Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC MEM FLASH NOR
|
pacchetto: - |
Azione7.136 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 2TBIT 167MHZ 272LBGA
|
pacchetto: - |
Azione5.680 |
|
FLASH | FLASH - NAND | 2Tb (256G x 8) | Parallel | 167MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
AKM Semiconductor Inc. |
IC EEPROM 4KBIT 4MHZ
|
pacchetto: - |
Azione4.608 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 4MHz | - | - | 1.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC SRAM 2MBIT 70NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione5.568 |
|
SRAM | SRAM - Asynchronous | 2Mb (128K x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Microchip Technology |
IC FLASH 1MBIT 55NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.472 |
|
FLASH | FLASH | 1Mb (128K x 8) | Parallel | - | 50µs | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 64KBIT 1.5MHZ 8LAP
|
pacchetto: 8-TDFN |
Azione6.496 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-TDFN | 8-LAP (5x8) |
||
Texas Instruments |
IC NVSRAM 2MBIT 85NS 32DIP
|
pacchetto: 32-DIP Module (0.61", 15.49mm) |
Azione3.952 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 2Mb (256K x 8) | Parallel | - | 85ns | 85ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 32-DIP Module (0.61", 15.49mm) | 32-DIP Module (18.42x52.96) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 36MBIT 400MHZ 165BGA
|
pacchetto: 165-LBGA |
Azione2.096 |
|
SRAM | SRAM - Synchronous, DDR IIP | 36Mb (2M x 18) | Parallel | 400MHz | - | - | 1.71 V ~ 1.89 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-LFBGA (15x17) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 512KBIT 12NS 100TQFP
|
pacchetto: 100-LQFP |
Azione6.880 |
|
SRAM | SRAM - Dual Port, Synchronous | 512Kb (64K x 8) | Parallel | - | - | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
ISSI, Integrated Silicon Solution Inc |
IC SRAM 4MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione3.440 |
|
SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 10ns | 10ns | 2.4 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Microchip Technology |
IC EEPROM 8KBIT 5MHZ M2P
|
pacchetto: M2 P, Smart Card Module (TWI) |
Azione2.768 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (TWI) | M2 - P Module (TWI) |
||
Microchip Technology |
IC EEPROM 2KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione4.816 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Rohm Semiconductor |
IC EEPROM 8KBIT 3MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione29.904 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
Fremont Micro Devices USA |
IC EEPROM 64KBIT 1MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione19.170 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I2C | 800kHz | 5ms | 700ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Alliance Memory, Inc. |
IC DRAM 1G PARALLEL 60FBGA
|
pacchetto: 60-TFBGA |
Azione3.904 |
|
DRAM | SDRAM - DDR2 | 1Gb (128M x 8) | Parallel | 400MHz | 15ns | 400ps | 1.7 V ~ 1.9 V | -40°C ~ 95°C (TC) | Surface Mount | 60-TFBGA | 60-FBGA (8x10) |
||
Cypress Semiconductor Corp |
IC FLASH 256M SPI 133MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione5.328 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Cypress Semiconductor Corp |
IC GATE NOR
|
pacchetto: - |
Azione6.048 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC FLASH 4G PARALLEL FBGA
|
pacchetto: - |
Azione4.576 |
|
FLASH | FLASH - NAND | 4Gb (256M x 16) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 256MBIT PAR 54TSOP II
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM | 256Mbit | LVTTL | 143 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
MoSys, Inc. |
IC MEMORY BW BURST 0.5GB FCBGA
|
pacchetto: - |
Request a Quote |
|
RAM | SRAM, RLDRAM | 576Mbit | Parallel | - | - | 3.2 ns | - | - | Surface Mount | 288-BGA, FCBGA | 288-FCBGA (19x19) |
||
Micron Technology Inc. |
IC SRAM 8MBIT PAR 83MHZ 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - ZBT | 8Mbit | Parallel | 83 MHz | - | 9 ns | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x20.1) |
||
Renesas Electronics Corporation |
64 MBIT, 1.8V (1.7V TO 2V), -40?
|
pacchetto: - |
Azione11.970 |
|
FLASH | FLASH - NOR (SLC) | 64Mbit | SPI - Quad I/O, QPI | 133 MHz | 150µs, 5ms | 6 ns | 1.7V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT PARALLEL 100TQFP
|
pacchetto: - |
Request a Quote |
|
SRAM | SRAM - Synchronous, SDR (ZBT) | 4.5Mbit | Parallel | 133 MHz | - | 4.2 ns | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Infineon Technologies |
IC FLASH 1GBIT SPI/QUAD 16SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 1Gbit | SPI - Quad I/O, QPI | 133 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Quality Semiconductor |
CACHE SRAM, 64KX4, 15NS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Insignis Technology Corporation |
IC DRAM 256MBIT PAR 54TSOP II
|
pacchetto: - |
Azione3.663 |
|
DRAM | SDRAM | 256Mbit | Parallel | 200 MHz | 10ns | 4.5 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 16MBIT SPI/QUAD 8SOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 104 MHz | 50µs, 3ms | - | 2.3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP |
||
Winbond Electronics |
2GB DDR3L 1.35V SDRAM, X16, INDU
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 2Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-VFBGA (7.5x13) |