
Everspin Technologies Inc. |
IC RAM 32MBIT PARALLEL 48FBGA
|
pacchetto: - |
Request a Quote |
|
RAM | MRAM (Magnetoresistive RAM) | 32Mbit | Parallel | - | 35ns | 35 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 48-LFBGA | 48-FBGA (10x10) |
||
Renesas Electronics Corporation |
QDR SRAM, 1MX36, 0.45NS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 2MBIT SPI/QUAD I/O 8SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 2Mbit | SPI - Quad I/O | 120 MHz | 50µs, 2.4ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Micron Technology Inc. |
ALL IN ONE MCP 1056G
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC EERAM 64KBIT SPI 66MHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
EERAM | EEPROM, SRAM | 64Kbit | SPI | 66 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |