Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 143MHZ 54BGA
|
pacchetto: 54-TFBGA |
Azione7.184 |
|
DRAM | SDRAM - Mobile | 256Mb (16M x 16) | Parallel | 143MHz | - | 5.4ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x8) |
||
Micron Technology Inc. |
IC SDRAM 4GBIT 167MHZ 240WFBGA
|
pacchetto: 240-WFBGA |
Azione3.504 |
|
DRAM | SDRAM - Mobile LPDDR | 4Gb (128M x 32) | Parallel | 166MHz | 15ns | 5.0ns | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 240-WFBGA | 240-WFBGA (14x14) |
||
Microchip Technology |
IC FLASH 8MBIT 90NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione28.260 |
|
FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 40µs | 90ns | 1.65 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 25NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione13.548 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Cypress Semiconductor Corp |
IC SRAM 18MBIT 375MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione3.536 |
|
SRAM | SRAM - Synchronous, DDR II | 18Mb (1M x 18) | Parallel | 375MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Cypress Semiconductor Corp |
IC SRAM 1.152MBIT 12NS 144TQFP
|
pacchetto: 144-LQFP |
Azione7.120 |
|
SRAM | SRAM - Dual Port, Asynchronous | 1.152Mb (32K x 36) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
STMicroelectronics |
IC NVSRAM 256KBIT 100NS 28SOH
|
pacchetto: 28-SOP (0.350", 8.89mm Width) with SNAPHAT Sockets |
Azione24.756 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 100ns | 100ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 28-SOP (0.350", 8.89mm Width) with SNAPHAT Sockets | 28-SOH |
||
Microchip Technology |
IC FLASH 2MBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.184 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20ms | 200ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
IDT, Integrated Device Technology Inc |
IC SRAM 18MBIT 166MHZ 256CABGA
|
pacchetto: 256-LBGA |
Azione2.784 |
|
SRAM | SRAM - Dual Port, Synchronous | 18Mb (512K x 36) | Parallel | 166MHz | - | 3.6ns | 2.4 V ~ 2.6 V | 0°C ~ 70°C (TA) | Surface Mount | 256-LBGA | 256-CABGA (17x17) |
||
Cypress Semiconductor Corp |
IC FLASH MEMORY 48TSOP
|
pacchetto: - |
Azione4.832 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Micron Technology Inc. |
IC SDRAM 4GBIT 1.33GHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione4.784 |
|
DRAM | SDRAM - DDR4 | 4Gb (256M x 16) | Parallel | 1.33GHz | - | - | 1.14 V ~ 1.26 V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (14x9) |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 2GBIT 667MHZ 96BGA
|
pacchetto: 96-TFBGA |
Azione4.784 |
|
DRAM | SDRAM - DDR3L | 2Gb (128M x 16) | Parallel | 667MHz | 15ns | 20ns | 1.283 V ~ 1.45 V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Microchip Technology |
IC FLASH 16MBIT 70NS 48WFBGA
|
pacchetto: 48-WFBGA |
Azione2.096 |
|
FLASH | FLASH | 16Mb (1M x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-WFBGA | 48-WFBGA (6x4) |
||
Micron Technology Inc. |
IC FLASH 16MBIT 75MHZ 16SO
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione324.660 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 75MHz | 15ms, 5ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SO W |
||
Adesto Technologies |
IC FLASH 1MBIT 104MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione3.088 |
|
FLASH | FLASH | 1Mb (128K x 8) | SPI | 104MHz | 8µs, 1.75ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.072 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Alliance Memory, Inc. |
IC SRAM 256KBIT 12NS 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione8.556 |
|
SRAM | SRAM - Asynchronous | 256Kb (32K x 8) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Adesto Technologies |
IC FLASH 2MBIT 70MHZ 8DFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione2.624 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 70MHz | 8µs, 2.5ms | - | 1.65 V ~ 4.4 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Rohm Semiconductor |
IC EEPROM 8KBIT 400KHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.272 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 400kHz | 5ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP-BJ |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.616 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Micron Technology Inc. |
IC FLASH 256G MMC
|
pacchetto: - |
Azione4.576 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | - | -40°C ~ 105°C (TA) | - | - | - |
||
Cypress Semiconductor Corp |
IC FLASH 512M SPI 66MHZ 24BGA
|
pacchetto: 24-TBGA |
Azione7.332 |
|
FLASH | FLASH - NOR | 512Mb (64M x 8) | SPI - Quad I/O | 66MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Micron Technology Inc. |
IC DRAM LPDDR4 WFBGA
|
pacchetto: - |
Azione6.560 |
|
DRAM | SDRAM - Mobile LPDDR4 | 4Gb (128M x 32) | - | 1.866GHz | - | - | 0.6V, 1.1V | -40°C ~ 95°C | Surface Mount | - | - |
||
Cypress Semiconductor Corp |
IC EPROM 8KBIT PARALLEL
|
pacchetto: - |
Request a Quote |
|
EPROM | EPROM - OTP | 8Kbit | Parallel | - | - | 30 ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
RLDRAM2 Memory, 288Mbit, x18, Se
|
pacchetto: - |
Request a Quote |
|
DRAM | RLDRAM 2 | 288Mbit | HSTL | 400 MHz | - | 15 ns | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 144-TFBGA | 144-TWBGA (11x18.5) |
||
Microchip Technology |
64 KBIT I2C SERIAL EEPROM WITH S
|
pacchetto: - |
Azione15.000 |
|
EEPROM | EEPROM | 64Kbit | I2C | 1 MHz | 5ms | 450 ns | 1.6V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Winbond Electronics |
8G-BIT SLC NAND FLASH, 1.8V, 4-B
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 8Gbit | ONFI | - | 35ns, 700µs | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) |
||
GigaDevice Semiconductor (HK) Limited |
LINEAR IC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 4Gbit | SPI - Quad I/O | 104 MHz | 600µs | 9 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x8) |