Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC FLASH NOR
|
pacchetto: - |
Azione2.944 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 128GBIT 48TSOP
|
pacchetto: - |
Azione3.856 |
|
FLASH | FLASH - NAND | 128Gb (16G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH/LPDRAM 1.5GBIT 107TFBGA
|
pacchetto: 107-TFBGA |
Azione7.552 |
|
FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 1Gb (64M x 16)(NAND), 512Mb (32M x 16)(LPDRAM) | Parallel | 200MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 107-TFBGA | 107-TFBGA |
||
ON Semiconductor |
IC EEPROM 16KBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.712 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 7.5NS 165CABGA
|
pacchetto: 165-TBGA |
Azione7.488 |
|
SRAM | SRAM - Synchronous ZBT | 4.5Mb (256K x 18) | Parallel | - | - | 7.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 100MHZ 100TQFP
|
pacchetto: 100-LQFP |
Azione3.152 |
|
SRAM | SRAM - Synchronous ZBT | 18Mb (512K x 36) | Parallel | 100MHz | - | 5ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
IC EEPROM 4KBIT 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione239.220 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 1MHz | 5ms | 550ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Micron Technology Inc. |
IC FLASH 8MBIT 33MHZ 32TSOP
|
pacchetto: 32-TFSOP (0.488", 12.40mm Width) |
Azione200.412 |
|
FLASH | FLASH - NOR | 8Mb (1M x 8) | Parallel | 33MHz | - | 250ns | 3 V ~ 3.6 V | -20°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.488", 12.40mm Width) | 32-TSOP (8x14) |
||
STMicroelectronics |
IC OTP 2MBIT 100NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.816 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 100ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.35x13.89) |
||
Rohm Semiconductor |
IC EEPROM 1KBIT 5MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.128 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 5MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Cypress Semiconductor Corp |
IC SRAM 288KBIT 9NS 100TQFP
|
pacchetto: 100-LQFP |
Azione3.376 |
|
SRAM | SRAM - Dual Port, Synchronous | 288Kb (16K x 18) | Parallel | 67MHz | - | 9ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Microchip Technology |
IC EEPROM 16KBIT 200NS 28DIP
|
pacchetto: 28-DIP (0.600", 15.24mm) |
Azione3.456 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | Parallel | - | 1ms | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 576KBIT 6NS 128TQFP
|
pacchetto: 128-LQFP |
Azione2.672 |
|
SRAM | SRAM - Dual Port, Synchronous | 576Kb (32K x 18) | Parallel | - | - | 6ns | 3.15 V ~ 3.45 V | 0°C ~ 70°C (TA) | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
Renesas Electronics America |
IC SRAM 1MBIT 70NS 32TSOP
|
pacchetto: 32-TFSOP (0.724", 18.40mm Width) |
Azione5.312 |
|
SRAM | SRAM | 1Mb (128K x 8) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP (8x20) |
||
Micron Technology Inc. |
IC FLASH 1GBIT 25NS 63VFBGA
|
pacchetto: 63-VFBGA |
Azione5.424 |
|
FLASH | FLASH - NAND | 1Gb (64M x 16) | Parallel | - | - | - | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
||
Microchip Technology |
IC EEPROM 128BIT 400KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione244.884 |
|
EEPROM | EEPROM | 128b (16 x 8) | I2C | 400kHz | 4ms | 3500ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
STMicroelectronics |
IC EEPROM 1MBIT 10MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.472 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | SPI | 16MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 145°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC FLASH 64MBIT 90NS 64FBGA
|
pacchetto: 64-LBGA |
Azione41.880 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8, 4M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-Fortified BGA (13x11) |
||
Cypress Semiconductor Corp |
IC FLASH 256M PARALLEL 64BGA
|
pacchetto: 64-LBGA |
Azione20.028 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | Parallel | - | 90ns | 90ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 16M PARALLEL 44TSOP
|
pacchetto: 50-TSOP (0.400", 10.16mm Width), 44 Leads |
Azione2.256 |
|
DRAM | DRAM - FP | 16Mb (1M x 16) | Parallel | - | - | 25ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 50-TSOP (0.400", 10.16mm Width), 44 Leads | 50/44-TSOP II |
||
Cypress Semiconductor Corp |
IC FLASH 128M SPI 133MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione2.896 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 133MHz | - | - | 1.7 V ~ 2 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Cypress Semiconductor Corp |
IC SRAM ASYNC
|
pacchetto: - |
Azione4.416 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 256MBIT SPI/QUAD 8WSON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |
||
Micron Technology Inc. |
DDR5 16G 2GX8 FBGA
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GSI Technology Inc. |
IC SRAM 288MBIT PAR 119FPBGA
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, Standard | 288Mbit | Parallel | 400 MHz | - | - | 2.3V ~ 2.7V, 3V ~ 3.6V | -40°C ~ 100°C (TJ) | Surface Mount | 119-BGA | 119-FPBGA (22x14) |
||
Harris Corporation |
2K X 8 CMOS RAM
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Winbond Electronics |
IC FLASH 256MBIT SPI 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 256Mbit | SPI - Quad I/O | 133 MHz | 5ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
ABLIC Inc. |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
EEPROM | EEPROM | 64Kbit | SPI | 6.5 MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-WSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-TMSOP |