Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC FLASH 256GBIT 100MHZ 100TBGA
|
pacchetto: - |
Azione2.576 |
|
FLASH | FLASH - NAND | 256Gb (32G x 8) | Parallel | 100MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Micron Technology Inc. |
IC FLASH 32GBIT 100MHZ 132VBGA
|
pacchetto: - |
Azione3.376 |
|
FLASH | FLASH - NAND | 32Gb (4G x 8) | Parallel | 100MHz | - | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC FLASH 512KBIT 104MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.016 |
|
FLASH | FLASH - NOR | 512Kb (64K x 8) | SPI - Quad I/O | 104MHz | 800µs | - | 2.3 V ~ 3.6 V | -40°C ~ 105°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 166MHZ 86TSOP
|
pacchetto: 86-TFSOP (0.400", 10.16mm Width) |
Azione2.928 |
|
DRAM | SDRAM | 256Mb (8M x 32) | Parallel | 166MHz | - | 5.5ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 86-TFSOP (0.400", 10.16mm Width) | 86-TSOP II |
||
Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 35NS 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione14.904 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 35ns | 35ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Micron Technology Inc. |
IC SDRAM 256MBIT 100MHZ 90VFBGA
|
pacchetto: 90-VFBGA |
Azione2.608 |
|
DRAM | SDRAM - Mobile LPSDR | 256Mb (8M x 32) | Parallel | 100MHz | 15ns | 7ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 90-VFBGA | 90-VFBGA (8x13) |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.128 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 35NS 84PGA
|
pacchetto: 84-BPGA |
Azione7.648 |
|
SRAM | SRAM - Dual Port, Asynchronous | 256Kb (16K x 16) | Parallel | - | 35ns | 35ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 84-BPGA | 84-PGA (27.94x27.94) |
||
Micron Technology Inc. |
IC FLASH 16GBIT 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione7.408 |
|
FLASH | FLASH - NAND | 16Gb (2G x 8) | Parallel | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 7.5NS 119BGA
|
pacchetto: 119-BGA |
Azione5.040 |
|
SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 117MHz | - | 7.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
||
Winbond Electronics |
IC SDRAM 2GBIT 400MHZ 168WFBGA
|
pacchetto: 168-WFBGA |
Azione6.800 |
|
DRAM | SDRAM - Mobile LPDDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | - | 1.14 V ~ 1.95 V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
||
Cypress Semiconductor Corp |
NOR
|
pacchetto: - |
Azione3.840 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O, QPI | 108MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 15NS 44TSOP
|
pacchetto: 44-TSOP (0.400", 10.16mm Width) |
Azione7.984 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Adesto Technologies |
IC FLASH 32MBIT 104MHZ 8SOIC
|
pacchetto: 8-SOIC (0.209", 5.30mm Width) |
Azione6.336 |
|
FLASH | FLASH | 32Mb (4M x 8) | SPI | 104MHz | 5µs, 5ms | - | 2.5 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC FLASH NOR 8WSON
|
pacchetto: 8-WDFN Exposed Pad |
Azione5.328 |
|
FLASH | FLASH - NOR | 64Mb (8M x 8) | SPI - Quad I/O | 108MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (5x6) |
||
Adesto Technologies |
IC EEPROM 64KBIT 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione94.164 |
|
EEPROM | EEPROM | 64kb (32B Page Size) | I2C | 1MHz | 100µs, 1.2ms | - | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC FLASH 1G PARALLEL 63BGA
|
pacchetto: 63-VFBGA |
Azione4.576 |
|
FLASH | FLASH - NAND | 1Gb (128M x 8) | Parallel | - | 25ns | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 63-VFBGA | 63-BGA (11x9) |
||
Micron Technology Inc. |
IC FLASH 1T MMC
|
pacchetto: - |
Azione2.736 |
|
FLASH | FLASH - NAND | 1Tb (128G x 8) | MMC | - | - | - | - | -25°C ~ 85°C (TA) | - | - | - |
||
Renesas Electronics America |
IC SRAM 4MBIT 55NS 32SOP
|
pacchetto: 32-SOIC (0.450", 11.40mm Width) |
Azione6.976 |
|
SRAM | SRAM | 4Mb (512K x 8) | Parallel | - | 55ns | 55ns | 4.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | 32-SOIC (0.450", 11.40mm Width) | 32-SOP |
||
Micron Technology Inc. |
IC DRAM LPDDR4 WFBGA
|
pacchetto: - |
Azione5.536 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 1GBIT SPI/QUAD 24TFBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 1Gbit | SPI - Quad I/O, QPI, DTR | 166 MHz | 70µs, 1.2ms | 6 ns | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
||
Intelligent Memory Ltd. |
DDR3 8GB, 1.35V/1.5V, 512MX16 (2
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 8Gbit | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-FBGA (9x13.5) |
||
GigaDevice Semiconductor (HK) Limited |
IC FLASH 1MBIT SPI/DUAL 8USON
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 1Mbit | SPI - Dual I/O | 100 MHz | 55µs, 6ms | 12 ns | 1.65V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-USON (1.5x1.5) |
||
Infineon Technologies |
IC FLASH 1GBIT CFI 64FBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 1Gbit | CFI | - | 60ns | 120 ns | 2.7V ~ 3.6V | -55°C ~ 125°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
||
Micron Technology Inc. |
LPDDR4 24G 768MX32 FBGA QDP
|
pacchetto: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 24Gbit | LVSTL | 2.133 GHz | - | - | 1.06V ~ 1.17V | -25°C ~ 85°C | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
||
Micron Technology Inc. |
TLC 512G 64GX8 VBGA
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (TLC) | 512Gbit | Parallel | - | - | - | 2.6V ~ 3.6V | 0°C ~ 70°C | Surface Mount | 132-VBGA | 132-VBGA (12x18) |
||
Winbond Electronics |
IC FLASH 128MBIT SPI/QUAD 8SOIC
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NOR | 128Mbit | SPI - Quad I/O, QPI | 104 MHz | 60µs, 5ms | 6 ns | 1.65V ~ 1.95V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
||
Winbond Electronics |
IC FLASH 1GBIT PARALLEL 48TSOP
|
pacchetto: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 1Gbit | Parallel | - | 25ns | 25 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |