Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC SRAM 64KBIT 15NS 64TQFP
|
pacchetto: 64-LQFP |
Azione7.040 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
||
Winbond Electronics |
IC FLASH 32MBIT 70NS 48TFBGA
|
pacchetto: 48-TFBGA |
Azione7.024 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | 48-TFBGA (6x8) |
||
Micron Technology Inc. |
IC FLASH 256MBIT 95NS 64EASYBGA
|
pacchetto: 64-TBGA |
Azione5.088 |
|
FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | 52MHz | 95ns | 95ns | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 64-TBGA | 64-EasyBGA (8x10) |
||
Cypress Semiconductor Corp |
IC SRAM 36MBIT 167MHZ 165FBGA
|
pacchetto: 165-LBGA |
Azione7.392 |
|
SRAM | SRAM - Synchronous, QDR II | 36Mb (2M x 18) | Parallel | 167MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
||
Cypress Semiconductor Corp |
IC SRAM 1MBIT 12NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione2.768 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 12ns | 12ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 9NS 100TQFP
|
pacchetto: 100-LQFP |
Azione7.040 |
|
SRAM | SRAM - Dual Port, Synchronous | 256Kb (32K x 8) | Parallel | - | - | 9ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 55NS 80TQFP
|
pacchetto: 80-LQFP |
Azione4.704 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (32K x 8) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Alliance Memory, Inc. |
IC SDRAM 4GBIT 800MHZ 96BGA
|
pacchetto: 96-VFBGA |
Azione3.072 |
|
DRAM | SDRAM - DDR3 | 4Gb (256M x 16) | Parallel | 800MHz | 15ns | 20ns | 1.425 V ~ 1.575 V | 0°C ~ 95°C (TC) | Surface Mount | 96-VFBGA | 96-FBGA (13x8) |
||
IDT, Integrated Device Technology Inc |
IC SRAM 4MBIT 10NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione4.384 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione5.600 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 80MHz | - | - | 1.7 V ~ 2 V | -40°C ~ 125°C (TA) | - | - | - |
||
Alliance Memory, Inc. |
IC SRAM 1MBIT 12NS 44SOJ
|
pacchetto: 44-BSOJ (0.400", 10.16mm Width) |
Azione3.840 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 12ns | 12ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
||
STMicroelectronics |
IC EEPROM 512KBIT 5MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.008 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | SPI | 16MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 2MBIT 55NS 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione2.848 |
|
FLASH | FLASH | 2Mb (128K x 16) | Parallel | - | 20µs | 55ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Micron Technology Inc. |
IC FLASH 16MBIT 75MHZ 8VFDFPN
|
pacchetto: 8-VDFN Exposed Pad |
Azione3.920 |
|
FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 75MHz | 15ms, 5ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-VFQFPN (6x5) |
||
Rohm Semiconductor |
IC EEPROM 8KBIT 5MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.504 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 5MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC EEPROM 4KBIT 3MHZ 8TDFN
|
pacchetto: 8-WFDFN Exposed Pad |
Azione2.608 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 2ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
||
Cypress Semiconductor Corp |
IC FLASH 1GBIT 100NS 64BGA
|
pacchetto: 64-LBGA |
Azione8.448 |
|
FLASH | FLASH - NOR | 1Gb (128M x 8) | Parallel | - | 60ns | 100ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Everspin Technologies Inc. |
IC MRAM 4MBIT 35NS 48FBGA
|
pacchetto: 48-LFBGA |
Azione5.168 |
|
RAM | MRAM (Magnetoresistive RAM) | 4Mb (256K x 16) | Parallel | - | 35ns | 35ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-LFBGA | 48-FBGA (8x8) |
||
Micron Technology Inc. |
IC DRAM 16G 1600MHZ
|
pacchetto: - |
Azione6.288 |
|
DRAM | SDRAM - Mobile LPDDR4 | 16Gb (512M x 32) | - | 1600MHz | - | - | 1.1V | -40°C ~ 105°C (TA) | - | - | - |
||
Maxim Integrated |
IC EEPROM 2K 1WIRE 6TDFN
|
pacchetto: 6-WFDFN Exposed Pad |
Azione6.128 |
|
EEPROM | EEPROM | 2Kb (2K x 1) | 1-Wire® | - | - | - | 2.97 V ~ 3.63 V | -40°C ~ 85°C (TA) | Surface Mount | 6-WFDFN Exposed Pad | 6-TDFN-EP (3x3) |
||
Winbond Electronics |
IC FLASH 64MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
IC FLASH 16MBIT SPI/QUAD 8WLCSP
|
pacchetto: - |
Azione14.424 |
|
FLASH | FLASH - NOR | 16Mbit | SPI - Quad I/O | 133 MHz | 12µs, 8ms | - | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFBGA, WLCSP | 8-WLCSP (1.77x1.74) |
||
Winbond Electronics |
IC DRAM 1GBIT HSUL 12 178VFBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR3 | 1Gbit | HSUL_12 | 800 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 178-VFBGA | 178-VFBGA (11x11.5) |
||
BYTe Semiconductor |
8 MBIT, 3.0V (2.7V TO 3.6V), -40
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 8Mbit | SPI - Quad I/O | 120 MHz | 55µs, 2ms | 7 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-USON (2x3) |
||
ISSI, Integrated Silicon Solution Inc |
IC DRAM 1GBIT PAR 96TWBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 1Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-TWBGA (9x13) |
||
Micron Technology Inc. |
LPDDR5 96G 1.5GX64 FBGA
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 96Gbit | - | 3.2 GHz | - | - | - | -25°C ~ 85°C | Surface Mount | 441-TFBGA | 441-TFBGA (14x14) |
||
Fujitsu Semiconductor Memory Solution |
IC FRAM 4MBIT SPI 50MHZ 8DFN
|
pacchetto: - |
Request a Quote |
|
FRAM | FRAM (Ferroelectric RAM) | 4Mbit | SPI | 50 MHz | - | - | 1.7V ~ 1.95V | -40°C ~ 125°C (TA) | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (5x6) |
||
Infineon Technologies |
IC FLASH 512MBIT SPI/QUAD 16SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | SPI - Quad I/O, QPI | 166 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |